METHOD OF FORMING METAL INTERCONNECTION LINE ON FLEXIBLE SUBSTRATE
    6.
    发明申请
    METHOD OF FORMING METAL INTERCONNECTION LINE ON FLEXIBLE SUBSTRATE 审中-公开
    金属互连线在柔性基板上的形成方法

    公开(公告)号:US20120291275A1

    公开(公告)日:2012-11-22

    申请号:US13337650

    申请日:2011-12-27

    IPC分类号: H05K3/10

    摘要: Provided is a method of forming a metal interconnection line on a flexible substrate, wherein the method includes: coating a hard mask layer on at least one surface of the flexible substrate, followed by performing photolithography thereon to form a predetermined hard mask pattern; etching a portion of the flexible substrate by using the hard mask pattern as a mask to form a trench; plasma treating the inside of the trench by using a treatment gas for pre-treating the flexible substrate; coating a seed layer inside the trench; removing the hard mask pattern; and filling the inside of the trench coated with the seed layer with metal. A metal interconnection line formed by using the method may have a strong adhesion force with respect to the flexible substrate.

    摘要翻译: 提供了一种在柔性基板上形成金属互连线的方法,其中所述方法包括:在柔性基板的至少一个表面上涂覆硬掩模层,然后对其进行光刻以形成预定的硬掩模图案; 通过使用硬掩模图案作为掩模蚀刻柔性基板的一部分以形成沟槽; 通过使用用于预处理柔性基板的处理气体等离子体处理沟槽的内部; 在沟槽内涂覆种子层; 去除硬掩模图案; 并用金属填充种子层涂覆的沟槽的内部。 通过使用该方法形成的金属互连线可以具有相对于柔性基板的强粘附力。