摘要:
A pneumatic dispenser (1) according to the present invention includes: a first plate (10) including a liquid supply unit (11), a first chamber (C1) connected to the liquid supply unit (11), and a liquid discharge unit (12) connected to the first chamber (C1), a flexible membrane (20) at least installed on the first chamber (C1) of the first plate (10) and establishing one side of the first chamber (C1), a second plate (30) including a second chamber (C2) at a side opposite to the first chamber (C1) while facing the first plate (10) with the flexible membrane (20) interposed there between and a bump (40) formed by protruding the liquid supply unit (11) toward the flexible membrane (20).
摘要:
A method of processing a superhydrophobic surface and a solid body having the superhydrophobic surface processed by the method are provided. The method includes orienting a spray nozzle of a particle sprayer toward a surface of a metal body, operating the particle sprayer to forming micro-scale protrusions and depressions on the surface of the metal body by spraying particles to the surface of the metal body, forming a plurality of nano-scale holes on the surface of the metal body by treating the metal body through an anodic oxidation process, forming a replica by immersing the metal body in a non-wetting polymer material and solidifying the non-wetting polymer material, and forming a superhydrophobic dual-scaled surface structure having nano-scale pillars formed on micro-scale protrusions and depressions by removing the metal body and an anodic oxide from the replica.
摘要:
A semiconductor package and a method for manufacturing the same. The semiconductor package includes a substrate having connection pads formed on one surface thereof, a semiconductor chip having bonding pads formed on one surface thereof to correspond to the connection pads; bumps for electrically connecting the connection pads and the bonding pads with each other, a coating layer located on exposed surface portions of the bonding pads and the connection pads to prevent voids from being formed in spaces between the substrate and the semiconductor chip, and an underfill member filled in the spaces over the coating layer.
摘要:
A method for forming roughness on an outer surface of cladding of a fuel nuclear rod including zirconium includes: positioning the cladding of the nuclear fuel rod at a first electrode and connecting a positive electrode thereto, and positioning a conductive plate at a second electrode and connecting a negative electrode thereto; putting the cladding of the nuclear fuel rod in an electrolyte solution; and applying voltage to the positive electrode and the negative electrode to cause oxidation on the outer surface of the cladding of the nuclear fuel rod. In this case, the electrolyte solution is maintained at 10° C. or lower.
摘要:
The present invention relates to a three-dimensional structure manufacturing method for performing surface treatment processes, and a replication step to provide hydrophobicity on an external surface of the three-dimensional structure. In the manufacturing method, the hydrophobicity may be provided to the external surface of the three-dimensional structure, a high cost device required in the conventional MEMS process is not used, the manufacturing cost is reduced, and the manufacturing process is simplified. In addition, it has been difficult to provide the hydrophobicity on an external surface of a three-dimensional structure having a large surface due to a spatial limitation, but in the exemplary embodiment of the present invention, the hydrophobicity may be provided to the external surface of the three-dimensional structure having a large surface, such as a torpedo, a submarine, a ship, and a vehicle, without the spatial limitation.
摘要:
The present invention relates to a method for manufacturing a solid body having a superhydrophobic surface structure formed by using a surface treatment of a metal body, a replication process, and a polymer sticking phenomenon to increase efficiency of fluid transfer and prevent foreign materials from being accumulated in the tube, and a superhydrophobic fluid transfer tube using the method. The superhydrophobic fluid transfer tube includes a fluid guider and a solid body provided on a fluid contact surface of the fluid guider and has micrometer-scaled unevenness and nanometer-scaled protrusions. In the method, a plurality of nanometer-scaled holes are formed on a surface of a metal body through an anodizing process, a replica is formed by immersing the metal body provided with the nanometer-scaled holes in a non-wetting polymer material and solidifying the non-wetting polymer material, the solid body having the superhydrophobic surface is formed by removing the metal body and an anode oxide from the replica, and the solid body is provided to a fluid contact surface of a fluid guider for guiding a fluid.
摘要:
An exemplary embodiment of the present invention relates to a cuvette of which an inner space thereof is easily cleansed while minimizing its inner space.A cuvette according to an exemplary embodiment of the present invention includes an upper portion having an inlet and forming a first inner space; a middle portion following the first inner space and forming a second inner space that is smaller than the first inner space; and a lower portion following the second inner space and forming a through hole having an interior diameter that is narrower than a cross-section of the second inner space.Accordingly, the through hole functions as a valve to stop the solution when the solution is divided to the inner space for the test, and after the test, the inlet is pressed such that the through hole functions as a nozzle when cleansing such that the solution may be exhausted therefrom.
摘要:
A method for fabricating a 3D (three-dimensional) structure is disclosed to provide hydrophobicity to a surface of a 3D structure by using a dipping method in which a predetermined-shaped structure is immersed in a molten metal solution. The method includes: immersing a predetermined-shaped structure in a molten metal solution to coat a molten metal material on the surface of the predetermined-shaped structure; anodizing a metal base coated with the molten metal material; coating a polymer material on an outer surface of the metal-coated base to form a negative replica structure; covering an outer surface of the negative replica structure with an outer formation material; and removing the metal-coated base from the negative replica structure and the outer formation material.
摘要:
A method for fabricating a 3D (three-dimensional) structure such that the 3D structure has a surface with hydrophobicity by using a metal foil such as an aluminum foil is disclosed. The method includes preparing a metal foil base by attaching a metal foil on an outer surface of a predetermined-shaped 3D structure; anodizing the metal foil base; coating a polymer material on the outer surface of the metal foil base material to form a negative replica structure; forming an outer structure by covering an outer surface of the negative replica structure with an outer formation material; and removing the metal foil base.
摘要:
A semiconductor package and a method for manufacturing the same. The semiconductor package includes a substrate having connection pads formed on one surface thereof, a semiconductor chip having bonding pads formed on one surface thereof to correspond to the connection pads; bumps for electrically connecting the connection pads and the bonding pads with each other, a coating layer located on exposed surface portions of the bonding pads and the connection pads to prevent voids from being formed in spaces between the substrate and the semiconductor chip, and an underfill member filled in the spaces over the coating layer.