TERMINATION CIRCUITS AND ATTENUATION METHODS THEREOF

    公开(公告)号:US20220103149A1

    公开(公告)日:2022-03-31

    申请号:US17037110

    申请日:2020-09-29

    申请人: INPHI CORPORATION

    摘要: The present invention is directed to communication systems and electrical circuits. According to an embodiment, the present invention provides a termination circuit that includes an inductor network. The inductor network is coupled to a termination resistor and a capacitor network, which includes a first capacitor and a second capacitor. The termination resistor, the first capacitor, and the second capacitor are adjustable, and they affect attenuation of the termination circuit. There are other embodiments as well.

    THIN-FILM FILTER FOR TUNABLE LASER

    公开(公告)号:US20210273408A1

    公开(公告)日:2021-09-02

    申请号:US16805526

    申请日:2020-02-28

    申请人: INPHI CORPORATION

    摘要: A thin-film device for a wavelength-tunable semiconductor laser. The device includes a cavity between a high-reflectivity facet and an anti-reflection facet designed to emit a laser light of a wavelength in a tunable range determined by two Vernier-ring resonators with a joint-free-spectral-range between a first wavelength and a second wavelength. The device further includes a film including multiple pairs of a first layer and a second layer sequentially stacking to an outer side of the high-reflectivity facet. Each layer in each pair has one unit of respective optical thickness except one first or second layer in one pair having a larger optical thickness. The film is configured to produce inner reflectivity of the laser light from the high-reflectivity facet at least >90% for wavelengths in the tunable range starting from the first wavelength but at least

    SILICON PHOTONICS INTEGRATION CIRCUIT

    公开(公告)号:US20210231866A1

    公开(公告)日:2021-07-29

    申请号:US16776362

    申请日:2020-01-29

    申请人: INPHI CORPORATION

    IPC分类号: G02B6/12 G02B6/14 G02B6/13

    摘要: A silicon photonics integration circuit includes a silicon substrate member; a RX sub-circuit formed in the silicon substrate member including multiple RX-input ports each having a mode size converter configured to receive an incoming light signal into one of multiple waveguides and multiple RX photo detectors coupled respectively to the multiple waveguides; and a TX sub-circuit formed in the silicon substrate member including one or more TX-input ports each having a mode size converter coupled to a first TX photo detector into one input waveguide, one or more 1×2 directional couplers each coupled between the input waveguide and two mod-input waveguides, multiple modulators coupled between respective multiple mod-input waveguides and multiple mod-output waveguides each being coupled to a second TX photo detector into one of multiple output waveguides, and multiple TX-output ports each having a mode size converter coupled to respective one of the multiple output waveguides.

    OPTICAL MODULE
    4.
    发明申请

    公开(公告)号:US20210159997A1

    公开(公告)日:2021-05-27

    申请号:US17168931

    申请日:2021-02-05

    申请人: INPHI CORPORATION

    IPC分类号: H04J14/02 H04B10/40

    摘要: An integrated apparatus with optical/electrical interfaces and protocol converter on a single silicon substrate. The apparatus includes an optical module comprising one or more modulators respectively coupled with one or more laser devices for producing a first optical signal to an optical interface and one or more photodetectors for detecting a second optical signal from the optical interface to generate a current signal. Additionally, the apparatus includes a transmit lane module coupled between the optical module and an electrical interface to receive a first electric signal from the electrical interface and provide a framing protocol for driving the one or more modulators. Furthermore, the apparatus includes a receive lane module coupled between the optical module and the electrical interface to process the current signal to send a second electric signal to the electrical interface.

    Packaging of a directly modulated laser chip in photonics module

    公开(公告)号:US11011886B2

    公开(公告)日:2021-05-18

    申请号:US16802438

    申请日:2020-02-26

    申请人: INPHI CORPORATION

    摘要: A package structure of a directly modulated laser in a photonics module includes a thermoelectric cooler including multiple conductor traces formed in a cool surface. The package structure further includes a directly modulated laser (DML) chip having a first electrode being attached with the cool surface and a second electrode at a distance away from the cool surface. Additionally, the package structure includes an interposer having a plurality of through-holes formed between a first surface to a second surface. The first surface is mounted to the cool surface such that each through-hole is aligned with one of the multiple conductor traces and the second surface being leveled with the second electrode. Moreover, the package structure includes a driver disposed on the second surface of the interposer with at least a galvanically coupled output port coupled directly to the second electrode of the DML chip.

    Method and device for digital compensation of dynamic distortion in high-speed transmitters

    公开(公告)号:US11005690B1

    公开(公告)日:2021-05-11

    申请号:US16825637

    申请日:2020-03-20

    申请人: INPHI CORPORATION

    摘要: A device and method of operation for digital compensation of dynamic distortion. The transmitter device includes at least a digital-to-analog converter (DAC) connected to a lookup table (LUT), a first shift register, and a second shift register. The method includes iteratively adjusting the input values via the LUT to induce changes in the DAC output that compensate for dynamic distortion, which depends on precursors, current cursors, and postcursors. More specifically, the method includes producing and capturing average output values for each possible sequence of three symbols using the shift register and LUT configuration. Then, the LUT is updated with estimated values to induce desired output values that are adjusted to eliminate clipping. These steps are performed iteratively until one or more check conditions are satisfied. This method can also be combined with techniques such as equalization, eye modulation, and amplitude scaling to introduce desirable output signal characteristics.

    Baud-rate time error detector
    7.
    发明授权

    公开(公告)号:US10999053B2

    公开(公告)日:2021-05-04

    申请号:US16924075

    申请日:2020-07-08

    申请人: INPHI CORPORATION

    IPC分类号: H04L7/027

    摘要: A receiver system that includes a clock and data recovery (CDR) system for aligning a local clock signal to an incoming data signal to extract correct timing information from the incoming data signal is provided. A timing error detector generates an output phase error signal representing the phase difference between the incoming data signal and the local clock signal. The timing error detector determines the phase difference according to recovered symbols and the difference between the recovered symbols and digital samples of the incoming data signal. The digital samples of the incoming data signal include intersymbol interference. The output timing information is suitable for aligning the local clock signal to the incoming data signal.

    Method and system for integrated differential electro-absorption modulator device

    公开(公告)号:US10989937B2

    公开(公告)日:2021-04-27

    申请号:US16025883

    申请日:2018-07-02

    申请人: INPHI CORPORATION

    摘要: An integrated differential Electro-Absorption Modulator (EAM) device. The device includes a substrate, an electrical driver, and two EAM modules. The electrical driver circuit is configured overlying the substrate member and has one output electrically coupled to the first EAM module and the other output electrically coupled to the second EAM module. The first and second EAM modules have a first and a second output, respectively. A beam splitter can be configured to split an optical input into two optical outputs, each of which can be optically coupled to the optical inputs of the first and second EAM modules.

    APPARATUS AND METHODS FOR DIGITAL SIGNAL CONSTELLATION TRANSFORMATION

    公开(公告)号:US20210119705A1

    公开(公告)日:2021-04-22

    申请号:US17109778

    申请日:2020-12-02

    申请人: INPHI CORPORATION

    发明人: Shu Hao FAN

    IPC分类号: H04B10/40 H04B10/50 H04B10/61

    摘要: Apparatus and method for digital signal constellation transformation are provided herein. In certain configurations, an integrated circuit includes an analog front-end that converts an analog signal vector representing an optical signal into a digital signal vector, and a digital signal processing circuit that processes the digital signal vector to recover data from the optical signal. The digital signal processing circuit generates signal data representing a signal constellation of the digital signal vector. The digital signal processing circuit includes an adaptive gain equalizer that compensates the signal data for distortion of the signal constellation arising from biasing errors of optical modulators used to transmit the optical signal.

    APPARATUS AND METHOD FOR COMMUNICATING DATA OVER AN OPTICAL CHANNEL

    公开(公告)号:US20210111833A1

    公开(公告)日:2021-04-15

    申请号:US17127510

    申请日:2020-12-18

    申请人: INPHI CORPORATION

    摘要: An optical module processes first FEC (Forward Error Correction) encoded data produced by a first FEC encoder. The optical module has a second FEC encoder for further coding a subset of the first FEC encoded data to produce second FEC encoded data. The optical module also has an optical modulator for modulating, based on a combination of the second FEC encoded data and a remaining portion of the first FEC encoded data that is not further coded, an optical signal for transmission over an optical channel. The second FEC encoder is an encoder for an FEC code that has a bit-level trellis representation with a number of states in any section of the bit-level trellis representation being less than or equal to 64 states. In this manner, the second FEC encoder has relatively low complexity (e.g. relatively low transistor count) that can reduce power consumption for the optical module.