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7 条记录 (耗时 0.011 秒)

    Contact assembly cleaning in an electrochemical mechanical processing apparatus
    1.
    发明申请
    Contact assembly cleaning in an electrochemical mechanical processing apparatus 审中-公开
    在电化学机械处理设备中接触组件清洁

    公开(公告)号：US20070084729A1

    公开(公告)日：2007-04-19

    申请号：US11251581

    申请日：2005-10-14

    申请人： Antoine Manens ,  Alain Duboust ,  Paul Butterfield ,  Ricardo Martinez ,  Yan Wang ,  Jose Salas-Vernis

    发明人： Antoine Manens ,  Alain Duboust ,  Paul Butterfield ,  Ricardo Martinez ,  Yan Wang ,  Jose Salas-Vernis

    IPC分类号： C25D21/06

    CPC分类号： C25F7/00 ,  B23H5/08 ,  B24B37/16 ,  B24B53/017

    摘要： Embodiments of the invention generally provide a method and apparatus for cleaning an electrical contact in an electrochemical mechanical planarizing apparatus. In one embodiment, a method for cleaning a contact assembly in an electroprocessing apparatus includes the steps of draining electrolyte from the contact assembly and flowing a rinsing fluid into the contact assembly. In another embodiment, a method for cleaning a contact assembly in an electroprocessing apparatus includes the steps of preventing fluid from passing between an interface of the contact assembly and a pad disposed outward thereof, flowing a rinsing fluid into the contact assembly and draining fluid flowing out of the contact assembly.

    摘要翻译： 本发明的实施例通常提供一种用于清洁电化学机械平面化装置中的电接触的方法和装置。 在一个实施例中，用于在电加工设备中清洁接触组件的方法包括以下步骤：从接触组件排出电解液并将冲洗流体流动到接触组件中。 在另一个实施例中，用于清洁电加工设备中的接触组件的方法包括以下步骤：防止流体在接触组件的界面和设置在其外部的垫片之间通过，将冲洗流体流动到接触组件中并排出流出的流体 的接触组件。

    Novel rinse solution to remove cross-contamination
    2.
    发明申请
    Novel rinse solution to remove cross-contamination 审中-公开
    新型冲洗液可以消除交叉污染

    公开(公告)号：US20070219103A1

    公开(公告)日：2007-09-20

    申请号：US11378521

    申请日：2006-03-17

    申请人： Tianbao Du ,  Feng Liu ,  Alain Duboust ,  Jose Salas-Vernis ,  Wei-Yung Hsu

    发明人： Tianbao Du ,  Feng Liu ,  Alain Duboust ,  Jose Salas-Vernis ,  Wei-Yung Hsu

    IPC分类号： B08B3/00 ,  C11D7/32

    CPC分类号： C11D7/265 ,  C11D3/2075 ,  C11D11/0047 ,  H01L21/02074 ,  H01L21/67051 ,  H01L21/67219 ,  H01L21/67745

    摘要： A composition for rinsing a substrate including deionized water, one or more carboxylate acid containing compounds, one or more surfactants, and one or more corrosion inhibitors and a method of using the same is provided. Also a method for rinsing a substrate between exposure to platens including moving the substrate from a first platen to a second platen and exposing the substrate to a rinse solution comprising one or more carboxylate acid containing compounds, one or more surfactants, and one or more corrosion inhibitors.

    摘要翻译： 提供了一种用于漂洗包括去离子水，一种或多种含羧酸的化合物，一种或多种表面活性剂和一种或多种腐蚀抑制剂的基质的组合物及其使用方法。 还有一种用于在暴露于压板之间冲洗衬底的方法，包括将衬底从第一压板移动到第二压板并将衬底暴露于包含一种或多种含羧酸的化合物，一种或多种表面活性剂和一种或多种腐蚀的冲洗溶液 抑制剂。

    BALL CONTACT COVER FOR COPPER LOSS REDUCTION AND SPIKE REDUCTION
    3.
    发明申请
    BALL CONTACT COVER FOR COPPER LOSS REDUCTION AND SPIKE REDUCTION 审中-公开
    用于铜减少和减少焦距的球接触罩

    公开(公告)号：US20070096315A1

    公开(公告)日：2007-05-03

    申请号：US11555588

    申请日：2006-11-01

    申请人： Antoine Manens ,  Alain Duboust ,  Donald Olgado ,  Yan Wang ,  Jose Salas-Vernis ,  Shou-Sung Chang

    发明人： Antoine Manens ,  Alain Duboust ,  Donald Olgado ,  Yan Wang ,  Jose Salas-Vernis ,  Shou-Sung Chang

    IPC分类号： H01L23/48 ,  H01L23/52 ,  H01L29/40

    CPC分类号： B24B37/16 ,  B23H5/08 ,  H01L21/32125

    摘要： Embodiments of the invention generally provide a method and apparatus for processing a substrate in an electrochemical mechanical planarizing system. In one embodiment, a contact assembly for electrochemically processing a substrate includes a housing having a ball disposed in a passage formed through the housing. The ball is adapted to extend partially from the housing to contact the substrate during processing. The housing comprises a conductive material. In another embodiment, the housing comprises a lower housing and a contact cover wherein the contact cover comprises a conductive material.

    摘要翻译： 本发明的实施方案通常提供用于在电化学机械平面化系统中处理基底的方法和装置。 在一个实施例中，用于电化学处理衬底的接触组件包括具有设置在通过壳体形成的通道中的球的壳体。 该球适于在加工过程中从壳体部分延伸以接触基底。 壳体包括导电材料。 在另一个实施例中，壳体包括下壳体和接触盖，其中接触盖包括导电材料。

    EDGE BEAD REMOVAL PROCESS WITH ECMP TECHNOLOGY
    7.
    发明申请
    EDGE BEAD REMOVAL PROCESS WITH ECMP TECHNOLOGY 审中-公开
    带ECMP技术的边缘除鳞工艺

    公开(公告)号：US20090061617A1

    公开(公告)日：2009-03-05

    申请号：US11849714

    申请日：2007-09-04

    申请人： Alain Duboust ,  Jose Salas-Vernis ,  Antoine P. Manens

    发明人： Alain Duboust ,  Jose Salas-Vernis ,  Antoine P. Manens

    IPC分类号： H01L21/3063

    CPC分类号： H01L21/3063 ,  H01L21/02087

    摘要： A method and apparatus for the removal of a deposited conductive layer along an edge of a substrate using a power ring configured to electro polish an edge of the substrate are provided. The electro polishing of the substrate edge may occur simultaneously with the electrochemical mechanical processing of a substrate face. In certain embodiments a method of electrochemically polishing a substrate having a conductive material disposed thereon is provided. A substrate is coupled with a carrier head comprising a power ring which surrounds an edge of the substrate, wherein the edge of the substrate includes the conductive material. A polishing pad is contacted with a face of the substrate. A first voltage is applied to the power ring to remove conductive material from the edge of the substrate. A second voltage different from the first voltage is applied to the polishing pad to remove a portion of the conductive material from the face of the substrate.

    摘要翻译： 提供了一种用于使用构造为电抛光衬底的边缘的功率环沿着衬底的边缘去除沉积的导电层的方法和装置。 衬底边缘的电抛光可以与衬底面的电化学机械加工同时发生。 在某些实施例中，提供了一种电化学抛光其上布置有导电材料的基板的方法。 衬底与包括围绕衬底的边缘的功率环的载体头耦合，其中衬底的边缘包括导电材料。 抛光垫与基板的表面接触。 向功率环施加第一电压以从衬底的边缘去除导电材料。 将不同于第一电压的第二电压施加到抛光垫，以从衬底的表面去除一部分导电材料。