-
1.发明公开公开(公告)号：US20240346380A1
公开(公告)日：2024-10-17
申请号：US18634510
申请日：2024-04-12
申请人： InvenSense, Inc.
IPC分类号： G06N20/00
CPC分类号： G06N20/00
摘要： Disclosed embodiments provide data augmentation techniques in which collected sensor data and simulated sensor data created by transforming collected sensor data are used to train a machine learning model (MLM), the MLM is then deployed on an integrated circuit chip of an embedded device, live sensor data received by the embedded device is then either transformed and input to the MLM or input to the MLM without transformation, and the MLM then performs a prediction by, for example, recognizing a gesture made by the user of the embedded device.
-
公开(公告)号：US20240302183A1
公开(公告)日：2024-09-12
申请号：US18596233
申请日：2024-03-05
申请人： INVENSENSE, INC
IPC分类号： G01C21/00
CPC分类号： G01C21/3841 , G01C21/3807 , G01C21/3848
摘要： Systems and methods are disclosed for creating a magnetic map by obtaining magnetic field measurements from a plurality of platforms. A first set of poses for each platform is determined and information from the magnetic map is obtained for any existing magnetic field values for the first set. Magnetic constraints on poses of the platform are determined and used for determining a second set of poses for each platform. The magnetic field values of the magnetic map are then updated based at least in part on the second set of poses for each platform.
-
3.发明公开公开(公告)号：US20240230400A9
公开(公告)日：2024-07-11
申请号：US18490312
申请日：2023-10-19
发明人： Pirmin Rombach , Kurt Rasmussen , Dennis Mortensen , Jan Ravnkilde , Cheng-Yen Liu , Jotaro Akiyama , Sushil Bharatan , Troy Chase
CPC分类号： G01H11/06 , H04R7/10 , H04R7/12 , H04R19/04 , H04R31/003 , H04R2201/003 , H04R2307/023
摘要： Low-cost, robust, and high performance microelectromechanical systems (MEMS) acoustic sensors are described. Described MEMS acoustic sensors can comprise a set of etch release structures in the acoustic sensor membrane that facilitates rapid and/or uniform etch release of the acoustic sensor membrane. In addition, MEMS acoustic sensors can comprise a set of membrane position control structures of the acoustic sensor membrane that can reduce the bending stress of the acoustic sensor membrane. MEMS acoustic sensors can further comprise a three layer acoustic sensor membrane that provides increased robustness. Further design flexibility and improvements are described that provide increased robustness and/or cost savings, and a low cost fabrication process for MEMS acoustic sensors is provided.
-
公开(公告)号：US20240171188A1
公开(公告)日：2024-05-23
申请号：US18500886
申请日：2023-11-02
申请人： INVENSENSE, INC.
IPC分类号： H03M1/08 , G01D5/24 , G01R19/00 , G01R19/257
CPC分类号： H03M1/0827 , G01D5/24 , G01R19/0053 , G01R19/257 , G01R19/0023
摘要： A continuous time single drive capacitance-to-voltage (C2V) converter can be employed for single sensor, balanced single sensor, or differential sensor. First sensor and/or second sensor can be employed to sense a condition. A capacitive bridge can comprise a first capacitive digital-to-analog-converter (DAC) and second capacitive DAC as a differential node. First capacitive DAC can be associated with first sensor, and second capacitive DAC can be associated with a third capacitive DAC, in series with first sensor, if single sensor is implemented or the second sensor if balanced single sensor or differential sensor is implemented. Capacitive bridge can be connected to differential input of a capacitive feedback amplifier that can be a continuous time amplifier with no signal sampling and no noise folding. Capacitive feedback amplifier can comprise capacitively coupled input common mode feedback, which can remove noise from a sensor drive, and output common mode feedback.
-
5.发明授权公开(公告)号：US11990917B2
公开(公告)日：2024-05-21
申请号：US17805761
申请日：2022-06-07
申请人： INVENSENSE, INC.
发明人： Omid Oliaei , Stephen Bart
CPC分类号： H03M1/462 , H03M1/008 , H03M1/0604 , H03M1/0626 , H03M1/122
摘要： The present invention relates to an incremental analog to digital converter incorporating noise shaping and residual error quantization. In one embodiment, a circuit includes an incremental analog to digital converter, comprising a loop filter that filters an analog input signal in response to receiving a reset signal, resulting in a filtered analog input signal, and a successive approximation register (SAR) quantizer, coupled with the filtered analog input signal, that converts the filtered analog input signal to an intermediate digitized output of a first resolution based on a reference voltage, wherein the SAR quantizer comprises a feedback loop that shapes quantization noise generated by the SAR quantizer as a result of converting the filtered analog input signal; and a digital filter, coupled with the intermediate digitized output, that generates a digitized output signal of a second resolution, greater than the first resolution, by digitally filtering the intermediate digitized output.
-
6.发明公开公开(公告)号：US20240133736A1
公开(公告)日：2024-04-25
申请号：US18490312
申请日：2023-10-18
发明人： Pirmin Rombach , Kurt Rasmussen , Dennis Mortensen , Jan Ravnkilde , Cheng-Yen Liu , Jotaro Akiyama , Sushil Bharatan , Troy Chase
CPC分类号： G01H11/06 , H04R7/10 , H04R7/12 , H04R19/04 , H04R31/003 , H04R2201/003 , H04R2307/023
摘要： Low-cost, robust, and high performance microelectromechanical systems (MEMS) acoustic sensors are described. Described MEMS acoustic sensors can comprise a set of etch release structures in the acoustic sensor membrane that facilitates rapid and/or uniform etch release of the acoustic sensor membrane. In addition, MEMS acoustic sensors can comprise a set of membrane position control structures of the acoustic sensor membrane that can reduce the bending stress of the acoustic sensor membrane. MEMS acoustic sensors can further comprise a three layer acoustic sensor membrane that provides increased robustness. Further design flexibility and improvements are described that provide increased robustness and/or cost savings, and a low cost fabrication process for MEMS acoustic sensors is provided.
-
公开(公告)号：US20240069061A1
公开(公告)日：2024-02-29
申请号：US18502444
申请日：2023-11-06
申请人： INVENSENSE, INC.
IPC分类号： G01P15/08
CPC分类号： G01P15/08 , G01P2015/0871
摘要： A microelectromechanical system device is described. The microelectromechanical system device can comprise: a proof mass coupled to an anchor via a spring, wherein the proof mass moves in response to an imposition of an external load to the proof mass, and an overtravel stop comprising a first portion and a second portion.
-
公开(公告)号：US11844282B2
公开(公告)日：2023-12-12
申请号：US16802436
申请日：2020-02-26
申请人： InvenSense, Inc.
IPC分类号： H01L41/083 , H10N30/50 , H04R17/00 , H10N30/057 , H10N30/87 , H10N30/88
CPC分类号： H10N30/50 , H04R17/00 , H10N30/057 , H10N30/871 , H10N30/883
摘要： A piezoelectric micromachined ultrasonic transducer (PMUT) device includes a substrate having an opening therethrough and a membrane attached to the substrate over the opening. An actuating structure layer on a surface of the membrane includes a piezoelectric layer sandwiched between the membrane and an upper electrode layer. The actuating structure layer is patterned to selectively remove portions of the actuating structure from portions of the membrane to form a central portion proximate a center of the open cavity and three or more rib portions projecting radially outward from the central portion.
-
公开(公告)号：US11841228B2
公开(公告)日：2023-12-12
申请号：US17467145
申请日：2021-09-03
申请人： INVENSENSE, INC.
发明人： Doruk Senkal , Robert Hennessy , Houri Johari-Galle , Joe Seeger
IPC分类号： G01C19/5712 , G01C19/5783
CPC分类号： G01C19/5712 , G01C19/5783
摘要： The subject disclosure provides exemplary 3-axis (e.g., GX, GY, and GZ) linear and angular momentum balanced vibratory rate gyroscope architectures with fully-coupled sense modes. Embodiments can employ balanced drive and/or balanced sense components to reduce induced vibrations and/or part to part coupling. Embodiments can comprise two inner frame gyroscopes for GY sense mode and an outer frame or saddle gyroscope for GX sense mode and drive system coupling, drive shuttles coupled to the two inner frame gyroscopes or outer frame gyroscope, and four GZ proof masses coupled to the inner frame gyroscopes for GZ sense mode. Components can be removed from an exemplary overall architecture to fabricate a single axis or two axis gyroscope and/or can be configured such that a number of proof-masses can be reduced in half from an exemplary overall architecture to fabricate a half-gyroscope. Other embodiments can employ a stress isolation frame to reduce package induced stress.
-
公开(公告)号：US11821731B2
公开(公告)日：2023-11-21
申请号：US17400102
申请日：2021-08-11
申请人： INVENSENSE, INC.
IPC分类号： H03M3/00 , G01C19/5712
CPC分类号： G01C19/5712 , H03M3/358 , H03M3/402 , H03M3/458
摘要： Facilitating minimization of non-linearity effects of a delay of a capacitance-to-voltage (C2V) converter on an output of a gyroscope is presented herein. A sense output signal of a sense mass of the gyroscope and a drive output signal of a drive mass of the gyroscope are electronically coupled to respective analog-to-digital converter (ADC) inputs of bandpass sigma-delta ADCs of the gyroscope. The bandpass sigma-delta ADCs include respective C2V converters that are electronically coupled, via respective feedback loops, to the respective ADC inputs to facilitate reductions of respective propagation delays of the bandpass sigma-delta ADCs. Respective ADC outputs of the bandpass sigma-delta ADCs are electronically coupled to demodulator inputs of a demodulator of the gyroscope that transforms the sense output into an output of the MEMS gyroscope representing an external stimulus that has been applied to the sense mass.
-
-
-
-
-
-
-
-
-
搜索结果
1174 条记录 (耗时 0.027 秒)
