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    NOVEL REWORKABLE UNDERFILLS FOR CERAMIC MCM C4 PROTECTION
    5.
    发明申请
    NOVEL REWORKABLE UNDERFILLS FOR CERAMIC MCM C4 PROTECTION 有权
    陶瓷MCM C4保护的新颖可行的解决方案

    公开(公告)号：US20120021567A1

    公开(公告)日：2012-01-26

    申请号：US13252424

    申请日：2011-10-04

    申请人： Jeffrey T. Coffin ,  Steven P. Ostrander ,  Frank L. Pompeo ,  Jiali Wu

    发明人： Jeffrey T. Coffin ,  Steven P. Ostrander ,  Frank L. Pompeo ,  Jiali Wu

    IPC分类号： H01L21/56

    CPC分类号： H01L23/293 ,  H01L21/563 ,  H01L23/3157 ,  H01L24/32 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16225 ,  H01L2224/27013 ,  H01L2224/32225 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2924/00014 ,  H01L2924/01029 ,  H01L2924/01078 ,  H01L2924/09701 ,  H01L2924/14 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/05599

    摘要： The present invention provides chip containing electronic devices such as Multichip Ceramic Modules (MCM's) containing a plurality of chips on a substrate which chips are underfilled with a reworkable composition which allows one or more chips to be removed from the device and replaced. The reworkable compositions contain a base resin which is not cross-linkable and which forms a matrix with a linear curable component or preferably a combination of linear curable components which curable components are cross-linkable and when cured form a cross-linked domain in the base resin matrix. A suitable cross-linking catalyst such as Pt is used and optionally a filler preferably silane surface treated silica. The preferred base resin is linear polydimethylsiloxane and the preferred curable components are vinyl terminated linear poly dimethyl siloxane and hydrogen terminated linear poly dimethyl siloxane.

    摘要翻译： 本发明提供了包含电子器件的芯片，例如在衬底上包含多个芯片的多芯片陶瓷模块（MCM），其中芯片底部填充有可重复组合，其允许从器件中移除一个或多个芯片并被替换。 可再加工组合物含有不可交联的基础树脂，并且其形成具有线性可固化组分或优选可固化组分可交联的线性可固化组分的组合的基质，并且当固化形成基底中的交联结构域时 树脂基体。 使用合适的交联催化剂如Pt，任选的填料优选是硅烷表面处理的二氧化硅。 优选的基础树脂是直链聚二甲基硅氧烷，优选的可固化组分是乙烯基封端的直链聚二甲基硅氧烷和氢封端的直链聚二甲基硅氧烷。

    Method of forming a flip-chip package
    6.
    发明授权
    Method of forming a flip-chip package 有权
    形成倒装芯片封装的方法

    公开(公告)号：US08037594B2

    公开(公告)日：2011-10-18

    申请号：US12116655

    申请日：2008-05-07

    申请人： Jeffrey T. Coffin ,  Michael A. Gaynes ,  David L. Questad ,  Kamal K. Sikka ,  Hilton T. Toy ,  Jamil A. Wakil

    发明人： Jeffrey T. Coffin ,  Michael A. Gaynes ,  David L. Questad ,  Kamal K. Sikka ,  Hilton T. Toy ,  Jamil A. Wakil

    IPC分类号： H05B3/00

    CPC分类号： H01L23/34 ,  H01L23/3735 ,  H01L23/42 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2924/3511 ,  Y10T29/49004 ,  Y10T29/49083 ,  Y10T29/49117 ,  Y10T29/49124 ,  Y10T29/4913 ,  Y10T29/49135 ,  Y10T29/4935

    摘要： Disclosed are thermally conductive plates. Each plate is configured such that a uniform adhesive-filled gap may be achieved between the plate and a heat generating structure when the plate is bonded to the heat generating structure and subjected to a temperature within a predetermined temperature range that causes the heat generating structure to warp. Additionally, this disclosure presents the associated methods of forming the plates and of bonding the plates to a heat generating structure. In one embodiment the plate is curved and modeled to match the curved surface of a heat generating structure within the predetermined temperature range. In another embodiment the plate is a multi-layer conductive structure that is configured to undergo the same warpage under a thermal load as the heat generating structure. Thus, when the plate is bonded with the heat generating structure it is able to achieve and maintain a uniform adhesive-filled gap at any temperature.

    摘要翻译： 披露的是导热板。 每个板被构造成使得当板结合到发热结构并经受使得发热结构的预定温度范围内的温度时，板和发热结构之间可以实现均匀的粘合剂填充的间隙 经。 另外，本公开提供了形成板并将板结合到发热结构的相关方法。 在一个实施例中，板是弯曲的并被建模以使发热结构的弯曲表面在预定温度范围内匹配。 在另一个实施例中，板是多层导电结构，其被配置为在与热产生结构相关的热负荷下经历相同的翘曲。 因此，当板与发热结构接合时，能够在任何温度下实现和保持均匀的粘合剂填充间隙。

    Reworkable underfills for ceramic MCM C4 protection
    7.
    发明授权
    Reworkable underfills for ceramic MCM C4 protection 有权
    用于陶瓷MCM C4保护的可重修的底漆

    公开(公告)号：US08492199B2

    公开(公告)日：2013-07-23

    申请号：US13252424

    申请日：2011-10-04

    申请人： Jeffrey T. Coffin ,  Steven P. Ostrander ,  Frank L. Pompeo ,  Jiali Wu

    发明人： Jeffrey T. Coffin ,  Steven P. Ostrander ,  Frank L. Pompeo ,  Jiali Wu

    IPC分类号： H01L21/56

    CPC分类号： H01L23/293 ,  H01L21/563 ,  H01L23/3157 ,  H01L24/32 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16225 ,  H01L2224/27013 ,  H01L2224/32225 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2924/00014 ,  H01L2924/01029 ,  H01L2924/01078 ,  H01L2924/09701 ,  H01L2924/14 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/05599

    摘要： The present invention provides chip containing electronic devices such as Multichip Ceramic Modules (MCM's) containing a plurality of chips on a substrate which chips are underfilled with a reworkable composition which allows one or more chips to be removed from the device and replaced. The reworkable compositions contain a base resin which is not cross-linkable and which forms a matrix with a linear curable component or preferably a combination of linear curable components which curable components are cross-linkable and when cured form a cross-linked domain in the base resin matrix. A suitable cross-linking catalyst such as Pt is used and optionally a filler preferably silane surface treated silica. The preferred base resin is linear polydimethylsiloxane and the preferred curable components are vinyl terminated linear poly dimethyl siloxane and hydrogen terminated linear poly dimethyl siloxane.

    摘要翻译： 本发明提供了包含电子器件的芯片，例如在衬底上包含多个芯片的多芯片陶瓷模块（MCM），其中芯片底部填充有可重复组合，其允许从器件中移除一个或多个芯片并被替换。 可再加工组合物含有不可交联的基础树脂，并且其形成具有线性可固化组分或优选可固化组分可交联的线性可固化组分的组合的基质，并且当固化形成基底中的交联结构域时 树脂基体。 使用合适的交联催化剂如Pt，任选的填料优选是硅烷表面处理的二氧化硅。 优选的基础树脂是直链聚二甲基硅氧烷，优选的可固化组分是乙烯基封端的直链聚二甲基硅氧烷和氢封端的直链聚二甲基硅氧烷。

    NOVEL REWORKABLE UNDERFILLS FOR CERAMIC MCM C4 PROTECTION
    9.
    发明申请
    NOVEL REWORKABLE UNDERFILLS FOR CERAMIC MCM C4 PROTECTION 审中-公开
    陶瓷MCM C4保护的新颖可行的解决方案

    公开(公告)号：US20070290378A1

    公开(公告)日：2007-12-20

    申请号：US11425208

    申请日：2006-06-20

    申请人： Jeffrey T. Coffin ,  Steven P. Ostrander ,  Frank L. Pompeo ,  Jiali Wu

    发明人： Jeffrey T. Coffin ,  Steven P. Ostrander ,  Frank L. Pompeo ,  Jiali Wu

    IPC分类号： H01L23/29

    CPC分类号： H01L23/293 ,  H01L21/563 ,  H01L23/3157 ,  H01L24/32 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16225 ,  H01L2224/27013 ,  H01L2224/32225 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2924/00014 ,  H01L2924/01029 ,  H01L2924/01078 ,  H01L2924/09701 ,  H01L2924/14 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/05599

    摘要： The present invention provides chip containing electronic devices such as Multichip Ceramic Modules (MCM's) containing a plurality of chips on a substrate which chips are underfilled with a reworkable composition which allows one or more chips to be removed from the device and replaced. The reworkable compositions contain a base resin which is not cross-linkable and which forms a matrix with a linear curable component or preferably a combination of linear curable components which curable components are cross-linkable and when cured form a cross-linked domain in the base resin matrix. A suitable cross-linking catalyst such as Pt is used and optionally a filler preferably silane surface treated silica. The preferred base resin is linear polydimethylsiloxane and the preferred curable components are vinyl terminated linear poly dimethyl siloxane and hydrogen terminated linear poly dimethyl siloxane.

    摘要翻译： 本发明提供了包含电子器件的芯片，例如在衬底上包含多个芯片的多芯片陶瓷模块（MCM），其中芯片底部填充有可重复组合，其允许从器件中移除一个或多个芯片并被替换。 可再加工组合物含有不可交联的基础树脂，并且其形成具有线性可固化组分或优选可固化组分可交联的线性可固化组分的组合的基质，并且当固化形成基底中的交联结构域时 树脂基体。 使用合适的交联催化剂如Pt，任选的填料优选是硅烷表面处理的二氧化硅。 优选的基础树脂是直链聚二甲基硅氧烷，优选的可固化组分是乙烯基封端的直链聚二甲基硅氧烷和氢封端的直链聚二甲基硅氧烷。