Automated core package placement
    1.
    发明授权
    Automated core package placement 失效
    自动核心软件包放置

    公开(公告)号:US06871687B2

    公开(公告)日:2005-03-29

    申请号:US10422235

    申请日:2003-04-24

    Abstract: A method of automatically placing a core package (301) in a mold (505) is provided. Locators (501) and a cavity (503) designed to receive at least a part of the core package (301) are formed in the mold (505). The mold (505) is positioned such that the locators (501) may be illuminated and one or more images are obtained of the locators (501). The images are processed to determine a target location for the core package (301) in the cavity (503), and an automated device (303) places the core package (303) in the mold (505) at the target location.

    Abstract translation: 提供了一种将芯包(301)自动放置在模具(505)中的方法。 在模具(505)中形成定位器(501)和设计成容纳芯包装(301)的至少一部分的空腔(503)。 模具(505)被定位成使得定位器(501)可被照亮,并且获得定位器(501)的一个或多个图像。 处理图像以确定空腔(503)中的芯包(301)的目标位置,并且自动化装置(303)将芯包(303)放置在模具(505)中的目标位置处。

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