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    CVD of metals capable of receiving nickel or alloys thereof using inert contact
    1.
    发明授权
    CVD of metals capable of receiving nickel or alloys thereof using inert contact 失效
    能够使用惰性接触来接收镍的金属或其合金的CVD

    公开(公告)号：US06569496B1

    公开(公告)日：2003-05-27

    申请号：US09050491

    申请日：1998-03-30

    申请人： Donald Rene Wall ,  John Joseph Garant ,  Kevin Michael Prettyman ,  Srinivasa S. N. Reddy

    发明人： Donald Rene Wall ,  John Joseph Garant ,  Kevin Michael Prettyman ,  Srinivasa S. N. Reddy

    IPC分类号： C23C1608

    CPC分类号： H01L21/28556 ,  C23C16/14 ,  C23C16/44

    摘要： The present invention discloses a CVD (Chemical Vapor Deposition) process where nickel or alloys thereof, such as, Ni/Cu, Ni/Co, are deposited on metal surfaces which are capable of receiving nickel or alloys thereof, using an Iodide source, preferably an Iodide salt, such as, Ammonium Iodide or Copper Iodide, with at least one inert stand-off in contact with the receiving metal surface. This invention basically allows the CVD of nickel (Ni) on molybdenum (Mo) or tungsten (W) where the nickel source is physically isolated from the refractory metal surface to be plated using at least one inert material that is in floating contact with the refractory metal surface that needs to be coated with at least one layer of nickel or alloy thereof.

    摘要翻译： 本发明公开了一种CVD（化学气相沉积）方法，其中镍或其合金，例如Ni / Cu，Ni / Co沉积在能够使用碘化物源，能够接收镍或其合金的金属表面上，优选地 碘化物盐，例如碘化铵或碘化铜，至少有一个与接收金属表面接触的惰性隔离物。 本发明基本上允许镍（Ni）在钼（Mo）或钨（W）上的CVD，其中镍源与耐火金属表面物理隔离）使用至少一种与耐火材料浮动接触的惰性材料进行电镀 需要涂覆至少一层镍或其合金的金属表面。

    CVD of metals capable of receiving nickel or alloys thereof using inert contact
    2.
    发明授权
    CVD of metals capable of receiving nickel or alloys thereof using inert contact 失效
    能够使用惰性接触来接收镍的金属或其合金的CVD

    公开(公告)号：US06224682B1

    公开(公告)日：2001-05-01

    申请号：US09489976

    申请日：2000-01-21

    申请人： Donald Rene Wall ,  John Joseph Garant ,  Kevin Michael Prettyman ,  Srinivasa S. N. Reddy

    发明人： Donald Rene Wall ,  John Joseph Garant ,  Kevin Michael Prettyman ,  Srinivasa S. N. Reddy

    IPC分类号： C23C1600

    CPC分类号： H01L21/28556 ,  C23C16/14 ,  C23C16/44

    摘要： The present invention discloses a CVD (Chemical Vapor Deposition) process where nickel or alloys thereof, such as, Ni/Cu, Ni/Co, are deposited on metal surfaces which are capable of receiving nickel or alloys thereof, using an Iodide source, preferably an Iodide salt, such as, Ammonium Iodide or Copper Iodide, with at least one inert stand-off in contact with the receiving metal surface. This invention basically allows the CVD of nickel (Ni) on molybdenum (Mo) or tungsten (W) where the nickel source is physically isolated from the refractory metal surface to be plated using at least one inert material that is in floating contact with the refractory metal surface that needs to be coated with at least one layer of nickel or alloy thereof.

    摘要翻译： 本发明公开了一种CVD（化学气相沉积）方法，其中镍或其合金，例如Ni / Cu，Ni / Co沉积在能够使用碘化物源，能够接收镍或其合金的金属表面上，优选地 碘化物盐，例如碘化铵或碘化铜，至少有一个与接收金属表面接触的惰性隔离物。 本发明基本上允许镍（Ni）在钼（Mo）或钨（W）上的CVD，其中镍源与耐火金属表面物理隔离）使用至少一种与耐火材料浮动接触的惰性材料进行电镀 需要涂覆至少一层镍或其合金的金属表面。