摘要:
A detection apparatus and method for an ion migration spectrum include acquiring an ion migration spectrum of pure carrier gas and an ion migration spectrum of carrier gas containing a test substance sample and performing differential process on the ion migration spectrum of the pure carrier gas and the ion migration spectrum of the carrier gas containing the test substance sample to acquire a differential spectrum. The value of a characteristic peak of the differential spectrum represents properties of the sample of substances. The method avoids interferences on the migration spectrum from interference sources of the apparatus itself, thereby improving detection sensitivity and accuracy of the ion migration spectrum, and migration spectrum shift caused by variations in the environmental conditions can be found and corrected through the differential process on the migration spectrum of the pure carrier gas, thereby achieving self-stableness and self-correction of the ion migration spectrometer.
摘要:
Disclosed is a flexible circuit cable with at least two bundled wire groups. The circuit cable has first and second ends respectively connected to first and second connection sections. The circuit cable includes a cluster section, which is formed of a plurality of cluster wires formed by slitting the circuit cable, in an extension direction of the cable, at a predetermined cut width. The cluster section includes at least two independent bundles, which are formed by dividing the cluster wires of the circuit cable into different signal groups according to electrical signals transmitted therethrough. Bundling members are used to the cluster wires of the independent bundles according to predetermined bundling modes. Further, the circuit cable has a surface forming a shielding conductive layer for electromagnetic interference protection and impedance control for internal signals of the circuit cable.
摘要:
An etchant for removing a porous low-k dielectric layer on a semiconductor substrate includes a hydrofluoric acid-based solvent, a dilating additive for dilating the pores in the porous low-k dielectric, and a passivating additive that forms a passivation layer at the interface between the low-k dielectric layer and the semiconductor substrate.
摘要:
The present invention discloses a filter device. The filter device comprises a housing with an air inlet and an filtered air outlet; a high voltage electric field region provided between two ends of the housing, wherein the direction of the electric field is perpendicular to the direction along which the air is introduced into the housing; an ionization source provided in the electric field region to ionize the ionizable pollutants present in the air introduced from the air inlet and form the resultant ionized pollutants which will move towards both ends of the housing under the influence of the electric field; and a discharging device for discharging the ionized pollutants which have arrived at the ends of the housing out of the filter device. The present invention also relates to a filtering method of using the filter device, and a trace detector. The filter device can be used to ionize the ionizable interferents existed in the air, separate the ionized interferents from the other components of the air under the influence of the electric field, and discharge the interferent out of the filter device, thereby reducing the consumption of the consumables or even eliminating the need for consumables. The filter device in accordance with the present invention is applicable to a trace detector based on ion mobility technology for the detection of trace amounts of substances.
摘要:
A system and method are configured to apply region level optimizations to a selected region of source code rather than loop level optimizations to a loop or loop nest. The region may include an outer loop, a plurality of inner loops and at least one control code. If the region includes an exceptional control flow statement and/or a procedure call, speculative region-level multi-versioning may be applied.
摘要:
A structure of via hole of electrical circuit board includes an adhesive layer and a conductor layer that are formed after wiring is formed on a carrier board. At least one through hole extends in a vertical direction through the carrier board, the wiring, the adhesive layer, and the conductor layer and forms a hole wall surface. The conductor layer shows a height difference with respect to an exposed zone of the circuit trace in the vertical direction. A conductive cover section covers the conductor layer and the hole wall surface of the through hole. The carrier board is a single-sided board, a double-sided board, a multi-layered board, or a combination thereof, and the single-sided board, the double-sided board, and multi-layered board can be flexible boards, rigid boards, or composite boards combining flexible and rigid boards.
摘要:
Disclosed is a flat signal transmission cable with bundling structure, including at least one flexible circuit. The flexible circuit includes a plurality of clustered flat cable components that are formed by slitting in a direction parallel to extension direction of the flexible circuit to impose free and independent flexibility for bending to each clustered flat cable component. At least one bundling structure is formed on a lateral side edge of a predetermined clustered flat cable component of the cluster section of the flexible circuit. The bundling structure forms a fastening section. When the clustered flat cable components of the cluster section of the flexible circuit are stacked to form a bundled structure, the bundling structure bundles the plurality of clustered flat cable components and is secured by being fastened by the fastening section.
摘要:
A flexible flat circuit cable includes first and second flexible circuit substrates extending in an extension direction. The first flexible circuit substrate has a first surface forming a first conductor layer and an insulation layer, and the second flexible circuit substrate has a first surface forming a second conductor layer and an insulation layer. A bonding material layer is applied at a predetermined section between the first flexible circuit substrate and the second flexible circuit substrate to bond the first and second flexible circuit substrates together in such a way to maintain a predetermined spacing distance between the first and second flexible circuit substrate and forming a gapped segment at sections where no bonding material is applied. The first and second flexible circuit substrates form a cluster section within the gapped segment, which has opposite ends respectively forming first and second connected sections each of which forms a connection plug or is provided with a connector.
摘要:
Methods and apparatus to provide loop parallelization based on loop splitting and/or index array are described. In one embodiment, one or more split loops, corresponding to an original loop, are generated based on the mis-speculation information. In another embodiment, a plurality of subloops are generated from an original loop based on an index array. Other embodiments are also described.