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    LED CHIP PACKAGE STRUCTURE
    1.
    发明申请
    LED CHIP PACKAGE STRUCTURE 审中-公开
    LED芯片包装结构

    公开(公告)号：US20120001203A1

    公开(公告)日：2012-01-05

    申请号：US13235585

    申请日：2011-09-19

    申请人： BILY WANG ,  JONNIE CHUANG ,  WEN-KUEI WU

    发明人： BILY WANG ,  JONNIE CHUANG ,  WEN-KUEI WU

    IPC分类号： H01L27/15 ,  H01L33/50

    CPC分类号： G02B6/0073 ,  F21K9/00 ,  H01L25/0753 ,  H01L2924/0002 ,  H01L2924/00

    摘要： A LED chip package structure includes a substrate unit, a light-emitting unit, and a package unit. The substrate unit includes a strip substrate body. The light-emitting unit includes a plurality of LED chips disposed on the strip substrate body and electrically connected to the strip substrate body. The package unit includes a strip package colloid body disposed on the strip substrate body to cover the LED chips, wherein the strip package colloid body has an exposed top surface and an exposed surrounding peripheral surface connected between the exposed top surface and the strip substrate body, and the strip package colloid body has at least one exposed lens portion projected upwardly from the exposed top surface thereof and corresponding to the LED chips. Hence, light beams generated by the LED chips pass through the strip package colloid body to form a strip light-emitting area on the strip package colloid body.

    摘要翻译： LED芯片封装结构包括基板单元，发光单元和封装单元。 基板单元包括带状基板主体。 发光单元包括设置在带状基板主体上并电连接到带状基板主体的多个LED芯片。 包装单元包括：带状包装胶体，其设置在带状基材主体上以覆盖LED芯片，其中带状包装胶体具有暴露的顶表面和连接在暴露的顶表面和带状基片主体之间的暴露的外围表面， 并且带状包装胶体具有从其暴露的顶表面向上突出并对应于LED芯片的至少一个露出的透镜部分。 因此，由LED芯片产生的光束通过条带封装胶体，在带状封装胶体上形成带状发光区域。

    Mold structure for packaging LED chips and method thereof
    2.
    发明授权
    Mold structure for packaging LED chips and method thereof 有权
    包装LED芯片的模具结构及其方法

    公开(公告)号：US07803641B2

    公开(公告)日：2010-09-28

    申请号：US11854066

    申请日：2007-09-12

    申请人： Bily Wang ,  Jonnie Chuang ,  Hui-Yen Huang

    发明人： Bily Wang ,  Jonnie Chuang ,  Hui-Yen Huang

    IPC分类号： H01L21/66 ,  H01L21/00

    CPC分类号： H01L21/565 ,  H01L21/561 ,  H01L2224/97 ,  H01L2224/85

    摘要： A mold structure for packaging LED chips includes a top mold and a bottom mold. The bottom mold is mated with the top mold. The bottom mold has a main flow channel, a plurality of receiving spaces formed beside the main flow channel, a plurality of secondary flow channels for respectively and transversely communicating the receiving spaces with each other, and a plurality of ejection pins penetrating through the bottom mold.

    摘要翻译： 用于封装LED芯片的模具结构包括顶模和底模。 底模与上模相配。 底模具有主流道，在主流路旁边形成有多个接收空间，分别形成多个用于使接收空间相互横向连通的二次流动通道，以及贯穿底模的多个排出销 。

    LED chip package structure with a plurality of thick guiding pins and a method for manufacturing the same
    4.
    发明授权
    LED chip package structure with a plurality of thick guiding pins and a method for manufacturing the same 有权
    具有多个厚引导针的LED芯片封装结构及其制造方法

    公开(公告)号：US07671374B2

    公开(公告)日：2010-03-02

    申请号：US11861757

    申请日：2007-09-26

    申请人： Bily Wang ,  Jonnie Chuang ,  Hui-Yen Huang

    发明人： Bily Wang ,  Jonnie Chuang ,  Hui-Yen Huang

    IPC分类号： H01L29/205 ,  H01L23/495

    CPC分类号： H01L25/0753 ,  H01L24/97 ,  H01L33/483 ,  H01L33/62 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/97 ,  H01L2924/01082 ,  H01L2924/12041 ,  H01L2224/85 ,  H01L2924/00014

    摘要： An LED chip package structure with thick guiding pin includes a plurality of conductive pins separated from each other, an insulative casing, a plurality of LED chips, and a packaging colloid. The insulative casing covers a bottom side of each conductive pin to form an injection concave groove for exposing a top surface of each conductive pin. Two lateral sides of each conductive pin are extended outward from the insulative casing. The LED chips are arranged in the injection concave groove, and each LED chip has a positive electrode side and a negative electrode side respectively and electrically connected with different conductive pins. In addition, the packaging colloid is filled into the injection concave groove for covering the LED chips.

    摘要翻译： 具有厚引导针的LED芯片封装结构包括彼此分离的多个导电引脚，绝缘壳体，多个LED芯片和封装胶体。 绝缘壳体覆盖每个导电销的底侧，以形成用于暴露每个导电销的顶表面的注入凹槽。 每个导电针的两个侧面从绝缘壳体向外延伸。 LED芯片布置在注入凹槽中，并且每个LED芯片分别具有正极侧和负极侧，并且与不同的导电针电连接。 此外，将包装胶体填充到用于覆盖LED芯片的注入凹槽中。

    MANUFACTURING METHOD OF WHITE LIGHT LED AND STRUCTURE THEREOF
    6.
    发明申请
    MANUFACTURING METHOD OF WHITE LIGHT LED AND STRUCTURE THEREOF 审中-公开
    白光LED及其结构的制造方法

    公开(公告)号：US20080246397A1

    公开(公告)日：2008-10-09

    申请号：US11696220

    申请日：2007-04-04

    申请人： Bily Wang ,  Jonnie Chuang ,  Chia-Hung Chen

    发明人： Bily Wang ,  Jonnie Chuang ,  Chia-Hung Chen

    IPC分类号： H01J99/00 ,  H01J9/26

    CPC分类号： H01L33/505 ,  H01L33/486 ,  H01L33/507 ,  H01L33/52 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

    摘要： A manufacturing method of white light LED and a structure thereof include first, a substrate being prepared to be formed as a consecutively connected holder, on a first electrode of which non-conductive fluorescent glue is coated to form a fluorescent layer, on which a blue light chip is fixed; second, two conducting wires being welded onto the chip and electrically connected to both the first electrode and the second electrode of the holder respectively, finally, glue body encapsulating the holder, the fluorescent layer, the chip, and the two conducting wires to form a photic zone, over which a frame body encloses; furthermore, a window being formed on the frame body and provided for making the photic zone exposed. When blue light chip is excited to generate blue light, which will further excite the fluorescent layer to emit yellow light, then both blue light and yellow light will be dispersed through the photic zone to generate a uniform light source, which may output light longitudinally and collectively, making the output power promoted notably and the lightness enhanced significantly.

    摘要翻译： 白光LED的制造方法及其结构首先在准备形成为连续保持器的基板上，在其上涂布非导电荧光胶的第一电极上形成荧光层，蓝色 光芯片固定; 第二，将两根导线焊接在芯片上，分别与保持器的第一电极和第二电极两者电连接，最后将胶体封装在保持器，荧光层，芯片和两根导线上，形成 一个框架主体围绕着它; 此外，窗框形成在框架体上并被设置用于使光区暴露。 当蓝光芯片被激发以产生蓝光，这将进一步激发荧光层发出黄光，则蓝光和黄光将通过光区分散以产生均匀的光源，其可以纵向输出光， 共同推动输出功率显着提升，亮度明显增强。

    LED package structure for increasing light-emitting effiency and method of packaging the same
    7.
    发明申请
    LED package structure for increasing light-emitting effiency and method of packaging the same 有权
    LED封装结构，提高发光效率和封装方法

    公开(公告)号：US20080099778A1

    公开(公告)日：2008-05-01

    申请号：US11588399

    申请日：2006-10-27

    申请人： Bily Wang ,  Jonnie Chuang ,  Chi-Wen Hung

    发明人： Bily Wang ,  Jonnie Chuang ,  Chi-Wen Hung

    IPC分类号： H01L33/00 ,  G09F9/33

    CPC分类号： H01L33/56 ,  H01L25/167 ,  H01L33/505 ,  H01L33/54 ,  H01L2224/0554 ,  H01L2224/0557 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/16245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/00014 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

    摘要： An LED package structure for increasing light-emitting efficiency includes: a substrate unit, and a plurality of fluorescence colloid units, LED units, conductive units and opaque units. The substrate unit has a main body and a plurality of through holes passing through the main body. Each fluorescence colloid unit is received in the corresponding through hole and having an installed surface. Each LED unit has a light-emitting surface disposed on the corresponding fluorescence colloid unit and facing the installed surface of the corresponding fluorescence colloid units. Each conductive unit is electrically connected between each two electrode areas that have the same pole and are respectively arranged on each LED unit and the main body. Each opaque unit is disposed on two corresponding lateral faces of the main body for covering the installed surface of the corresponding fluorescence colloid unit, the corresponding LED unit, and the corresponding conductive units.

    摘要翻译： 用于提高发光效率的LED封装结构包括：基板单元和多个荧光胶体单元，LED单元，导电单元和不透明单元。 基板单元具有主体和穿过主体的多个通孔。 每个荧光胶体单元被接收在相应的通孔中并具有安装表面。 每个LED单元具有设置在相应的荧光胶体单元上并面对相应的荧光胶体单元的安装表面的发光表面。 每个导电单元电连接在具有相同极点并且分别布置在每个LED单元和主体上的每个两个电极区域之间。 每个不透明单元设置在主体的两个对应的侧面上，用于覆盖相应的荧光胶体单元的安装表面，相应的LED单元和相应的导电单元。

    Semiconductor substrate structure and processing method thereof
    8.
    发明授权
    Semiconductor substrate structure and processing method thereof 有权
    半导体衬底结构及其加工方法

    公开(公告)号：US07303984B2

    公开(公告)日：2007-12-04

    申请号：US11081527

    申请日：2005-03-17

    申请人： Bily Wang ,  Jonnie Chuang ,  Hui-Yen Huang

    发明人： Bily Wang ,  Jonnie Chuang ,  Hui-Yen Huang

    IPC分类号： H01L21/4763

    CPC分类号： H05K3/445 ,  H05K1/056 ,  H05K3/0052 ,  H05K2201/09881 ,  H05K2203/0228 ,  H05K2203/0278 ,  H05K2203/1536

    摘要： A semiconductor substrate structure includes a substrate having a trench formed thereon, a polymer composite material supplied into the trench and an electroplate conductive layer formed on the substrate. Further, a semiconductor substrate processing method includes the steps of: providing a substrate forming a trench thereon, supplying a polymer composite material into the trench, polishing a surface of the substrate and forming a covering material on the surface of the substrate. Therefore, the method is provided for combining the polymer composite material into the substrate, thereby to raise cutting precision and strength of the semiconductor substrate structure.

    摘要翻译： 半导体衬底结构包括其上形成有沟槽的衬底，提供到沟槽中的聚合物复合材料和形成在衬底上的电镀导电层。 此外，半导体衬底处理方法包括以下步骤：提供在其上形成沟槽的衬底，将聚合物复合材料供应到沟槽中，抛光衬底的表面并在衬底的表面上形成覆盖材料。 因此，提供了将聚合物复合材料组合到基板中的方法，从而提高半导体基板结构的切割精度和强度。