公开(公告)号：US09850576B2

公开(公告)日：2017-12-26

申请号：US12982843

申请日：2010-12-30

申请人： Jonghoon Baek ,  Edwin C. Suarez ,  Tsutomu Tanaka ,  Edward P. Hammond, IV ,  Jeonghoon Oh

发明人： Jonghoon Baek ,  Edwin C. Suarez ,  Tsutomu Tanaka ,  Edward P. Hammond, IV ,  Jeonghoon Oh

IPC分类号： C23C16/00 ,  C23C16/50 ,  C23F1/00 ,  H01L21/306 ,  C23C16/455 ,  H01J37/32 ,  C23C16/509

CPC分类号： C23C16/45565 ,  C23C16/509 ,  H01J37/32082 ,  H01J37/32431 ,  H01J37/3244

摘要： Embodiments of the present invention generally relate to apparatus for reducing arcing and parasitic plasma in substrate processing chambers. The apparatus generally include a processing chamber having a substrate support, a backing plate, and a showerhead disposed therein. A showerhead suspension electrically couples the backing plate to the showerhead. An electrically conductive bracket is coupled to the backing plate and spaced apart from the showerhead. The electrically conductive bracket may include a plate, a lower portion, an upper portion, and a vertical extension. The electrically conductive bracket contacts an electrical isolator.

公开(公告)号：US09039864B2

公开(公告)日：2015-05-26

申请号：US12892892

申请日：2010-09-28

申请人： Jonghoon Baek ,  Beom Soo Park ,  Sam Hyungsam Kim

发明人： Jonghoon Baek ,  Beom Soo Park ,  Sam Hyungsam Kim

IPC分类号： H01J37/32

CPC分类号： H01J37/32174 ,  H01J37/32091 ,  H01J37/32577 ,  Y10T29/49117

摘要： An electrical ground (36) of an RF impedance matching network (33) is connected to a connection area (50) on the grounded chamber cover (18) of a plasma chamber. The connection area is offset away from the center of the chamber cover toward a workpiece passageway (20). Alternatively, an RF power supply (30) has an electrically grounded output (32) that is connected to a connection area (52) on the chamber cover having such offset. Alternatively, an RF transmission line (37) has an electrically grounded conductor (39) that is connected between a grounded output of an RF power supply and a connection area (52) on the chamber cover having such offset.

摘要翻译： RF阻抗匹配网络（33）的电接地（36）连接到等离子体室的接地室盖（18）上的连接区域（50）。 连接区域离开室盖的中心偏离工件通道（20）。 或者，RF电源（30）具有电接地输出（32），其连接到具有偏移的腔室盖上的连接区域（52）。 或者，RF传输线（37）具有电接地导体（39），其连接在RF电源的接地输出端和具有偏移的腔室盖上的连接区域（52）之间。

公开(公告)号：US20110185972A1

公开(公告)日：2011-08-04

申请号：US13014113

申请日：2011-01-26

申请人： Jonghoon Baek ,  Sam H. Kim ,  Beom Soo Park

发明人： Jonghoon Baek ,  Sam H. Kim ,  Beom Soo Park

IPC分类号： C23C16/505 ,  C23C16/455

CPC分类号： C23C16/505

摘要： Embodiments disclosed herein generally relate to a PECVD apparatus. When the RF power source is coupled to the electrode at multiple locations, the current and voltage may be different at the multiple locations. In order to ensure that both the current and voltage are substantially identical at the multiple locations, an RF bridge assembly may be coupled between the multiple locations at a location just before connection to the electrode. The RF bridge assembly substantially equalizes the voltage distribution and current distribution between multiple locations. Therefore, a substantially identical current and voltage is applied to the electrode at the multiple locations.

摘要翻译： 本文公开的实施例一般涉及PECVD装置。 当RF电源在多个位置耦合到电极时，电流和电压在多个位置可能是不同的。 为了确保电流和电压在多个位置处基本上相同，RF桥组件可以在连接到电极之前的位置处耦合在多个位置之间。 RF桥组件基本上均衡多个位置之间的电压分布和电流分布。 因此，在多个位置处对电极施加基本相同的电流和电压。

公开(公告)号：US09068262B2

公开(公告)日：2015-06-30

申请号：US13110184

申请日：2011-05-18

申请人： Jozef Kudela ,  Jonghoon Baek ,  John M. White ,  Robin Tiner ,  Suhail Anwar ,  Gaku Furuta

发明人： Jozef Kudela ,  Jonghoon Baek ,  John M. White ,  Robin Tiner ,  Suhail Anwar ,  Gaku Furuta

IPC分类号： C23C16/455 ,  C23C16/509 ,  H01J37/32

CPC分类号： B05B1/185 ,  C23C16/45565 ,  C23C16/509 ,  C23C16/5096 ,  H01J37/3244 ,  H01J37/32532 ,  H01J37/32623 ,  H01J37/32651 ,  Y10T137/6851

摘要： Embodiments of the invention generally include shield frame assembly for use with a showerhead assembly, and a showerhead assembly having a shield frame assembly that includes an insulator that tightly fits around the perimeter of a showerhead in a vacuum processing chamber. In one embodiment, a showerhead assembly includes a gas distribution plate and a multi-piece frame assembly that circumscribes a perimeter edge of the gas distribution plate. The multi-piece frame assembly allows for expansion of the gas distribution plate without creating gaps which may lead to arcing. In other embodiments, the insulator is positioned to be have the electric fields concentrated at the perimeter of the gas distribution plate located therein, thereby reducing arcing potential.

摘要翻译： 本发明的实施例通常包括用于喷头组件的屏蔽框架组件和具有屏蔽框架组件的喷头组件，所述屏蔽框架组件包括紧密配合在真空处理室中的喷头周边周围的绝缘体。 在一个实施例中，喷头组件包括气体分配板和环绕气体分布板的周边边缘的多片框架组件。 多件式框架组件允许气体分配板的膨胀而不产生可能导致电弧的间隙。 在其它实施例中，绝缘体被定位成具有集中在位于其中的气体分配板的周边的电场，从而减少电弧电势。

公开(公告)号：US08312839B2

公开(公告)日：2012-11-20

申请号：US12730886

申请日：2010-03-24

申请人： Jonghoon Baek

发明人： Jonghoon Baek

IPC分类号： C23C16/50

CPC分类号： C23C16/509 ,  H01J37/32091 ,  H01J37/32165

摘要： Embodiments disclosed herein generally relate to obtaining a substantially uniform plasma distribution within a large area processing chamber. For large area processing chambers that utilize RF voltages, standing waves can lead to deposition and/or etching non-uniformities. By applying RF voltage in at least two separate locations at two separate, but close frequencies with or without phase modulation, the wave interference pattern moves across the electrode. By moving the standing wave across the electrode, the plasma generated in the chamber can, over time, be substantially uniform.

摘要翻译： 本文公开的实施例通常涉及在大面积处理室内获得基本均匀的等离子体分布。 对于利用RF电压的大面积处理室，驻波可导致沉积和/或蚀刻非均匀性。 通过在具有或不具有相位调制的两个分离但接近的频率的至少两个分开的位置中施加RF电压，波干涉图案跨过电极移动。 通过将驻波移动穿过电极，腔室中产生的等离子体可以随着时间的推移而基本均匀。

公开(公告)号：US20110284100A1

公开(公告)日：2011-11-24

申请号：US13110184

申请日：2011-05-18

申请人： JOZEF KUDELA ,  JONGHOON BAEK ,  JOHN M. WHITE ,  ROBIN TINER ,  SUHAIL ANWAR ,  GAKU FURUTA

发明人： JOZEF KUDELA ,  JONGHOON BAEK ,  JOHN M. WHITE ,  ROBIN TINER ,  SUHAIL ANWAR ,  GAKU FURUTA

IPC分类号： F16L3/00

CPC分类号： B05B1/185 ,  C23C16/45565 ,  C23C16/509 ,  C23C16/5096 ,  H01J37/3244 ,  H01J37/32532 ,  H01J37/32623 ,  H01J37/32651 ,  Y10T137/6851

摘要： Embodiments of the invention generally include shield frame assembly for use with a showerhead assembly, and a showerhead assembly having a shield frame assembly that includes an insulator that tightly fits around the perimeter of a showerhead in a vacuum processing chamber. In one embodiment, a showerhead assembly includes a gas distribution plate and a multi-piece frame assembly that circumscribes a perimeter edge of the gas distribution plate. The multi-piece frame assembly allows for expansion of the gas distribution plate without creating gaps which may lead to arcing. In other embodiments, the insulator is positioned to be have the electric fields concentrated at the perimeter of the gas distribution plate located therein, thereby reducing arcing potential.

摘要翻译： 本发明的实施例通常包括用于喷头组件的屏蔽框架组件和具有屏蔽框架组件的喷头组件，所述屏蔽框架组件包括紧密配合在真空处理室中的喷头周边周围的绝缘体。 在一个实施例中，喷头组件包括气体分配板和环绕气体分布板的周边边缘的多片框架组件。 多件式框架组件允许气体分配板的膨胀而不产生可能导致电弧的间隙。 在其它实施例中，绝缘体被定位成具有集中在位于其中的气体分配板的周边的电场，从而减少电弧电势。

公开(公告)号：US20110126405A1

公开(公告)日：2011-06-02

申请号：US12892892

申请日：2010-09-28

申请人： Jonghoon Baek ,  Beom Soo Park ,  Sam Hyungsam Kim

发明人： Jonghoon Baek ,  Beom Soo Park ,  Sam Hyungsam Kim

IPC分类号： H01R43/00 ,  H01L21/02

CPC分类号： H01J37/32174 ,  H01J37/32091 ,  H01J37/32577 ,  Y10T29/49117

摘要： An electrical ground (36) of an RF impedance matching network (33) is connected to a connection area (50) on the grounded chamber cover (18) of a plasma chamber. The connection area is offset away from the center of the chamber cover toward a workpiece passageway (20). Alternatively, an RF power supply (30) has an electrically grounded output (32) that is connected to a connection area (52) on the chamber cover having such offset. Alternatively, an RF transmission line (37) has an electrically grounded conductor (39) that is connected between a grounded output of an RF power supply and a connection area (52) on the chamber cover having such offset.

摘要翻译： RF阻抗匹配网络（33）的电接地（36）连接到等离子体室的接地室盖（18）上的连接区域（50）。 连接区域离开室盖的中心偏离工件通道（20）。 或者，RF电源（30）具有电接地输出（32），其连接到具有偏移的腔室盖上的连接区域（52）。 或者，RF传输线（37）具有电接地导体（39），其连接在RF电源的接地输出端和具有偏移的腔室盖上的连接区域（52）之间。

公开(公告)号：US20100245214A1

公开(公告)日：2010-09-30

申请号：US12730886

申请日：2010-03-24

申请人： Jonghoon Baek

发明人： Jonghoon Baek

IPC分类号： G09G3/28

CPC分类号： C23C16/509 ,  H01J37/32091 ,  H01J37/32165

摘要： Embodiments disclosed herein generally relate to obtaining a substantially uniform plasma distribution within a large area processing chamber. For large area processing chambers that utilize RF voltages, standing waves can lead to deposition and/or etching non-uniformities. By applying RF voltage in at least two separate locations at two separate, but close frequencies with or without phase modulation, the wave interference pattern moves across the electrode. By moving the standing wave across the electrode, the plasma generated in the chamber can, over time, be substantially uniform.

摘要翻译： 本文公开的实施例通常涉及在大面积处理室内获得基本均匀的等离子体分布。 对于利用RF电压的大面积处理室，驻波可导致沉积和/或蚀刻非均匀性。 通过在具有或不具有相位调制的两个分离但接近的频率的至少两个分开的位置中施加RF电压，波干涉图案跨过电极移动。 通过将驻波移动穿过电极，腔室中产生的等离子体可以随着时间的推移而基本均匀。

公开(公告)号：US08875657B2

公开(公告)日：2014-11-04

申请号：US13014113

申请日：2011-01-26

申请人： Jonghoon Baek ,  Sam H. Kim ,  Beom Soo Park

发明人： Jonghoon Baek ,  Sam H. Kim ,  Beom Soo Park

IPC分类号： C23C16/00 ,  C23F1/00 ,  H01L21/306 ,  C23C16/505

CPC分类号： C23C16/505

摘要： Embodiments disclosed herein generally relate to a PECVD apparatus. When the RF power source is coupled to the electrode at multiple locations, the current and voltage may be different at the multiple locations. In order to ensure that both the current and voltage are substantially identical at the multiple locations, an RF bridge assembly may be coupled between the multiple locations at a location just before connection to the electrode. The RF bridge assembly substantially equalizes the voltage distribution and current distribution between multiple locations. Therefore, a substantially identical current and voltage is applied to the electrode at the multiple locations.

摘要翻译： 本文公开的实施例一般涉及PECVD装置。 当RF电源在多个位置耦合到电极时，电流和电压在多个位置可能是不同的。 为了确保电流和电压在多个位置处基本上相同，RF桥组件可以在连接到电极之前的位置处耦合在多个位置之间。 RF桥组件基本上均衡多个位置之间的电压分布和电流分布。 因此，在多个位置处对电极施加基本相同的电流和电压。

公开(公告)号：US20130071581A1

公开(公告)日：2013-03-21

申请号：US13622955

申请日：2012-09-19

申请人： Jonghoon Baek ,  Sam H. Kim ,  Beom Soo Park ,  John M. White ,  Shinichi Kunita ,  Hsiao-Lin Yang

发明人： Jonghoon Baek ,  Sam H. Kim ,  Beom Soo Park ,  John M. White ,  Shinichi Kunita ,  Hsiao-Lin Yang

IPC分类号： H05H1/46

CPC分类号： H05H1/46 ,  H01J37/32091 ,  H01J37/32183 ,  H01J37/32935

摘要： The present invention generally relates to a capacitively coupled plasma (CCP) processing chamber, a manner to reduce or prevent stray capacitance, and a manner to measure plasma conditions within the processing chamber. As CCP processing chambers increase in size, there is a tendency for stray capacitance to negatively impact the process. Additionally, RF ground straps may break. By increasing the spacing between the chamber backing plate and the chamber wall, stray capacitance may be minimized. Additionally, the plasma may be monitored by measuring the conditions of the plasma at the backing plate rather than at the match network. In so measuring, the plasma harmonic data may be analyzed to reveal plasma processing conditions within the chamber.

摘要翻译： 本发明一般涉及电容耦合等离子体（CCP）处理室，减少或防止杂散电容的方式，以及测量处理室内等离子体状态的方式。 随着CCP处理室的尺寸增加，杂散电容的趋势将对工艺产生负面影响。 另外，射频接地带可能会断开。 通过增加腔室背板和室壁之间的间隔，杂散电容可以最小化。 此外，可以通过测量背板上的等离子体的条件而不是在匹配网络来监测等离子体。 在这样的测量中，可以分析等离子体谐波数据以显示室内的等离子体处理条件。