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公开(公告)号：US07533457B2
公开(公告)日：2009-05-19
申请号：US11173219
申请日：2005-06-30
Applicant: Richard B Foehringer , Jason E Snodgress , Steven R. Eskildsen , John G. Meyers
Inventor： Richard B Foehringer , Jason E Snodgress , Steven R. Eskildsen , John G. Meyers
CPC classification number: H01L23/3121 , H01L21/565 , H01L24/97 , H01L25/167 , H01L2224/48091 , H01L2224/48227 , H01L2924/12041 , H01L2924/181 , H01L2924/19041 , H01L2924/19105 , H05K3/0052 , H05K3/284 , H05K2201/10106 , H05K2201/10446 , Y10T29/49117 , Y10T29/4913 , Y10T29/49131 , Y10T29/49144 , H01L2924/00014 , H01L2924/00012
Abstract: A method includes populating a circuit board with components, and encapsulating the circuit board and the components with a material. The method further includes separating the circuit board into a plurality of separate devices.
Abstract translation: 一种方法包括使用组件填充电路板，并用材料封装电路板和组件。 该方法还包括将电路板分离成多个单独的装置。
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公开(公告)号：US5956840A
公开(公告)日：1999-09-28
申请号：US971155
申请日：1997-11-14
Applicant: Steven S. Chan , John E. Dowsing, III , Jason E. Snodgress
Inventor： Steven S. Chan , John E. Dowsing, III , Jason E. Snodgress
CPC classification number: H01L23/66 , H01P1/08 , H01L2924/0002 , Y10T29/49016
Abstract: The invention relates to a method for producing low cost hermetic Integrated Module Assembly (IMA) packaging, where an aluminum coating (24) is deposited on a poly-tetrafluoral-ethaline substrate (20), the aluminum coating (24) is selectively etched to form a waveguide window (26) and the substrate (20) is selectively treated over the waveguide window (26) to produce a non-conductive hermetic seal. The substrate (20) is then joined to a metal carrier (28) containing the waveguide (30). As a result of using selectively treated low cost substrates to produce hermetic seals, more expensive substrates are not required to form hermetic seals over substrate to waveguide interconnections.
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公开(公告)号：US07109830B2
公开(公告)日：2006-09-19
申请号：US10227687
申请日：2002-08-26
Applicant: Richard Emil Sweeney , Jason E. Snodgress
Inventor： Richard Emil Sweeney , Jason E. Snodgress
CPC classification number: H01P5/185 , H05K1/0218 , H05K1/144
Abstract: Methods of assembling a coupler are provided in which a first printed circuit board is provided, and a second printed circuit board is then surface mounted on the first printed circuit board. The first printed circuit board and the second printed circuit board are then electrically and mechanically connected to provide a coupler having a shielded region defined between the first printed circuit board and the second printed circuit board. The shielded region at least partly surrounds a coupler circuit disposed therein.
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公开(公告)号：US6028007A
公开(公告)日：2000-02-22
申请号：US274832
申请日：1999-03-23
Applicant: Steven S. Chan , John E. Dowsing, III , Jason E. Snodgress
Inventor： Steven S. Chan , John E. Dowsing, III , Jason E. Snodgress
IPC: H01L23/12 , H01L23/66 , H01P1/08 , H01P11/00 , H01L21/311
CPC classification number: H01L23/66 , H01P1/08 , H01L2924/0002 , Y10T29/49016
Abstract: The invention relates to a method for producing low cost hermetic Integrated Module Assembly (IMA) packaging, where an aluminum coating (24) is deposited on a poly-tetrafluoral-ethaline substrate (20), the aluminum coating (24) is selectively etched to form a waveguide window (26) and the substrate (20) is selectively treated over the waveguide window (26) to produce a non-conductive hermetic seal. The substrate (20) is then joined to a metal carrier (28) containing the waveguide (30). As a result of using selectively treated low cost substrates to produce hermetic seals, more expensive substrates are not required to form hermetic seals over substrate to waveguide interconnections.
Abstract translation: 本发明涉及一种用于生产低成本密封的集成模块装配（IMA）封装的方法，其中铝涂层（24）沉积在聚四氟乙基底（20）上，铝涂层（24）被选择性地蚀刻到 形成波导窗口（26），并且在波导窗口（26）上选择性地处理衬底（20）以产生非导电气密封。 然后将基板（20）接合到包含波导管（30）的金属载体（28）上。 作为使用选择性处理的低成本基底以产生气密密封的结果，不需要更昂贵的基底以在基底与波导互连之间形成气密密封。
