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公开(公告)号：US11832371B2
公开(公告)日：2023-11-28
申请号：US17674048
申请日：2022-02-17
发明人： I-Jang Teng , Chun Peng Lin , Hsiu Lun Yeh
IPC分类号： H05F3/04
CPC分类号： H05F3/04
摘要： The present disclosure provides an over-voltage protection device. The over-voltage protection device includes a substrate, a stack structure disposed over the substrate. The stack structure includes a first insulation structure, a second insulation structure, and a conductive layer. The conductive layer is disposed on the first insulation structure, and the second insulation structure is disposed on the conductive layer. The second insulation structure has an insulation air gap, which has an upper width greater than a lower width.
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2.发明申请公开(公告)号：US20220367105A1
公开(公告)日：2022-11-17
申请号：US17316746
申请日：2021-05-11
发明人： Cheng-Han YU , Yi-Cheng CHEN
摘要： A integrated power inductor integrated with bottom electrode without carrier, the power inductor is composed of a coil, a tin layer, and a magnetic powder envelope etc, wherein the wire of the coil is directly drawn to the bottom of the magnetic powder envelope without via a carrier as an electrode, thereby effectively reducing the risk of the inductor being opened due to too small or incomplete welding points between the coil and the material sheet, and can greatly improve the characteristics, reliability and manufacturing yield of the inductor,
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公开(公告)号：US20190252767A1
公开(公告)日：2019-08-15
申请号：US16393302
申请日：2019-04-24
发明人： PO-KAI HSU , CHIH-MING SU
CPC分类号： H01Q1/243 , A45C2011/002 , H01Q1/2208 , H01Q1/38 , H04B1/3888 , H04B5/00 , H04B5/0031 , H04B5/0081
摘要： The present disclosure provides a back cover assembly of a portable electronic device. The back cover assembly includes a substrate structure and a coil structure. The substrate structure includes a metal substrate and a first non-metal substrate connected with the metal substrate. The coil structure is matched with an IC chip for generating an antenna magnetic field that passes through the first non-metal substrate without matching with the metal substrate. The coil structure has a first coil portion and a second coil portion connected to the first coil portion, the first coil portion is disposed above the metal substrate, the second coil portion is disposed above the first non-metal substrate, and the percentage of the first coil portion to the coil structure is larger than that the percentage of the second coil portion to the coil structure.
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公开(公告)号：US20170271906A1
公开(公告)日：2017-09-21
申请号：US15071420
申请日：2016-03-16
发明人： Ming-Tsan TSENG , Yu-Cheng HAN , Chi-Feng YANG
CPC分类号： H02J7/025 , G04G17/04 , G04G19/00 , G06F1/163 , G06F1/1635 , H02J7/0054 , H02J50/10
摘要： A mobile charging module of a wearable electronic device is disclosed. The wearable electronic device includes a main body portion and a lacing portion that can be assembled to or disassembled from the main body portion, wherein the main body portion includes a host, a host battery and a Rx Coil; the lacing portion includes a Tx Coil which can be wireless and inductively charged with the Rx Coil and a backup power supply (BPS); which is characterized in: the Tx Coil and the Rx Coil are mounted on a magnetic body respectively; through controlling a coupling gap between the two magnetic bodies, the magnetic field of the Tx Coil can be coupled to the Rx Coil through the two magnetic bodies for quickly charging the host battery with high efficiency.
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公开(公告)号：US20170117609A1
公开(公告)日：2017-04-27
申请号：US15210955
申请日：2016-07-15
发明人： Yen-Ming CHEN
CPC分类号： H01Q1/2275 , H01Q1/38 , H01Q1/48 , H01Q9/0485
摘要： A metal base high efficiency antenna, it is preferably formed as a ceramic fine peace, and suitable for installed to the connector inside an electronic appliance, such that the connector has functions of antenna, in addition, since the connector is mostly arranged at a space near the surface of electronic appliance, the radiation efficiency of antenna would not be interfered by the metallic elements inside the electronic appliance.
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公开(公告)号：US20170011961A1
公开(公告)日：2017-01-12
申请号：US15237372
申请日：2016-08-15
发明人： YU-MING PENG , WEI-LUN HSU , CHU-CHUN HSU , HONG-SHENG KE , YU CHIA CHANG
IPC分类号： H01L21/768 , H01L23/29 , H01L23/31 , H01L23/528 , H01L23/532
摘要： The disclosure provides a semiconductor package structure, including a substrate having a front side and a back side, a first insulating layer disposed on the front side of the substrate, and a die disposed on the first insulating layer; wherein the die includes a first die pad and a second die pad, the first die pad coupled to a first portion of a metal layer, the second die pad coupled to a second portion of the metal layer, and the first portion of the metal layer and the second portion of the metal layer spaced apart by a second insulating layer. An associated semiconductor packaging method and another semiconductor package structure are also disclosed.
摘要翻译： 本发明提供一种半导体封装结构，包括具有正面和背面的衬底，设置在衬底前侧的第一绝缘层和设置在第一绝缘层上的管芯; 其中所述管芯包括第一管芯焊盘和第二管芯焊盘，所述第一管芯焊盘耦合到金属层的第一部分，所述第二管芯焊盘耦合到所述金属层的第二部分，并且所述金属层的第一部分 并且金属层的第二部分被第二绝缘层隔开。 还公开了一种相关半导体封装方法和另一半导体封装结构。
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7.发明授权公开(公告)号：US08933343B2
公开(公告)日：2015-01-13
申请号：US13783643
申请日：2013-03-04
CPC分类号： H01L23/3171 , H01G4/224 , H01G4/236 , H01L24/05 , H01L24/29 , H01L24/32 , H01L2224/02371 , H01L2224/04026 , H01L2224/04105 , H01L2224/0502 , H01L2224/05548 , H01L2224/0556 , H01L2224/05562 , H01L2224/05568 , H01L2224/291 , H01L2224/32013 , H01L2224/32058 , H01L2224/32227 , H01L2224/3315 , H01L2224/48091 , H01L2224/83815 , H01L2924/10156 , H01L2924/35121 , H05K3/3442 , H01L2924/00014 , H01L2924/00012 , H01L2924/014
摘要： An electronic structure includes a substrate body, an electronic package structure and a conductive unit. The electronic package structure is disposed on the substrate body. The electronic package structure includes a first inner electrode portion, a second inner electrode portion, a first outer electrode portion electrically connected to the first inner electrode portion, and a second outer electrode portion electrically connected to the second inner electrode portion. The conductive unit includes a first conductive body and a second conductive body respectively electrically contacting the first and the second outer electrode portions. The electronic package structure has a first notch and a second notch, the first outer electrode portion is extended into the first notch to contact the top surface of the first inner electrode portion, and the second outer electrode portion is extended into the second notch to contact the top surface of the second inner electrode portion.
摘要翻译： 电子结构包括基板主体，电子封装结构和导电单元。 电子封装结构设置在基板主体上。 电子封装结构包括第一内部电极部分，第二内部电极部分，与第一内部电极部分电连接的第一外部电极部分和与第二内部电极部分电连接的第二外部电极部分。 导电单元包括分别与第一和第二外部电极部分电接触的第一导电体和第二导电体。 电子封装结构具有第一切口和第二切口，第一外部电极部延伸到第一切口以与第一内部电极部的顶面接触，第二外部电极部延伸到第二切口以接触 第二内电极部分的顶表面。
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公开(公告)号：US20040252066A1
公开(公告)日：2004-12-16
申请号：US10458310
申请日：2003-06-11
发明人： Hsu Cho-Kang
IPC分类号： H01Q021/00
摘要： Disclosed herein is a multi-combined multi-frequency antenna, and in particular, to an antenna which has a helically wound conductor and a plate type or a linear type conductor, so as to form a multi-combined antenna which is operatable against various frequency bands.
摘要翻译： 本文公开了一种多组合多频天线，特别涉及一种具有螺旋缠绕导体和板式或线型导体的天线，以形成可针对各种频率操作的多组合天线 乐队。
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公开(公告)号：US20040204008A1
公开(公告)日：2004-10-14
申请号：US10261689
申请日：2002-10-02
发明人： Sheng Ming Deng
IPC分类号： H04B001/38 , H04Q007/20 , H04M001/00
CPC分类号： H01Q21/28 , H01Q1/242 , H01Q9/0414
摘要： A GPS receiving antenna for cellular phone is configurated into a L-shaped frame, a Y-shaped frame, or a U-shaped frame so as to achieve the best capturing effect of the radio wave radiated from the satellite. It is not necessary to use materials of specially high dielectric constant for fabrication of these antennas so that the production cost can be minimized and fabrication process can be simplified.
摘要翻译： 用于蜂窝电话的GPS接收天线被配置成L形框架，Y形框架或U形框架，以便实现从卫星辐射的无线电波的最佳捕获效果。 不需要使用特别高介电常数的材料来制造这些天线，从而可以最小化生产成本并简化制造过程。
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公开(公告)号：US20020130301A1
公开(公告)日：2002-09-19
申请号：US09810183
申请日：2001-03-19
发明人： Lee Chun-Yuan
IPC分类号： H01C001/00
摘要： The material for transient voltage suppressors is composed of at least two kinds of evenly-mixed powders including a powder material with non-linear resistance interfaces and a conductive powder, wherein the conductive powder is distributed in the powder with non-linear resistance interfaces to relatively reduce the total number of non-linear resistance interfaces between two electrodes and, as a result, decrease the breakdown voltage of the components.
摘要翻译： 用于瞬态电压抑制器的材料由至少两种均匀混合的粉末组成，包括具有非线性电阻界面的粉末材料和导电粉末，其中导电粉末分布在具有非线性电阻界面的粉末中 减少两个电极之间的非线性电阻接口总数，从而降低组件的击穿电压。
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