公开(公告)号：US10789272B2

公开(公告)日：2020-09-29

申请号：US13154207

申请日：2011-06-06

Applicant: Aidon P. Jennery ,  Brett E. Morris ,  Sriram R. Rao ,  Jin Wu

Inventor： Aidon P. Jennery ,  Brett E. Morris ,  Sriram R. Rao ,  Jin Wu

IPC: G06F7/00 ,  G06F16/27

Abstract: Provided are techniques for using containers to store objects. One data store from a set of data stores is assigned as a primary data store, wherein the remaining data stores comprise secondary data stores. A container for a group is created on the primary data store. A unique identifier for the container is generated on the primary data store. Metadata for the container is stored on the primary data store. Zero or more objects are stored in the container on the primary data store. For each of the secondary data stores that have objects belonging to the group, a container is created in that secondary data store having the unique identifier, wherein the container spans the primary data store and the secondary data stores, and wherein the objects in the container do not span the primary data store and the secondary data stores.

公开(公告)号：US10585371B2

公开(公告)日：2020-03-10

申请号：US13118021

申请日：2011-05-27

Applicant: Brian P. Gilmartin ,  Liang-Bih Lin ,  Jeanne M. Koval ,  Jin Wu ,  Aaron M. Stuckey

Inventor： Brian P. Gilmartin ,  Liang-Bih Lin ,  Jeanne M. Koval ,  Jin Wu ,  Aaron M. Stuckey

IPC: G03G5/02 ,  G03G15/02

Abstract: Exemplary embodiments provide materials and methods for an electrostatic charging member including a conductive substrate; a base layer disposed over the conductive substrate, the base layer comprising an elastomeric material and a semiconductive material; and a protective outer layer disposed over the base layer, the protective outer layer comprising a polymeric resin and a plurality of conductive particles, wherein the outer protective layer has a surface resistivity ranging from about 105 O/sq to about 1013 O/sq.

公开(公告)号：US09209157B2

公开(公告)日：2015-12-08

申请号：US13074883

申请日：2011-03-29

Applicant: Wen-Chih Chiou ,  Chen-Hua Yu ,  Weng-Jin Wu

Inventor： Wen-Chih Chiou ,  Chen-Hua Yu ,  Weng-Jin Wu

IPC: H01L21/44 ,  H01L25/065 ,  H01L21/768 ,  H01L23/48 ,  H01L25/00

CPC classification number: H01L23/481 ,  H01L21/76898 ,  H01L25/0657 ,  H01L25/50 ,  H01L2224/16 ,  H01L2225/06513 ,  H01L2225/06541

Abstract: The formation of through silicon vias (TSVs) in an integrated circuit (IC) die or wafer is described in which the TSV is formed in the integration process prior to contact or metallization processing. Contacts and bonding pads may then be fabricated after the TSVs are already in place, which allows the TSV to be more dense and allows more freedom in the overall TSV design. By providing a denser connection between TSVs and bonding pads, individual wafers and dies may be bonded directly at the bonding pads. The conductive bonding material, thus, maintains an electrical connection to the TSVs and other IC components through the bonding pads.

Abstract translation: 描述了在集成电路（IC）管芯或晶片中形成通孔硅通孔（TSV），其中在接触或金属化处理之前的集成工艺中形成TSV。 然后可以在TSV已经就位之后制造触点和接合焊盘，这允许TSV更致密并且允许TSV设计中的更多自由度。 通过在TSV和接合焊盘之间提供更密集的连接，单个晶片和管芯可以直接接合在接合焊盘处。 因此，导电接合材料通过接合焊盘保持与TSV和其它IC部件的电连接。

公开(公告)号：US09117828B2

公开(公告)日：2015-08-25

申请号：US12717573

申请日：2010-03-04

Applicant: Weng-Jin Wu ,  Ku-Feng Yang ,  Wen-Chih Chiou

Inventor： Weng-Jin Wu ,  Ku-Feng Yang ,  Wen-Chih Chiou

IPC: H01L21/50 ,  H01L21/56 ,  H01L21/71 ,  H01L21/60 ,  H01L21/683 ,  H01L21/768 ,  H01L23/31 ,  H01L23/00 ,  H01L25/00 ,  H01L29/06

CPC classification number: H01L21/561 ,  H01L21/6835 ,  H01L21/76898 ,  H01L23/3121 ,  H01L24/11 ,  H01L24/13 ,  H01L24/16 ,  H01L24/81 ,  H01L24/94 ,  H01L24/95 ,  H01L25/50 ,  H01L29/0657 ,  H01L2221/68318 ,  H01L2221/68345 ,  H01L2224/13009 ,  H01L2224/13099 ,  H01L2224/131 ,  H01L2224/13147 ,  H01L2224/81001 ,  H01L2224/81801 ,  H01L2224/81894 ,  H01L2224/83894 ,  H01L2225/06513 ,  H01L2225/06541 ,  H01L2924/0001 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01074 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/00 ,  H01L2224/0401

Abstract: A method of handling a thin wafer includes forming a support structure at the edge of a thinned wafer that is encapsulated by a protection layer. The support structure can be an adhesive layer enclosing the protection layer, a dielectric-filled trench embedded in the thinned wafer and surrounding the protection layer, or a housing affixing the edge of the thinned wafer.

Abstract translation: 处理薄晶片的方法包括在由保护层封装的薄化晶片的边缘处形成支撑结构。 支撑结构可以是包围保护层的粘合剂层，嵌入在薄化晶片中并围绕保护层的介电填充沟槽或者固定薄化晶片的边缘的壳体。

公开(公告)号：US08906513B2

公开(公告)日：2014-12-09

申请号：US12966220

申请日：2010-12-13

Applicant: Jin Wu ,  Dante M. Pietrantoni ,  Yuhua Tong ,  David W. Martin

Inventor： Jin Wu ,  Dante M. Pietrantoni ,  Yuhua Tong ,  David W. Martin

IPC: B32B25/08 ,  B32B25/20 ,  B32B27/20 ,  B32B27/34 ,  G03G15/20

CPC classification number: G03G15/2053 ,  G03G2215/2019 ,  G03G2215/2041 ,  Y10T428/3154 ,  Y10T428/31663 ,  Y10T428/31721

Abstract: The present teachings provide a fuser member. The fuser member includes a substrate layer comprising a polyamideimide/polybenzimidazole polymer blend. A method of manufacturing the fuser member is described.

Abstract translation: 本教导提供定影器构件。 定影器构件包括包含聚酰胺酰亚胺/聚苯并咪唑聚合物共混物的基底层。 描述了一种制造定影部件的方法。

公开(公告)号：US08901257B2

公开(公告)日：2014-12-02

申请号：US13026249

申请日：2011-02-12

Applicant: Jin Wu

Inventor： Jin Wu

IPC: C08G75/20 ,  C08G75/23 ,  C08G73/10 ,  C08G73/12 ,  G03G15/16 ,  B28B7/30 ,  C08J5/20

CPC classification number: G03G15/162 ,  B28B7/30 ,  C08J5/18 ,  C08J5/20 ,  C08J2381/06 ,  C08J2479/08

Abstract: Flexible members for use in imaging devices comprise a polyphenylsulfone and a polyetherimide; and optionally, a polysiloxane surfactant.

Abstract translation: 用于成像装置的柔性构件包括聚苯砜和聚醚酰亚胺; 和任选的聚硅氧烷表面活性剂。

公开(公告)号：US08840998B2

公开(公告)日：2014-09-23

申请号：US11939776

申请日：2007-11-14

Applicant: Liang-Bih Lin ,  David H. Pan ,  Daniel Levy ,  Jin Wu

Inventor： Liang-Bih Lin ,  David H. Pan ,  Daniel Levy ,  Jin Wu

IPC: G03G15/02 ,  C08K3/04 ,  G03G21/00 ,  G03G15/20

CPC classification number: G03G15/0233 ,  B82Y30/00 ,  B82Y40/00 ,  G03G15/0291 ,  G03G15/2057 ,  G03G21/0017 ,  G03G21/0035 ,  G03G21/0058 ,  G03G2215/021 ,  G03G2215/027 ,  G03G2215/028 ,  Y10S977/932 ,  Y10T428/31504

Abstract: An electrophotographic imaging device includes a charging device, a cleaning device, and a fuser member that each include hydrophobic carbon nanotubes. The use of hydrophobic carbon nanotubes can increases the charging device's, the cleaning device's, and the fuser member's durability, conductivity, and contaminants deposition.

Abstract translation: 电子照相成像装置包括充电装置，清洁装置和定影器构件，其各自包括疏水性碳纳米管。 使用疏水性碳纳米管可以增加充电装置，清洁装置和定影器构件的耐久性，导电性和污染物沉积。

公开(公告)号：US08802766B2

公开(公告)日：2014-08-12

申请号：US12965264

申请日：2010-12-10

Applicant: Yuhua Tong ,  Dante M. Pietrantoni ,  Jin Wu

Inventor： Yuhua Tong ,  Dante M. Pietrantoni ,  Jin Wu

IPC: G03G15/20

CPC classification number: G03G15/161 ,  C08G73/14 ,  G03G15/162

Abstract: An intermediate transfer member including a first supporting substrate layer, and a second layer of a silane-containing polyamideimide, and a filler component.

Abstract translation: 包括第一支撑基底层和含硅烷的聚酰胺酰亚胺的第二层和填料组分的中间转印部件。

公开(公告)号：US08765339B2

公开(公告)日：2014-07-01

申请号：US13601456

申请日：2012-08-31

Applicant: Jin Wu ,  Kenny-Tuan T. Dinh ,  Lanhui Zhang ,  Lin Ma

Inventor： Jin Wu ,  Kenny-Tuan T. Dinh ,  Lanhui Zhang ,  Lin Ma

IPC: G03G5/05

CPC classification number: G03G5/0614 ,  G03G5/0517 ,  G03G5/0539 ,  G03G5/0564

Abstract: The presently disclosed embodiments relate generally to layers that are useful in imaging apparatus members and components, for use in electrophotographic, including digital printing, apparatuses. More particularly, the embodiments pertain to an improved electrophotographic imaging member comprising a charge transport layer comprising a novel combination of a tetraaryl polycarbonate copolymer binder and perfluorinated fillers. The present charge transport layer provides reduced wear rate and long service life.

Abstract translation: 目前公开的实施例一般涉及可用于成像装置构件和部件中用于电子照相（包括数字印刷，装置）的层。 更具体地，实施方案涉及改进的电子照相成像构件，其包括电荷输送层，其包含四芳基聚碳酸酯共聚物粘合剂和全氟化填料的新型组合。 本电荷传输层提供降低的磨损率和长的使用寿命。

公开(公告)号：US08736039B2

公开(公告)日：2014-05-27

申请号：US11539481

申请日：2006-10-06

Applicant: Weng-Jin Wu ,  Wen-Chih Chiou ,  Chen-Hua Yu

Inventor： Weng-Jin Wu ,  Wen-Chih Chiou ,  Chen-Hua Yu

IPC: H01L23/22

CPC classification number: H01L21/78 ,  H01L23/585 ,  H01L25/0657 ,  H01L2225/06513 ,  H01L2225/06527 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A stacked structure includes a first die bonded over a second die. The first die has a first die area defined over a first surface. At least one first protective structure is formed over the first surface, around the first die area. At least one side of the first protective structure has at least one first extrusion part extending across a first scribe line around the protective structure. The second die has a second die area defined over a second surface. At least one second protective structure is formed over the second surface, around the second die area. At least one side of the second protective structure has at least one second extrusion part extending across a second scribe line around the protective structure, wherein the first extrusion part is connected with the second extrusion part.

Abstract translation: 层叠结构包括在第二管芯上结合的第一管芯。 第一管芯具有限定在第一表面上的第一管芯区域。 在第一表面，围绕第一模具区域形成至少一个第一保护结构。 第一保护结构的至少一侧具有至少一个在保护结构周围延伸穿过第一划线的第一挤压部分。 第二模具具有限定在第二表面上的第二模具区域。 在第二表面上围绕第二管芯区域形成至少一个第二保护结构。 第二保护结构的至少一侧具有至少一个在保护结构周围延伸穿过第二划线的第二挤压部分，其中第一挤压部分与第二挤压部分连接。