Switching device of active display device and method of driving the switching device
    1.
    发明授权
    Switching device of active display device and method of driving the switching device 有权
    有源显示装置的开关装置和驱动开关装置的方法

    公开(公告)号:US08760597B2

    公开(公告)日:2014-06-24

    申请号:US12805382

    申请日:2010-07-28

    Abstract: Example embodiments are directed to a switching device of an active display device and a method of driving the switching device, such that electrical reliability of the active display device is improved. The switching device of the active display device includes a plurality of thin film transistors (TFTs) that are connected in series. Except for a refresh time duration during which the plurality of TFTs of the switching device are simultaneously turned ON, a positive voltage is applied to at least one of the plurality of TFTs of the switching device so that a reliability of the switching device may be improved.

    Abstract translation: 示例性实施例涉及有源显示装置的开关装置和驱动开关装置的方法,使得主动显示装置的电可靠性得到改善。 有源显示装置的开关装置包括串联连接的多个薄膜晶体管(TFT)。 除了开关装置的多个TFT同时导通的刷新持续时间之外,对开关装置的多个TFT中的至少一个施加正电压,从而可以提高开关装置的可靠性 。

    Method of forming a polysilicon film and method of manufacturing a thin film transistor including a polysilicon film
    6.
    发明授权
    Method of forming a polysilicon film and method of manufacturing a thin film transistor including a polysilicon film 有权
    形成多晶硅膜的方法和制造包括多晶硅膜的薄膜晶体管的方法

    公开(公告)号:US07923316B2

    公开(公告)日:2011-04-12

    申请号:US11808521

    申请日:2007-06-11

    CPC classification number: H01L29/66757 H01L29/78603 H01L29/78606

    Abstract: In a method of forming a polysilicon film, a thin film transistor including a polysilicon film, and a method of manufacturing a thin film transistor including a polysilicon film, the thin film transistor includes a substrate, a first heat conduction film on the substrate, a second heat conduction film adjacent to the first heat conduction film, the second heat conduction film having a lower thermal conductivity than the first heat conduction film, a polysilicon film on the second heat conduction film and the first heat conduction film adjacent to the second heat conduction film, and a gate stack on the polysilicon film. The second heat conduction film may either be on the first heat conduction film or, alternatively, the first heat conduction film may be non-contiguous and the second heat conduction film may be interposed between portions of the non-contiguous first heat conduction film.

    Abstract translation: 在形成多晶硅膜的方法中,包括多晶硅膜的薄膜晶体管和包括多晶硅膜的薄膜晶体管的制造方法,薄膜晶体管包括基板,基板上的第一导热膜, 与所述第一导热膜相邻的所述第二导热膜,所述第二导热膜的热导率低于所述第一导热膜,所述第二导热膜上的多晶硅膜和与所述第二导热膜相邻的所述第一导热膜 膜和多晶硅膜上的栅极堆叠。 第二导热膜可以在第一导热膜上,或者第一导热膜可以不连续,并且第二导热膜可以介于不连续的第一导热膜的部分之间。

    ORGANIC ELECTRO-LUMINESCENT DISPLAY AND METHOD OF FABRICATING THE SAME
    7.
    发明申请
    ORGANIC ELECTRO-LUMINESCENT DISPLAY AND METHOD OF FABRICATING THE SAME 有权
    有机电致发光显示器及其制造方法

    公开(公告)号:US20100301324A1

    公开(公告)日:2010-12-02

    申请号:US12855807

    申请日:2010-08-13

    CPC classification number: H01L21/02672 H01L21/02532 H01L27/1277 H01L27/3244

    Abstract: An organic electro-luminescent display and a method of fabricating the same include an organic light emitting diode, a driving transistor which drives the organic light emitting diode, and a switching transistor which controls an operation of the driving transistor, wherein active layers of the switching and driving transistors are crystallized using silicides having different densities such that the active layer of the driving transistor has a larger grain size than the active layer of the switching layer.

    Abstract translation: 有机电致发光显示器及其制造方法包括有机发光二极管,驱动有机发光二极管的驱动晶体管和控制驱动晶体管的操作的开关晶体管,其中开关的有源层 并且使用具有不同密度的硅化物使驱动晶体管结晶,使得驱动晶体管的有源层具有比开关层的有源层更大的晶粒尺寸。

    Apparatus for atomic layer deposition and method of atomic layer deposition using the same
    8.
    发明申请
    Apparatus for atomic layer deposition and method of atomic layer deposition using the same 审中-公开
    用于原子层沉积的装置和使用其的原子层沉积的方法

    公开(公告)号:US20090291211A1

    公开(公告)日:2009-11-26

    申请号:US12292595

    申请日:2008-11-21

    CPC classification number: C23C16/45565 C23C16/45551 C23C16/45574

    Abstract: Example embodiments provide an atomic layer deposition apparatus and a method of depositing an atomic layer using the atomic layer deposition apparatus. The atomic layer deposition apparatus may include a reaction chamber, a substrate supporter installed in the reaction chamber to support a substrate, and a shower head that is disposed above the substrate supporter and has at least one nozzle set that simultaneously inject a first source gas, a second source gas, and a purge gas onto the substrate. The method of depositing an atomic layer may include moving at least one of the substrate and the shower head in a first direction and simultaneously depositing at least one first atomic layer and at least one second atomic layer on the substrate by injecting the first source gas, the second source gas, and the purge gas through the shower head while the moving operation is performed.

    Abstract translation: 示例性实施例提供原子层沉积设备和使用原子层沉积设备沉积原子层的方法。 原子层沉积装置可以包括反应室,安装在反应室中以支撑基板的基板支撑件和设置在基板支撑件上方并具有至少一个同时喷射第一源气体的喷嘴组的喷淋头, 第二源气体和吹扫气体到基板上。 沉积原子层的方法可以包括沿第一方向移动衬底和淋浴头中的至少一个,并且通过注入第一源气体同时在衬底上沉积至少一个第一原子层和至少一个第二原子层, 第二源气体和通过淋浴喷头的净化气体进行移动操作。

    Oxide semiconductor transistor and method of manufacturing the same
    9.
    发明申请
    Oxide semiconductor transistor and method of manufacturing the same 有权
    氧化物半导体晶体管及其制造方法

    公开(公告)号:US20090206332A1

    公开(公告)日:2009-08-20

    申请号:US12320701

    申请日:2009-02-02

    CPC classification number: H01L29/7869 H01L29/42384 H01L29/4908 H01L29/78648

    Abstract: An oxide semiconductor thin film transistor (TFT) and a method of manufacturing the oxide semiconductor TFT. The oxide semiconductor TFT includes a first gate insulating layer arranged between an oxide semiconductor channel layer and a first gate and a second gate insulating layer arranged between the channel layer and a second gate. The first and second gate insulating layers are made out of different materials and have different thicknesses. Preferably, the second gate insulating layer is silicon oxide and is thinner than the first gate insulating layer which is preferably silicon nitride. Oxide semiconductor refers to an oxide material such as Zinc Oxide, Tin Oxide, Ga—In—Zn Oxide, In—Zn Oxide, In—Sn Oxide, and one of Zinc Oxide, Tin Oxide, Ga—In—Zn Oxide, In—Zn Oxide and In—Sn Oxide.

    Abstract translation: 氧化物半导体薄膜晶体管(TFT)及其制造方法。 氧化物半导体TFT包括布置在氧化物半导体沟道层和第一栅极之间的第一栅极绝缘层和布置在沟道层和第二栅极之间的第二栅极绝缘层。 第一和第二栅极绝缘层由不同的材料制成并且具有不同的厚度。 优选地,第二栅极绝缘层是氧化硅并且比优选为氮化硅的第一栅极绝缘层更薄。 氧化物半导体是指氧化锌,氧化锡,Ga-In-Zn氧化物,In-Zn氧化物,In-Sn氧化物,氧化锌,氧化锡,Ga-In-Zn氧化物,In- 氧化锌和氧化铟锡。

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