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    Cvd method and device for forming silicon-containing insulation film
    1.
    发明申请
    Cvd method and device for forming silicon-containing insulation film 有权
    Cvd方法和用于形成含硅绝缘膜的装置

    公开(公告)号：US20050095770A1

    公开(公告)日：2005-05-05

    申请号：US10500150

    申请日：2003-01-14

    申请人： Takeshi Kumagai ,  Hitoshi Katoh ,  Jinsu Lee ,  Shingo Maku

    发明人： Takeshi Kumagai ,  Hitoshi Katoh ,  Jinsu Lee ,  Shingo Maku

    IPC分类号： C23C16/30 ,  C23C16/34 ,  C23C16/40 ,  C23C16/452 ,  H01L21/8238

    CPC分类号： C23C16/45561 ,  C23C16/308 ,  C23C16/345 ,  C23C16/40 ,  C23C16/401 ,  C23C16/452

    摘要： A CVD apparatus (2) forms an insulating film, which is a silicon oxide film, silicon nitride film, or silicon oxynitride film. The CVD apparatus includes a process chamber (8) to accommodate a target substrate (W), a support member (20) to support the target substrate in the process chamber, a heater (12) to heat the target substrate supported by the support member, an exhaust section (39) to vacuum-exhaust the process chamber, and a supply section (40) to supply a gas into the process chamber. The supply section includes a first circuit (42) to supply a first gas of a silane family gas, a second circuit (44) to supply a second gas, which is an oxidizing gas, nitriding gas, or oxynitriding gas, and a third circuit (46) to supply a third gas of a carbon hydride gas, and can supply the first, second, and third gases together.

    摘要翻译： CVD装置（2）形成作为氧化硅膜，氮化硅膜或氮氧化硅膜的绝缘膜。 CVD装置包括：容纳目标基板（W）的处理室（8）;将处理室中的目标基板支撑的支撑构件（20）;加热器（12），用于加热由支撑构件支撑的目标基板 ，用于对处理室进行真空排气的排气部（39），以及向处理室供给气体的供给部（40）。 供给部包括供给硅烷族气体的第一气体的第一回路（42），供给作为氧化气体的第二气体的第二回路（44），氮化气体或氮氧化气体，以及第三回路 （46）供应碳氢化合物气体的第三气体，并且可以将第一，第二和第三气体供应在一起。

    CVD method and device for forming silicon-containing insulation film
    2.
    发明授权
    CVD method and device for forming silicon-containing insulation film 有权
    CVD方法和用于形成含硅绝缘膜的装置

    公开(公告)号：US07125812B2

    公开(公告)日：2006-10-24

    申请号：US10500150

    申请日：2003-01-14

    申请人： Takeshi Kumagai ,  Hitoshi Katoh ,  Jinsu Lee ,  Shingo Maku

    发明人： Takeshi Kumagai ,  Hitoshi Katoh ,  Jinsu Lee ,  Shingo Maku

    IPC分类号： H01L21/31

    CPC分类号： C23C16/45561 ,  C23C16/308 ,  C23C16/345 ,  C23C16/40 ,  C23C16/401 ,  C23C16/452

    摘要： A CVD apparatus (2) forms an insulating film, which is a silicon oxide film, silicon nitride film, or silicon oxynitride film. The CVD apparatus includes a process chamber (8) to accommodate a target substrate (W), a support member (20) to support the target substrate in the process chamber, a heater (12) to heat the target substrate supported by the support member, an exhaust section (39) to vacuum-exhaust the process chamber, and a supply section (40) to supply a gas into the process chamber. The supply section includes a first circuit (42) to supply a first gas of a silane family gas, a second circuit (44) to supply a second gas, which is an oxidizing gas, nitriding gas, or oxynitriding gas, and a third circuit (46) to supply a third gas of a carbon hydride gas, and can supply the first, second, and third gases together.

    摘要翻译： CVD装置（2）形成作为氧化硅膜，氮化硅膜或氮氧化硅膜的绝缘膜。 CVD装置包括：容纳目标基板（W）的处理室（8）;将处理室中的目标基板支撑的支撑构件（20）;加热器（12），用于加热由支撑构件支撑的目标基板 ，用于对处理室进行真空排气的排气部（39），以及向处理室供给气体的供给部（40）。 供给部包括供给硅烷族气体的第一气体的第一回路（42），供给作为氧化气体的第二气体的第二回路（44），氮化气体或氮氧化气体，以及第三回路 （46）供应碳氢化合物气体的第三气体，并且可以将第一，第二和第三气体供应在一起。

    Mobile terminal
    4.
    发明授权
    Mobile terminal 有权
    移动终端

    公开(公告)号：US08767407B2

    公开(公告)日：2014-07-01

    申请号：US13244277

    申请日：2011-09-24

    申请人： Gukchan Lim ,  Hyokune Hwang ,  Hyunok Lee ,  Jungwoo Sohn ,  Jinsu Lee ,  Taejong Jeong ,  Dongsu Han ,  Yongheon He ,  Hongjo Shim

    发明人： Gukchan Lim ,  Hyokune Hwang ,  Hyunok Lee ,  Jungwoo Sohn ,  Jinsu Lee ,  Taejong Jeong ,  Dongsu Han ,  Yongheon He ,  Hongjo Shim

    IPC分类号： H05K5/00

    CPC分类号： H05K9/0028

    摘要： A mobile terminal includes a main body; at least one circuit board placed in the main body and comprising an upper surface, a lower surface, and at least one lateral surface; at least one conductive body disposed at the at least one lateral surface of the at least one circuit board and electrically connected to a ground of the at least one circuit board; and at least one shield member mounted on the at least one circuit board. The at least one shield member includes a base portion formed to cover at least part of the upper surface or the lower surface of the at least one circuit board and at least one protrusion portion protruded from the base portion and formed to be electrically in contact with the at least one conductive body.

    摘要翻译： 移动终端包括主体; 放置在主体中的至少一个电路板包括上表面，下表面和至少一个侧表面; 至少一个导电体，设置在所述至少一个电路板的所述至少一个侧表面上并电连接到所述至少一个电路板的接地; 以及安装在所述至少一个电路板上的至少一个屏蔽构件。 所述至少一个屏蔽构件包括形成为覆盖所述至少一个电路板的上表面或下表面的至少一部分的基部和从所述基部突出的至少一个突出部，并形成为与 所述至少一个导电体。

    Printed circuit board assembly for a mobile terminal and method for fabricating the same
    5.
    发明授权
    Printed circuit board assembly for a mobile terminal and method for fabricating the same 有权
    用于移动终端的印刷电路板组件及其制造方法

    公开(公告)号：US08842443B2

    公开(公告)日：2014-09-23

    申请号：US13228357

    申请日：2011-09-08

    申请人： Gukchan Lim ,  Seehyung Lee ,  Kun Joo ,  Sangmo Park ,  Jinsu Lee ,  Dongchul Jin ,  Sooyoul Yang ,  Yoonho Kim

    发明人： Gukchan Lim ,  Seehyung Lee ,  Kun Joo ,  Sangmo Park ,  Jinsu Lee ,  Dongchul Jin ,  Sooyoul Yang ,  Yoonho Kim

    IPC分类号： H04N1/03

    CPC分类号： H05K1/141 ,  H05K1/144 ,  H05K2201/047

    摘要： A printed circuit board (PCB) assembly includes a main PCB, a body PCB and a cover PCB. The main PCB has a first electronic component mounted thereon. The body PCB is mounted on the main PCB and includes a cavity therethrough. The first electronic component is positioned within the cavity when the body PCB is mounted on the main PCB. The cover PCB is aligned and mounted on the body PCB to cover the cavity. The cover PCB has a second electronic component mounted on a surface thereof. When the cover PCB is mounted on the body PCB, the second electronic component is positioned within the cavity and faces the main PCB. A method of fabricating the PCB assembly and a mobile terminal including the PCB assembly are also provided.

    摘要翻译： 印刷电路板（PCB）组件包括主PCB，主体PCB和盖PCB。 主PCB具有安装在其上的第一电子部件。 主体PCB安装在主PCB上并且包括穿过其中的空腔。 当主体PCB安装在主PCB上时，第一个电子元件位于腔内。 盖PCB对准并安装在主体PCB上以覆盖空腔。 盖PCB具有安装在其表面上的第二电子部件。 当盖PCB安装在主体PCB上时，第二电子部件位于空腔内并面向主PCB。 还提供了制造PCB组件的方法和包括PCB组件的移动终端。

    PRINTED CIRCUIT BOARD ASSEMBLY FOR A MOBILE TERMINAL AND METHOD FOR FABRICATING THE SAME
    7.
    发明申请
    PRINTED CIRCUIT BOARD ASSEMBLY FOR A MOBILE TERMINAL AND METHOD FOR FABRICATING THE SAME 有权
    用于移动终端的印刷电路板组件及其制造方法

    公开(公告)号：US20120243195A1

    公开(公告)日：2012-09-27

    申请号：US13228357

    申请日：2011-09-08

    申请人： Gukchan Lim ,  Seehyung Lee ,  Kun Joo ,  Sangmo Park ,  Jinsu Lee ,  Dongchul Jin ,  Sooyoul Yang ,  Yoonho Kim

    发明人： Gukchan Lim ,  Seehyung Lee ,  Kun Joo ,  Sangmo Park ,  Jinsu Lee ,  Dongchul Jin ,  Sooyoul Yang ,  Yoonho Kim

    IPC分类号： H05K1/14 ,  H05K1/18

    CPC分类号： H05K1/141 ,  H05K1/144 ,  H05K2201/047

    摘要： A printed circuit board (PCB) assembly includes a main PCB, a body PCB and a cover PCB. The main PCB has a first electronic component mounted thereon. The body PCB is mounted on the main PCB and includes a cavity therethrough. The first electronic component is positioned within the cavity when the body PCB is mounted on the main PCB. The cover PCB is aligned and mounted on the body PCB to cover the cavity. The cover PCB has a second electronic component mounted on a surface thereof. When the cover PCB is mounted on the body PCB, the second electronic component is positioned within the cavity and faces the main PCB. A method of fabricating the PCB assembly and a mobile terminal including the PCB assembly are also provided.

    摘要翻译： 印刷电路板（PCB）组件包括主PCB，主体PCB和盖PCB。 主PCB具有安装在其上的第一电子部件。 主体PCB安装在主PCB上并且包括穿过其中的空腔。 当主体PCB安装在主PCB上时，第一个电子元件位于腔内。 盖PCB对准并安装在主体PCB上以覆盖空腔。 盖PCB具有安装在其表面上的第二电子部件。 当盖PCB安装在主体PCB上时，第二电子部件位于空腔内并面向主PCB。 还提供了制造PCB组件的方法和包括PCB组件的移动终端。

    MOBILE TERMINAL
    8.
    发明申请
    MOBILE TERMINAL 有权
    移动终端

    公开(公告)号：US20120147573A1

    公开(公告)日：2012-06-14

    申请号：US13244277

    申请日：2011-09-24

    申请人： Gukchan Lim ,  Hyokune Hwang ,  Hyunok Lee ,  Jungwoo Sohn ,  Jinsu Lee ,  Taejong Jeong ,  Dongsu Han ,  Yongheon He ,  Hongjo Shim

    发明人： Gukchan Lim ,  Hyokune Hwang ,  Hyunok Lee ,  Jungwoo Sohn ,  Jinsu Lee ,  Taejong Jeong ,  Dongsu Han ,  Yongheon He ,  Hongjo Shim

    IPC分类号： H05K5/02

    CPC分类号： H05K9/0028

    摘要： A mobile terminal includes a main body; at least one circuit board placed in the main body and comprising an upper surface, a lower surface, and at least one lateral surface; at least one conductive body disposed at the at least one lateral surface of the at least one circuit board and electrically connected to a ground of the at least one circuit board; and at least one shield member mounted on the at least one circuit board. The at least one shield member includes a base portion formed to cover at least part of the upper surface or the lower surface of the at least one circuit board and at least one protrusion portion protruded from the base portion and formed to be electrically in contact with the at least one conductive body.

    摘要翻译： 移动终端包括主体; 放置在主体中的至少一个电路板包括上表面，下表面和至少一个侧表面; 至少一个导电体，设置在所述至少一个电路板的所述至少一个侧表面上并电连接到所述至少一个电路板的接地; 以及安装在所述至少一个电路板上的至少一个屏蔽构件。 所述至少一个屏蔽构件包括形成为覆盖所述至少一个电路板的上表面或下表面的至少一部分的基部和从所述基部突出的至少一个突出部，并形成为与 所述至少一个导电体。