公开(公告)号：US09808874B2

公开(公告)日：2017-11-07

申请号：US13613000

申请日：2012-09-13

申请人： Kang-Wook Lee ,  Jae-Woong Nah ,  Nathalie Normand ,  Valerie Oberson

发明人： Kang-Wook Lee ,  Jae-Woong Nah ,  Nathalie Normand ,  Valerie Oberson

IPC分类号： B23K1/00 ,  B23K35/36 ,  B23K35/362

CPC分类号： B23K1/0016 ,  B23K35/3601 ,  B23K35/362

摘要： The present invention is directed to a soldering method for joining objects is also provided, comprising the steps of applying a flux composition to at least a portion of one or more of the objects, and joining the objects.

公开(公告)号：US09343423B2

公开(公告)日：2016-05-17

申请号：US14526268

申请日：2014-10-28

申请人： Claudius Ferger ,  Michael A. Gaynes ,  Jae-Woong Nah ,  Da-Yuan Shih

发明人： Claudius Ferger ,  Michael A. Gaynes ,  Jae-Woong Nah ,  Da-Yuan Shih

IPC分类号： H01L21/50 ,  H01L21/48 ,  H01L23/00 ,  H01L23/498 ,  H01L21/463 ,  H01L23/544

CPC分类号： H01L24/81 ,  H01L21/463 ,  H01L21/563 ,  H01L23/49816 ,  H01L23/544 ,  H01L24/11 ,  H01L24/13 ,  H01L24/16 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/73 ,  H01L24/743 ,  H01L24/83 ,  H01L24/92 ,  H01L2223/54426 ,  H01L2223/54473 ,  H01L2223/54486 ,  H01L2224/11462 ,  H01L2224/13082 ,  H01L2224/13147 ,  H01L2224/1605 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/16238 ,  H01L2224/2741 ,  H01L2224/32225 ,  H01L2224/73104 ,  H01L2224/73204 ,  H01L2224/8113 ,  H01L2224/81132 ,  H01L2224/81192 ,  H01L2224/81193 ,  H01L2224/81203 ,  H01L2224/814 ,  H01L2224/81801 ,  H01L2224/81815 ,  H01L2224/83192 ,  H01L2224/83856 ,  H01L2224/9211 ,  H01L2224/94 ,  H01L2924/01029 ,  H01L2924/10253 ,  H01L2924/1461 ,  H01L2924/00 ,  H01L2924/00014 ,  H01L2924/00012 ,  H01L2924/014 ,  H01L2224/11 ,  H01L2224/27 ,  H01L2224/81 ,  H01L2224/83

摘要： A preassembly semiconductor device comprises chip soldering structures on a semiconductor chip and substrate soldering structures on a substrate corresponding to the chip soldering structures. The substrate soldering structures extend toward the chip soldering structures for forming solder connections with the chip soldering structures. The chip and the substrate are in preassembly positions relative to one another. The height of the substrate soldering structures is greater than the height of the chip soldering structures. A pre-applied underfill is contiguous with the substrate and is sufficiently thick so as to extend substantially no further than the full height of the substrate soldering structures. In another embodiment the height of the chip soldering structures is greater than the height of the substrate soldering structures and the pre-applied underfill is contiguous with the semiconductor chip and sufficiently thick so as to extend substantially no further than the full height of the chip soldering structures. A process comprises manufacturing semiconductor assemblies from these devices by soldering the chip and the substrate to one another.

摘要翻译： 预组装半导体器件包括半导体芯片上的芯片焊接结构和对应于芯片焊接结构的衬底上的衬底焊接结构。 衬底焊接结构朝着芯片焊接结构延伸，以形成与芯片焊接结构的焊接连接。 芯片和衬底相对于彼此处于预组装位置。 基板焊接结构的高度大于芯片焊接结构的高度。 预先施加的底部填充物与基底相邻并且足够厚以便基本上不超过基底焊接结构的全高度延伸。 在另一个实施例中，芯片焊接结构的高度大于衬底焊接结构的高度，并且预先施加的底部填充物与半导体芯片邻接并且足够厚以便基本上不超过芯片焊接的全部高度 结构。 一种方法包括通过将芯片和衬底彼此焊接来从这些器件制造半导体组件。

公开(公告)号：US09082754B2

公开(公告)日：2015-07-14

申请号：US13565982

申请日：2012-08-03

申请人： Peter A. Gruber ,  Jae-Woong Nah

发明人： Peter A. Gruber ,  Jae-Woong Nah

IPC分类号： H01L21/44 ,  H01L23/48 ,  H01L23/00 ,  B23K3/06 ,  H01L23/498 ,  H01L21/48 ,  B23K1/00 ,  B23K26/38 ,  B23K26/40

CPC分类号： H01L23/48 ,  B23K1/0016 ,  B23K3/0607 ,  B23K3/0623 ,  B23K26/384 ,  B23K26/389 ,  B23K26/40 ,  B23K2101/42 ,  B23K2103/16 ,  H01L21/4853 ,  H01L23/14 ,  H01L23/147 ,  H01L23/49816 ,  H01L24/03 ,  H01L24/05 ,  H01L24/11 ,  H01L24/13 ,  H01L24/14 ,  H01L2224/0345 ,  H01L2224/03464 ,  H01L2224/0347 ,  H01L2224/0401 ,  H01L2224/056 ,  H01L2224/11003 ,  H01L2224/11005 ,  H01L2224/111 ,  H01L2224/1112 ,  H01L2224/11436 ,  H01L2224/11472 ,  H01L2224/11849 ,  H01L2224/13017 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/13551 ,  H01L2224/13561 ,  H01L2224/136 ,  H01L2224/81101 ,  H01L2224/81191 ,  H01L2924/01322 ,  H01L2924/12042 ,  H01L2924/00012 ,  H01L2924/00014 ,  H01L2924/014 ,  H01L2924/00

摘要： A method and system of producing metal cored solder structures on a substrate which includes: providing a decal having a plurality of apertures, the apertures being tapered from a top surface to a bottom surface; positioning a carrier beneath the bottom of the decal, the carrier having cavities located in alignment with the apertures of the decal; positioning the decal on the carrier having the decal bottom surface in contact with the carrier top surface to form feature cavities defined by the decal apertures and the carrier cavities; positioning a plurality of metal elements in the feature cavities; filling the feature cavities with molten solder and cooling the solder; separating the decal from the carrier to partially expose metal core solder contacts; positioning the metal core solder contacts on receiving elements of a substrate; and exposing the metal core solder contacts on the substrate.

摘要翻译： 一种在衬底上制造金属芯焊料结构的方法和系统，包括：提供具有多个孔的贴花，所述孔从顶表面到底表面渐缩; 将载体定位在贴花底部的下方，载体具有与贴花的孔对准的空腔; 将贴花定位在具有贴花底表面的载体上，与载体顶表面接触以形成由贴花孔和载体空腔限定的特征空腔; 将多个金属元件定位在特征腔中; 用熔融焊料填充特征腔并冷却焊料; 将贴花从载体分离以部分地暴露金属芯焊料触点; 将金属芯焊料触点定位在基板的接收元件上; 并将金属芯焊料触点暴露在基板上。

公开(公告)号：US20150147851A1

公开(公告)日：2015-05-28

申请号：US14526268

申请日：2014-10-28

申请人： Claudius Feger ,  Michael A. Gaynes ,  Jae-Woong Nah ,  Da-Yuan Shih

发明人： Claudius Feger ,  Michael A. Gaynes ,  Jae-Woong Nah ,  Da-Yuan Shih

IPC分类号： H01L23/00 ,  H01L21/56

CPC分类号： H01L24/81 ,  H01L21/463 ,  H01L21/563 ,  H01L23/49816 ,  H01L23/544 ,  H01L24/11 ,  H01L24/13 ,  H01L24/16 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/73 ,  H01L24/743 ,  H01L24/83 ,  H01L24/92 ,  H01L2223/54426 ,  H01L2223/54473 ,  H01L2223/54486 ,  H01L2224/11462 ,  H01L2224/13082 ,  H01L2224/13147 ,  H01L2224/1605 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/16238 ,  H01L2224/2741 ,  H01L2224/32225 ,  H01L2224/73104 ,  H01L2224/73204 ,  H01L2224/8113 ,  H01L2224/81132 ,  H01L2224/81192 ,  H01L2224/81193 ,  H01L2224/81203 ,  H01L2224/814 ,  H01L2224/81801 ,  H01L2224/81815 ,  H01L2224/83192 ,  H01L2224/83856 ,  H01L2224/9211 ,  H01L2224/94 ,  H01L2924/01029 ,  H01L2924/10253 ,  H01L2924/1461 ,  H01L2924/00 ,  H01L2924/00014 ,  H01L2924/00012 ,  H01L2924/014 ,  H01L2224/11 ,  H01L2224/27 ,  H01L2224/81 ,  H01L2224/83

摘要： A preassembly semiconductor device comprises chip soldering structures on a semiconductor chip and substrate soldering structures on a substrate corresponding to the chip soldering structures. The substrate soldering structures extend toward the chip soldering structures for forming solder connections with the chip soldering structures. The chip and the substrate are in preassembly positions relative to one another. The height of the substrate soldering structures is greater than the height of the chip soldering structures. A pre-applied underfill is contiguous with the substrate and is sufficiently thick so as to extend substantially no further than the full height of the substrate soldering structures. In another embodiment the height of the chip soldering structures is greater than the height of the substrate soldering structures and the pre-applied underfill is contiguous with the semiconductor chip and sufficiently thick so as to extend substantially no further than the full height of the chip soldering structures. A process comprises manufacturing semiconductor assemblies from these devices by soldering the chip and the substrate to one another

公开(公告)号：US08963340B2

公开(公告)日：2015-02-24

申请号：US13231594

申请日：2011-09-13

申请人： Claudius Feger ,  Michael A. Gaynes ,  Jae-Woong Nah ,  Da-Yuan Shih

发明人： Claudius Feger ,  Michael A. Gaynes ,  Jae-Woong Nah ,  Da-Yuan Shih

IPC分类号： H01L23/52 ,  H01L23/48 ,  H01L27/146 ,  H01L23/498 ,  H01L21/56 ,  H01L23/544 ,  H01L23/00

CPC分类号： H01L24/81 ,  H01L21/463 ,  H01L21/563 ,  H01L23/49816 ,  H01L23/544 ,  H01L24/11 ,  H01L24/13 ,  H01L24/16 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/73 ,  H01L24/743 ,  H01L24/83 ,  H01L24/92 ,  H01L2223/54426 ,  H01L2223/54473 ,  H01L2223/54486 ,  H01L2224/11462 ,  H01L2224/13082 ,  H01L2224/13147 ,  H01L2224/1605 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/16238 ,  H01L2224/2741 ,  H01L2224/32225 ,  H01L2224/73104 ,  H01L2224/73204 ,  H01L2224/8113 ,  H01L2224/81132 ,  H01L2224/81192 ,  H01L2224/81193 ,  H01L2224/81203 ,  H01L2224/814 ,  H01L2224/81801 ,  H01L2224/81815 ,  H01L2224/83192 ,  H01L2224/83856 ,  H01L2224/9211 ,  H01L2224/94 ,  H01L2924/01029 ,  H01L2924/10253 ,  H01L2924/1461 ,  H01L2924/00 ,  H01L2924/00014 ,  H01L2924/00012 ,  H01L2924/014 ,  H01L2224/11 ,  H01L2224/27 ,  H01L2224/81 ,  H01L2224/83

摘要： A preassembly semiconductor device comprises substrate soldering structures extending toward chip soldering structures for forming solder connections with the chip soldering structures, i.e., the chip and the substrate are in preassembly positions relative to one another. The height of the substrate soldering structures is greater than the height of the chip soldering structures. A pre-applied underfill is contiguous with the substrate and is sufficiently thick so as to extend substantially no further than the full height of the substrate soldering structures. In another embodiment the height of the chip soldering structures is greater than the height of the substrate soldering structures and the pre-applied underfill is contiguous with the semiconductor chip and sufficiently thick so as to extend substantially no further than the full height of the chip soldering structures. A process comprises manufacturing semiconductor assemblies from these devices by soldering the semiconductor chip and the substrate to one another.

摘要翻译： 预组装半导体器件包括朝向芯片焊接结构延伸的衬底焊接结构，用于形成与芯片焊接结构的焊接连接，即，芯片和衬底相对于彼此处于预组装位置。 基板焊接结构的高度大于芯片焊接结构的高度。 预先施加的底部填充物与基底相邻并且足够厚以便基本上不超过基底焊接结构的全高度延伸。 在另一个实施例中，芯片焊接结构的高度大于衬底焊接结构的高度，并且预先施加的底部填充物与半导体芯片邻接并且足够厚以便基本上不超过芯片焊接的全部高度 结构。 一种方法包括通过将半导体芯片和衬底相互焊接来从这些器件制造半导体组件。

公开(公告)号：US08841544B2

公开(公告)日：2014-09-23

申请号：US13611047

申请日：2012-09-12

申请人： Augustin J. Hong ,  Jeehwan Kim ,  Jae-Woong Nah ,  Devendra K. Sadana

发明人： Augustin J. Hong ,  Jeehwan Kim ,  Jae-Woong Nah ,  Devendra K. Sadana

IPC分类号： H01L31/00

CPC分类号： H01L31/02366 ,  C03C15/00 ,  C03C2218/34 ,  Y02E10/50

摘要： A substrate for photovoltaic device includes a textured surface formed from silicon-based material. The textured surface includes a plurality of cones uniformly distributed across the textured surface. The uniformly distributed cones are configured by etching from a top surface of the substrate using a self-assembled solder dot mask evaporated on the substrate prior to etching. The cones are uniformly distributed as a result of gettering a process chamber prior to forming the solder dot mask. The cones have a height/width ratio between about 1 to about 4, and the cones have a density between 108 to 109 cones/cm2.

摘要翻译： 用于光伏器件的衬底包括由硅基材料形成的纹理表面。 纹理表面包括均匀分布在纹理化表面上的多个锥体。 均匀分布的锥体通过在蚀刻之前使用在衬底上蒸发的自组装焊点掩模从衬底的顶表面进行蚀刻而配置。 由于在形成焊点掩模之前吸收处理室，锥体均匀分布。 锥体具有约1至约4之间的高度/宽度比，并且锥体具有在108至109锥/ cm 2之间的密度。

公开(公告)号：US20140035150A1

公开(公告)日：2014-02-06

申请号：US13565982

申请日：2012-08-03

申请人： Peter A. Gruber ,  Jae-Woong Nah

发明人： Peter A. Gruber ,  Jae-Woong Nah

IPC分类号： H01L23/48 ,  H01L21/28

CPC分类号： H01L23/48 ,  B23K1/0016 ,  B23K3/0607 ,  B23K3/0623 ,  B23K26/384 ,  B23K26/389 ,  B23K26/40 ,  B23K2101/42 ,  B23K2103/16 ,  H01L21/4853 ,  H01L23/14 ,  H01L23/147 ,  H01L23/49816 ,  H01L24/03 ,  H01L24/05 ,  H01L24/11 ,  H01L24/13 ,  H01L24/14 ,  H01L2224/0345 ,  H01L2224/03464 ,  H01L2224/0347 ,  H01L2224/0401 ,  H01L2224/056 ,  H01L2224/11003 ,  H01L2224/11005 ,  H01L2224/111 ,  H01L2224/1112 ,  H01L2224/11436 ,  H01L2224/11472 ,  H01L2224/11849 ,  H01L2224/13017 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/13551 ,  H01L2224/13561 ,  H01L2224/136 ,  H01L2224/81101 ,  H01L2224/81191 ,  H01L2924/01322 ,  H01L2924/12042 ,  H01L2924/00012 ,  H01L2924/00014 ,  H01L2924/014 ,  H01L2924/00

摘要： A method and system of producing metal cored solder structures on a substrate which includes: providing a decal having a plurality of apertures, the apertures being tapered from a top surface to a bottom surface; positioning a carrier beneath the bottom of the decal, the carrier having cavities located in alignment with the apertures of the decal; positioning the decal on the carrier having the decal bottom surface in contact with the carrier top surface to form feature cavities defined by the decal apertures and the carrier cavities; positioning a plurality of metal elements in the feature cavities; filling the feature cavities with molten solder and cooling the solder; separating the decal from the carrier to partially expose metal core solder contacts; positioning the metal core solder contacts on receiving elements of a substrate; and exposing the metal core solder contacts on the substrate.

摘要翻译： 一种在衬底上制造金属芯焊料结构的方法和系统，包括：提供具有多个孔的贴花，所述孔从顶表面到底表面渐缩; 将载体定位在贴花底部的下方，载体具有与贴花的孔对准的空腔; 将贴花定位在具有贴花底表面的载体上，与载体顶表面接触以形成由贴花孔和载体空腔限定的特征空腔; 将多个金属元件定位在特征腔中; 用熔融焊料填充特征腔并冷却焊料; 将贴花从载体分离以部分地暴露金属芯焊料触点; 将金属芯焊料触点定位在基板的接收元件上; 并将金属芯焊料触点暴露在基板上。

公开(公告)号：US08541291B2

公开(公告)日：2013-09-24

申请号：US13159773

申请日：2011-06-14

申请人： Bruce K. Furman ,  Jae-Woong Nah

发明人： Bruce K. Furman ,  Jae-Woong Nah

IPC分类号： H01L21/00 ,  H01L21/44

CPC分类号： H05K3/3436 ,  H01L21/563 ,  H01L21/6835 ,  H01L24/11 ,  H01L24/12 ,  H01L24/16 ,  H01L24/81 ,  H01L2224/05001 ,  H01L2224/05026 ,  H01L2224/0508 ,  H01L2224/05144 ,  H01L2224/05147 ,  H01L2224/05155 ,  H01L2224/05166 ,  H01L2224/05171 ,  H01L2224/05571 ,  H01L2224/05644 ,  H01L2224/11003 ,  H01L2224/11334 ,  H01L2224/11901 ,  H01L2224/13082 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/1357 ,  H01L2224/13611 ,  H01L2224/13644 ,  H01L2224/13655 ,  H01L2224/16 ,  H01L2224/73203 ,  H01L2224/81191 ,  H01L2224/81193 ,  H01L2224/81203 ,  H01L2224/81801 ,  H01L2924/00013 ,  H01L2924/01006 ,  H01L2924/01022 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/14 ,  H05K3/328 ,  H05K2201/0367 ,  H05K2201/0379 ,  H05K2201/10234 ,  H05K2201/10734 ,  H05K2201/10977 ,  H05K2203/0338 ,  Y02P70/613 ,  Y10T29/49155 ,  H01L2924/00014 ,  H01L2224/13099

摘要： An electrical structure and method for forming electrical interconnects. The method includes positioning a sacrificial carrier substrate such that a first surface of a non-solder metallic core structure within the sacrificial carrier substrate is in contact with a first electrically conductive pad. The first surface is thermo-compression bonded to the first electrically conductive pad. The sacrificial carrier substrate is removed from the non-solder metallic core structure. A solder structure is formed on a second electrically conductive pad. The first substrate comprising the non-solder metallic core structure is positioned such that a second surface of the non-solder metallic core structure is in contact with the solder structure. The solder structure is heated to a temperature sufficient to cause the solder structure to melt and form an electrical and mechanical connection between the second surface of the non-solder metallic core structure and the second electrically conductive pad.

摘要翻译： 一种用于形成电互连的电结构和方法。 该方法包括定位牺牲载体衬底，使得牺牲载体衬底内的非焊料金属芯结构的第一表面与第一导电焊盘接触。 第一表面被热压接合到第一导电焊盘。 从非焊接金属芯结构去除牺牲载体衬底。 在第二导电焊盘上形成焊料结构。 包括非焊料金属芯结构的第一衬底定位成使得非焊料金属芯结构的第二表面与焊料结构接触。 将焊料结构加热到足以使焊料结构熔化并在非焊接金属芯结构的第二表面和第二导电焊盘之间形成电和机械连接的温度。

公开(公告)号：US08492262B2

公开(公告)日：2013-07-23

申请号：US12706212

申请日：2010-02-16

申请人： Peter A. Gruber ,  Paul A. Lauro ,  Jae-Woong Nah

发明人： Peter A. Gruber ,  Paul A. Lauro ,  Jae-Woong Nah

IPC分类号： H01L21/44

CPC分类号： H05K3/3452 ,  H01L21/4853 ,  H01L23/3157 ,  H01L23/49811 ,  H01L23/49816 ,  H01L24/05 ,  H01L24/11 ,  H01L24/13 ,  H01L24/742 ,  H01L2224/0401 ,  H01L2224/05647 ,  H01L2224/10145 ,  H01L2224/1131 ,  H01L2224/11472 ,  H01L2224/1148 ,  H01L2224/11849 ,  H01L2224/13021 ,  H01L2224/13022 ,  H01L2224/131 ,  H01L2224/1403 ,  H01L2224/742 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01038 ,  H01L2924/01042 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/14 ,  H05K3/3468 ,  H05K2201/09036 ,  H05K2201/09827 ,  H05K2201/09845 ,  H05K2203/0126 ,  H05K2203/043 ,  H05K2203/0557 ,  H05K2203/0594 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： An assembly is obtained; it includes a substrate; a plurality of wet-able pads formed on a surface of the substrate; and a solder resist layer deposited on the surface of the substrate and having an outer surface. At least the solder resist layer is formed with recessed regions defining volumes adjacent the wet-able pads. Molten solder is directly injected into the volumes adjacent the wet-able pads, such that the volumes adjacent the wet-able pads are filled with solder. The solder is allowed to solidify. It forms a plurality of solder structures adhered to the wet-able pads. The substrate and the solder are re-heated after the solidification, to re-flow the solder into generally spherical balls extending above the outer surface of the solder resist layer. The volumes adjacent the wet-able pads are configured and dimensioned to receive sufficient solder in the injecting step such that the generally spherical balls extend above the outer surface of the solder resist layer as a result of the re-heating step. In an alternative approach, solder injection and solidification are carried out in a nitrogen environment or a forming gas environment, and the reflow step may be omitted.

摘要翻译： 获得组装; 它包括一个基片; 形成在所述基板的表面上的多个可湿式焊盘; 以及沉积在基板的表面上并具有外表面的阻焊层。 至少阻焊层形成有限定与湿润垫相邻的体积的凹陷区域。 将熔融的焊料直接注入到与湿式焊盘相邻的体积中，使得与可湿性焊盘相邻的体积填充有焊料。 使焊料固化。 它形成粘附到湿润垫的多个焊料结构。 在固化之后，将基板和焊料重新加热，以将焊料重新流入延伸到阻焊层的外表面之上的大致球形的球体。 配置和设置相邻于湿式焊盘的体积，以便在注入步骤中接收足够的焊料，使得大致球形球由于再加热步骤而在阻焊层的外表面上方延伸。 在替代方法中，焊料注入和凝固在氮气环境或形成气体环境中进行，并且可以省略回流步骤。

公开(公告)号：US20130049150A1

公开(公告)日：2013-02-28

申请号：US13606916

申请日：2012-09-07

申请人： Augustin J. Hong ,  Woo-Shik Jung ,  Jeehwan Kim ,  Jae-Woong Nah ,  Devendra K. Sadana

发明人： Augustin J. Hong ,  Woo-Shik Jung ,  Jeehwan Kim ,  Jae-Woong Nah ,  Devendra K. Sadana

IPC分类号： B32B3/30 ,  H01L31/0352

CPC分类号： H01L31/035227 ,  C03C15/00 ,  C03C17/06 ,  C03C2218/34 ,  H01L31/022433 ,  H01L31/02363 ,  H01L31/035281 ,  H01L31/0376 ,  H01L31/0392 ,  H01L31/03921 ,  H01L31/03923 ,  H01L31/03925 ,  H01L31/056 ,  H01L31/075 ,  Y02E10/52 ,  Y02E10/541 ,  Y02E10/548 ,  Y10S438/945 ,  Y10S977/773 ,  Y10S977/779 ,  Y10T428/12014 ,  Y10T428/12069 ,  Y10T428/12076 ,  Y10T428/24479 ,  Y10T428/24488 ,  Y10T428/2982

摘要： Hemispheres and spheres are formed and employed for a plurality of applications. Hemispheres are employed to form a substrate having an upper surface and a lower surface. The upper surface includes peaks of pillars which have a base attached to the lower surface. The peaks have a density defined at the upper surface by an array of hemispherical metal structures that act as a mask during an etch to remove substrate material down to the lower surface during formation of the pillars. The pillars are dense and uniform and include a microscale average diameter. The spheres are formed as independent metal spheres or nanoparticles for other applications.