摘要:
A method, system, and apparatus for cooling one or more devices through use of a cooling plate. An example system includes multiple heat generating devices coupled to a cooling plate, each through an individual thermal interface unit. The thermal interface unit includes a compressible solid pad with at least one surface having a plurality of projections carrying a flowable material. The thermal interface units are pressed between the heat generating devices and the cooling plate so that the flowable material is completely enclosed.
摘要:
A mechanism for electrically connecting a first electronic component to a second electronic component includes an actuating member disposed in the first electronic component including a first connector half and an actuation screw having a head and a threaded end. The actuation screw is located in the first electronic component wherein rotation of the actuation screw urges the actuating member in a direction substantially perpendicular to an axis of the actuation screw thereby engaging the first connector half to a second connector half disposed in the second electronic component.
摘要:
A mechanism for electrically connecting a first electronic component to a second electronic component. The mechanism includes an actuating member disposed in the first electronic component including a first connector half and an actuation screw having a head and a threaded end. The actuation screw is located in the first electronic component wherein rotation of the actuation screw urges the actuating member in a direction substantially perpendicular to an axis of the actuation screw thereby engaging the first connector half to a second connector half disposed in the second electronic component. A method for electrically connecting a first electronic component to a second electronic component includes rotating an actuation screw disposed in the first electronic component and in operable communication with an actuating member disposed in the first electronic component, the actuating member including a first connector half. The actuating member is urged in a direction substantially perpendicular to an axis of the actuation screw by the rotation of the actuation screw and the first connector half is engaged to a second connector half disposed in the second electronic component.
摘要:
An actuation assembly and method is provided for mating electronic unto a computer rack comprising a main housing engageably securable to a slide assembly. The slide assembly is capable of being secured to a side of the computer rack and having sliding features such that the slide assembly and the main housing when engaged can be telescoped out or returned to a closed position. The main housing having a vertical wedge for securing said assembly to said rack more securely and a drive wedge for moving the vertical wedge such that it can telescope into and out of said rack with said slide mechanism via a lead screw.
摘要:
An apparatus for extracting and inserting a circuit card into a socket, the apparatus includes a tool device releasably mountable to opposing sides defining the circuit card. The tool device includes a pair of frame members having a friction fit feature for attachment to the opposing side edges defining the circuit card; and a sliding plane translatable between the pair of frame members. Upward translation of the sliding plane relative to the fixed pair of frame members acts to release latches on the connector to extract the circuit card from the connector upon upward translation of the pair of frame members, and downward translation of the sliding plane relative to the fixed pair of frame members acts to transfer a force to the circuit card, thereby inserting the circuit card with the connector. The apparatus further includes a tool guide having two members opposing each other, each member including a plurality of slots, each configured to guide a respective edge of the tool device therethrough for alignment with the connector.
摘要:
A connector system includes a first connector assembly that is electrically connected to wiring on a first printed wiring board and a second connector assembly that is electrically connected to wiring on a second printed wiring board. Each connector assembly includes a number of connector modules that are joined together in a predetermined array such as a row. In one of the connector assemblies, the row also includes one or more actuation modules. The actuation module or modules are engaged by an actuator mechanism to force the connector assemblies into mating engagement or to draw them apart.
摘要:
A capping structure and capping method are presented for an electronics package having a substrate and one or more electronics devices disposed on the substrate. The capping structure includes a capping plate sized to cover the electronics device(s) disposed on the substrate, and two or more force transfer pins. The force transfer pins are disposed between the capping plate and the substrate so that when a force is applied to the capping plate or the substrate, the force is transferred therebetween via the force transfer pins. Various capping plate and pin configurations are presented.
摘要:
A multi-level interconnect apparatus includes a substrate including a substrate body having a first side and a second side opposite the first side, a processing unit disposed on the second side of the substrate body, a first input/output (I/O) unit disposed on the first side of the substrate body and configured to be electrically communicable with the processing unit along a thickness dimension of the substrate body and a second I/O unit disposed on the second side of the substrate body and configured to be electrically communicable with the processing unit along a planar dimension of the substrate body.
摘要:
A multi-level interconnect apparatus includes a substrate including a substrate body having a first side and a second side opposite the first side, a processing unit disposed on the second side of the substrate body, a first input/output (I/O) unit disposed on the first side of the substrate body and configured to be electrically communicable with the processing unit along a thickness dimension of the substrate body and a second I/O unit disposed on the second side of the substrate body and configured to be electrically communicable with the processing unit along a planar dimension of the substrate body.
摘要:
A multi-chip electronic module includes a circuit board having a first end portion, a second end portion, a first surface portion and an opposing second surface portion. A plurality of electronic components is mounted to the first surface portion of the circuit board. A heat spreader member is supported at the first surface portion of the circuit board. The heat spreader includes a body having a first end, a second end, a first surface and a second surface. The first end portion and first end define a fluid inlet, and the second end portion and second end define a fluid outlet. The second surface is in thermal contact with the plurality of electronic components. The heat spreader member and circuit board define an enclosed fluid duct having a plurality of substantially parallel flow paths.