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    Process for making interconnect solder Pb-free bumps free from organo-tin/tin deposits on the wafer surface
    1.
    发明授权
    Process for making interconnect solder Pb-free bumps free from organo-tin/tin deposits on the wafer surface 有权
    制造互连焊锡的工艺无晶圆表面上无有机锡/锡沉积物的无铅凸点

    公开(公告)号：US07833897B2

    公开(公告)日：2010-11-16

    申请号：US11778678

    申请日：2007-07-17

    申请人： Sarah H. Knickerbocker ,  Sean A. Allen ,  John J. Garant ,  Jerry A. Gorrell ,  Phillip W Palmatier ,  Christopher L Tessler

    发明人： Sarah H. Knickerbocker ,  Sean A. Allen ,  John J. Garant ,  Jerry A. Gorrell ,  Phillip W Palmatier ,  Christopher L Tessler

    IPC分类号： H01L21/44 ,  H01L21/00 ,  B23K31/00 ,  B23K31/02

    CPC分类号： B23K3/0623 ,  B23K2101/40

    摘要： A method is provided for making of interconnect solder bumps on a wafer or other electronic device without depositing any significant amount of tin or other solder component from the solder onto the wafer surface which tin can cause shorts or other defects in the wafer. The method is particularly useful for well-known C4NP interconnect technology. In one aspect of the invention, a reducing gas flow rate is used to remove oxides from the solder surfaces and wafer pad surfaces and is of a sufficient determined or pre-determined flow and/or chamber or mold/wafer spacing to provide a gas velocity across the solder surfaces and wafer pad surfaces so that Sn or other contaminants do not deposit on the wafer surface during solder transfer. In another aspect, the transfer contact is performed below the melting point of the solder and subsequently heated to above the melting temperature while in transfer contact. The heated solder in contact with the wafer pads is transferred to the wafer pads.

    摘要翻译： 提供了一种用于在晶片或其他电子器件上制造互连焊料凸块的方法，而不会将任何显着量的锡或其他焊料组分从焊料沉积到晶片表面上，锡可能导致晶片中的短路或其它缺陷。 该方法对于众所周知的C4NP互连技术特别有用。 在本发明的一个方面，使用还原气体流速从焊料表面和晶片焊盘表面去除氧化物，并且具有足够的确定或预定的流动和/或室或模具/晶片间距以提供气体速度 穿过焊料表面和晶片焊盘表面，使得Sn或其他污染物在焊料传输期间不会沉积在晶片表面上。 在另一方面，转移接触在焊料的熔点之下进行，随后在转移接触的同时被加热至高于熔融温度。 与晶片焊盘接触的加热焊料被转移到晶片焊盘。

    Vacuum transition for solder bump mold filling
    3.
    发明授权
    Vacuum transition for solder bump mold filling 有权
    焊锡凸块模具填充的真空过渡

    公开(公告)号：US09498837B2

    公开(公告)日：2016-11-22

    申请号：US12551755

    申请日：2009-09-01

    申请人： John J. Garant ,  Robert G. Haas ,  Bouwe W. Leenstra ,  Phillip W. Palmatier

    发明人： John J. Garant ,  Robert G. Haas ,  Bouwe W. Leenstra ,  Phillip W. Palmatier

    IPC分类号： B23K31/02 ,  B23K35/12 ,  B23K3/06

    CPC分类号： B23K3/0623 ,  B23K2101/42

    摘要： A bond metal injection tool can include a fill head having a sealed chamber for containing a molten bond metal (e.g., solder) and a gas, and a nozzle for directing a flow of the molten bond metal into cavities in a major surface of a mold. A pressure control device can controllably apply pressure within the chamber to eject the bond metal from the nozzle into the cavities. The pressure control device may also controllably reduce a pressure within the chamber to inhibit the bond metal from being ejected from the nozzle, such as when the fill head is being moved onto the mold surface from a parking location or when the fill head is being moved off the mold surface onto a parking location.

    摘要翻译： 粘合金属注射工具可以包括具有用于容纳熔融粘合金属（例如焊料）和气体的密封室的填充头，以及用于将熔融粘合金属流引导到模具的主表面中的空腔中的喷嘴 。 压力控制装置可以可控制地在腔室内施加压力以将接合金属从喷嘴喷射到空腔中。 压力控制装置还可以可控制地减小腔室内的压力以阻止接合金属从喷嘴喷射，例如当填充头​​从停车位置移动到模具表面上时或当填充头被移动时 离开模具表面到停车位置。

    PROCESS FOR MAKING INTERCONNECT SOLDER Pb-FREE BUMPS FREE FROM ORGANO-TIN/TIN DEPOSITS ON THE WAFER SURFACE
    4.
    发明申请
    PROCESS FOR MAKING INTERCONNECT SOLDER Pb-FREE BUMPS FREE FROM ORGANO-TIN/TIN DEPOSITS ON THE WAFER SURFACE 有权
    制造互连焊接工艺的方法无铅焊锡从无机表面上的有机锡/锡沉积物

    公开(公告)号：US20090020590A1

    公开(公告)日：2009-01-22

    申请号：US11778678

    申请日：2007-07-17

    申请人： Sarah H. Knickerbocker ,  Sean A. Allen ,  John J. Garant ,  Jerry A. Gorrell ,  Phillip W Palmatier ,  Christopher L. Tessler

    发明人： Sarah H. Knickerbocker ,  Sean A. Allen ,  John J. Garant ,  Jerry A. Gorrell ,  Phillip W Palmatier ,  Christopher L. Tessler

    IPC分类号： B23K31/02

    CPC分类号： B23K3/0623 ,  B23K2101/40

    摘要： A method is provided for making of interconnect solder bumps on a wafer or other electronic device without depositing any significant amount of tin or other solder component from the solder onto the wafer surface which tin can cause shorts or other defects in the wafer. The method is particularly useful for well-known C4NP interconnect technology. In one aspect of the invention, a reducing gas flow rate is used to remove oxides from the solder surfaces and wafer pad surfaces and is of a sufficient determined or pre-determined flow and/or chamber or mold/wafer spacing to provide a gas velocity across the solder surfaces and wafer pad surfaces so that Sn or other contaminants do not deposit on the wafer surface during solder transfer. In another aspect, the transfer contact is performed below the melting point of the solder and subsequently heated to above the melting temperature while in transfer contact. The heated solder in contact with the wafer pads is transferred to the wafer pads.

    摘要翻译： 提供了一种用于在晶片或其他电子器件上制造互连焊料凸块的方法，而不会将任何显着量的锡或其他焊料组分从焊料沉积到晶片表面上，锡可能导致晶片中的短路或其它缺陷。 该方法对于众所周知的C4NP互连技术特别有用。 在本发明的一个方面，使用还原气体流速从焊料表面和晶片焊盘表面去除氧化物，并且具有足够的确定或预定的流动和/或室或模具/晶片间距以提供气体速度 穿过焊料表面和晶片焊盘表面，使得Sn或其他污染物在焊料传输期间不会沉积在晶片表面上。 在另一方面，转移接触在焊料的熔点之下进行，随后在转移接触的同时被加热至高于熔融温度。 与晶片焊盘接触的加热焊料被转移到晶片焊盘。

    VACUUM TRANSITION FOR SOLDER BUMP MOLD FILLING
    8.
    发明申请
    VACUUM TRANSITION FOR SOLDER BUMP MOLD FILLING 有权
    真空过滤器用于焊接模具填充

    公开(公告)号：US20110049759A1

    公开(公告)日：2011-03-03

    申请号：US12551755

    申请日：2009-09-01

    申请人： John J. Garant ,  Robert G. Haas ,  Bouwe W. Leenstra ,  Phillip W. Palmatier

    发明人： John J. Garant ,  Robert G. Haas ,  Bouwe W. Leenstra ,  Phillip W. Palmatier

    IPC分类号： B29C45/14 ,  B29C45/77

    CPC分类号： B23K3/0623 ,  B23K2101/42

    摘要： A bond metal injection tool can include a fill head having a sealed chamber for containing a molten bond metal (e.g., solder) and a gas, and a nozzle for directing a flow of the molten bond metal into cavities in a major surface of a mold. A pressure control device can controllably apply pressure within the chamber to eject the bond metal from the nozzle into the cavities. The pressure control device may also controllably reduce a pressure within the chamber to inhibit the bond metal from being ejected from the nozzle, such as when the fill head is being moved onto the mold surface from a parking location or when the fill head is being moved off the mold surface onto a parking location.

    摘要翻译： 粘合金属注射工具可以包括具有用于容纳熔融粘合金属（例如焊料）和气体的密封室的填充头，以及用于将熔融粘合金属流引导到模具的主表面中的空腔中的喷嘴 。 压力控制装置可以可控制地在腔室内施加压力以将接合金属从喷嘴喷射到空腔中。 压力控制装置还可以可控制地减小腔室内的压力以阻止接合金属从喷嘴喷射，例如当填充头​​从停车位置移动到模具表面上时或当填充头被移动时 离开模具表面到停车位置。