公开(公告)号：USRE45781E1

公开(公告)日：2015-10-27

申请号：US14176526

申请日：2014-02-10

申请人： Jeffrey C. Hedrick ,  Kang-Wook Lee ,  Kelly Malone ,  Christy S. Tyberg

发明人： Jeffrey C. Hedrick ,  Kang-Wook Lee ,  Kelly Malone ,  Christy S. Tyberg

IPC分类号： H01L21/02 ,  H01L23/532 ,  H01L21/70 ,  H01L23/52 ,  H01L21/316 ,  H01L21/768 ,  H01L23/522 ,  H01L21/22

CPC分类号： H01L21/22 ,  H01L21/02118 ,  H01L21/02126 ,  H01L21/022 ,  H01L21/02203 ,  H01L21/02282 ,  H01L21/02362 ,  H01L21/31695 ,  H01L21/76801 ,  H01L21/76807 ,  H01L21/7682 ,  H01L21/76829 ,  H01L21/76832 ,  H01L21/76835 ,  H01L23/5222 ,  H01L23/5329 ,  H01L23/53295 ,  H01L2221/1047 ,  H01L2924/0002 ,  Y10T428/31663 ,  H01L2924/00

摘要： A structure useful for electrical interconnection comprises a substrate; a plurality of porous dielectric layers disposed on the substrate; an etch stop layer disposed between a first of the dielectric layers and a second of the dielectric layers; and at least one thin, tough, non-porous dielectric layer disposed between at least one of the porous dielectric layers and the etch stop layer. A method for forming the structure comprising forming a multilayer stack of porous dielectric layers on the substrate, the stack including the plurality of porous dielectric layers, and forming a plurality of patterned metal conductors within the multilayer stack. Curing of the multilayer dielectric stack may be in a single cure step in a furnace. The application and hot plate baking of the individual layers of the multi layer dielectric stack may be accomplished in a single spin-coat tool, without being removed, to fully cure the stack until all dielectric layers have been deposited.

摘要翻译： 用于电互连的结构包括：基底; 设置在所述基板上的多个多孔介电层; 设置在第一电介质层和第二介电层之间的蚀刻停止层; 以及设置在至少一个多孔电介质层和蚀刻停止层之间的至少一个薄的，韧性的无孔介电层。 一种用于形成所述结构的方法，包括在所述衬底上形成多层介电层的多层堆叠，所述堆叠包括所述多个多孔介电层，以及在所述多层堆叠内形成多个图案化的金属导体。 多层电介质堆叠的固化可以在炉中的单一固化步骤中。 多层电介质堆叠的各层的应用和热板烘烤可以在单个旋涂工具中实现，而不被去除，以完全固化堆叠，直到所有电介质层已经沉积。

公开(公告)号：US08288278B2

公开(公告)日：2012-10-16

申请号：US12270386

申请日：2008-11-13

申请人： Ki-Tae Park ,  Kang-Wook Lee ,  Hyun-Kyoung Kim

发明人： Ki-Tae Park ,  Kang-Wook Lee ,  Hyun-Kyoung Kim

IPC分类号： H01L21/44

CPC分类号： H01L23/5384 ,  H01L21/76898 ,  H01L23/481 ,  H01L24/05 ,  H01L25/0657 ,  H01L25/50 ,  H01L2224/0401 ,  H01L2224/16 ,  H01L2225/06513 ,  H01L2225/06541 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/00

摘要： A semiconductor device includes a substrate, and a through electrode passing through the substrate. The semiconductor device has a pad region and a through electrode region. A pad covers the pad region, extends into the through electrode region, and delimits an opening in the through electrode region. A through electrode extends through the semiconductor substrate below the hole in the pad in the through region.

摘要翻译： 半导体器件包括衬底和穿过衬底的通孔。 半导体器件具有焊盘区域和贯通电极区域。 焊盘覆盖焊盘区域，延伸到通孔电极区域中，并限定通孔电极区域中的开口。 穿通电极通过穿通区域中的垫中的孔下方的半导体衬底延伸。

公开(公告)号：US20120217290A1

公开(公告)日：2012-08-30

申请号：US13438213

申请日：2012-04-03

申请人： Kang-Wook Lee ,  Nathalie Normand ,  Valerie Oberson

发明人： Kang-Wook Lee ,  Nathalie Normand ,  Valerie Oberson

IPC分类号： B23K1/20 ,  B23K35/363

CPC分类号： B23K35/362 ,  B23K1/0016 ,  B23K35/262 ,  B23K35/3601 ,  B23K35/3612 ,  B23K35/3618

摘要： The present invention is directed to flux compositions and uses thereof. One composition comprises an activator and a solvent being a glycerol ethoxylate with a molecular weight of 200-500. Another composition comprises an activator, a solvent being a glycerol ethoxylate with a molecular weight of 200-500 and an amine. A soldering method for joining objects is also provided, comprising the steps of applying a flux composition to at least a portion of one or more of the objects, and joining the objects.

摘要翻译： 本发明涉及助焊剂组合物及其用途。 一种组合物包含活化剂和溶剂，其分子量为200-500的甘油乙氧基化物。 另一组合物包含活化剂，溶剂为分子量为200-500的甘油乙氧基化物和胺。 还提供了一种用于接合物体的焊接方法，包括以下步骤：将焊剂组合物施加到一个或多个物体的至少一部分，并且连接物体。

公开(公告)号：US20120134864A1

公开(公告)日：2012-05-31

申请号：US13387446

申请日：2009-12-02

申请人： Kang-Wook Lee ,  Bum-Dong Sa

发明人： Kang-Wook Lee ,  Bum-Dong Sa

IPC分类号： F01C1/04

CPC分类号： F01C21/02 ,  F04C18/322 ,  F04C18/3564 ,  F04C23/008 ,  F04C23/02 ,  F04C29/0071 ,  F04C29/0085 ,  F04C29/023 ,  F04C2230/603 ,  F04C2240/10 ,  F04C2240/30 ,  F04C2240/40 ,  F04C2240/52 ,  F04C2240/60 ,  F04C2270/12

摘要： The present invention relates to a compressor in which a rotary member suspended on a stationary member is rotated to compress the refrigerant. The rotary member is suspended on a first stationary member and rotatably supported on a second stationary member spaced apart from the first stationary member, which achieves the structural stability and allows the components to be easily centered and assembled. A refrigerant suction passage and a refrigerant discharge passage are improved such that the refrigerant can be sucked and discharged without a valve.

摘要翻译： 本发明涉及一种压缩机，其中悬挂在静止构件上的旋转构件旋转以压缩制冷剂。 旋转构件悬挂在第一固定构件上并且可旋转地支撑在与第一固定构件间隔开的第二固定构件上，这实现了结构稳定性并且允许构件容易地居中和组装。 制冷剂吸入通路和制冷剂排出通路得到改善，使得制冷剂能够在没有阀的情况下被抽吸和排出。

公开(公告)号：US07786594B2

公开(公告)日：2010-08-31

申请号：US11822630

申请日：2007-07-09

申请人： Kang-Wook Lee ,  Se-Yong Oh ,  Young-Hee Song ,  Gu-Sung Kim

发明人： Kang-Wook Lee ,  Se-Yong Oh ,  Young-Hee Song ,  Gu-Sung Kim

IPC分类号： H01L23/48 ,  H01L23/52

CPC分类号： H01L25/50 ,  H01L23/3128 ,  H01L23/481 ,  H01L23/5389 ,  H01L24/05 ,  H01L24/06 ,  H01L24/16 ,  H01L24/48 ,  H01L24/49 ,  H01L24/94 ,  H01L25/0657 ,  H01L2224/02372 ,  H01L2224/02379 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/05009 ,  H01L2224/06181 ,  H01L2224/13025 ,  H01L2224/13099 ,  H01L2224/14181 ,  H01L2224/16145 ,  H01L2224/16146 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/32014 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48095 ,  H01L2224/48227 ,  H01L2224/49171 ,  H01L2224/49175 ,  H01L2224/73265 ,  H01L2224/94 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06524 ,  H01L2225/06527 ,  H01L2225/06541 ,  H01L2225/06582 ,  H01L2225/06589 ,  H01L2924/00 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/30107 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A wafer level stack structure, including a first wafer including at least one first device chip of a first chip size, wherein each first device chip contains a first plurality of input/output (I/O) pads, a second wafer including at least one second device chip of a second chip size smaller than the first chip size, wherein each second device chip contains a second plurality of I/O pads, wherein the at least one second device chip is increased to the first chip size, wherein the first wafer and the second wafer are stacked, and wherein the first wafer and the second wafer are coupled to each other. A system-in-package, including a wafer level stack structure including at least one first device chip with a first plurality of input/output (I/O) pads and at least one second device chip with a second plurality of I/O pads, and a common circuit board to which the wafer level stack structure is connected.

摘要翻译： 一种晶片级堆叠结构，包括包括第一芯片尺寸的至少一个第一器件芯片的第一晶片，其中每个第一器件芯片包含第一多个输入/输出（I / O）焊盘，第二晶片包括至少一个 第二芯片尺寸小于第一芯片尺寸的第二器件芯片，其中每个第二器件芯片包含第二多个I / O焊盘，其中所述至少一个第二器件芯片增加到所述第一芯片尺寸，其中所述第一晶片 并且第二晶片被堆叠，并且其中第一晶片和第二晶片彼此耦合。 一种系统级封装，包括晶片级堆叠结构，其包括具有第一多个输入/输出（I / O）焊盘的至少一个第一器件芯片和至少一个具有第二多个I / O焊盘的第二器件芯片 ，以及与晶片级堆叠结构连接的公共电路板。

公开(公告)号：US07666690B2

公开(公告)日：2010-02-23

申请号：US12222648

申请日：2008-08-13

申请人： Kang-Wook Lee ,  Se-Young Jeong

发明人： Kang-Wook Lee ,  Se-Young Jeong

IPC分类号： H01L21/00

CPC分类号： H01L21/485 ,  B23K26/351 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2224/0401

摘要： Exemplary embodiments of the selective laser repair apparatus and method may allow the repair of metal bumps in a semiconductor device stack by applying a laser beam to a damaged and/or defective bump. Metal bumps may be repaired and individual chips and/or packages forming a device stack need not be separated. The operation of a control unit and a driving unit may position a laser unit such that a laser beam may be irradiated at the damaged and/or defective metal bump. An X-ray inspection unit may obtain information about the damaged and/or defective metal bump.

摘要翻译： 选择性激光修复装置和方法的示例性实施例可以允许通过将激光束施加到损坏和/或缺陷凸起来修复半导体器件堆叠中的金属凸块。 可以修复金属凸块，并且不需要分离形成器件堆叠的各个芯片和/或封装。 控制单元和驱动单元的操作可以定位激光单元，使得可以在损坏的和/或有缺陷的金属凸块处照射激光束。 X射线检查单元可以获得有关损坏和/或有缺陷的金属凸块的信息。

公开(公告)号：US20100011806A1

公开(公告)日：2010-01-21

申请号：US12289711

申请日：2008-10-31

申请人： Hyuk Nam ,  Kang-Wook Lee ,  Seung-Hyoung Ha ,  Geun-Hyoung Lee

发明人： Hyuk Nam ,  Kang-Wook Lee ,  Seung-Hyoung Ha ,  Geun-Hyoung Lee

IPC分类号： F25B49/02 ,  F25B1/04 ,  H02K21/46 ,  H02P1/44 ,  F25B1/10 ,  F04C18/00 ,  F04C28/02

CPC分类号： F04C18/3564 ,  F04C23/001 ,  F04C23/008 ,  F04C28/06 ,  F04C29/0085 ,  F04C2240/803 ,  F04C2270/56 ,  H02K1/246 ,  H02K17/165 ,  H02K21/46

摘要： The present invention provides a motor, comprising: a stator including a coil wiring portion to which power is supplied; a rotor, which includes conductive bars, flux barriers, and permanent magnets, and rotates through an interactive electromagnetic force between the conductive bars, flux barriers, and permanent magnets and the coil wiring portion of the stator; an integrated capacitor, which is electrically connected to the coil wiring portion and includes two capacitors connected to each other in parallel, an electrical switch serially connected to one of the two capacitors, and a casing on which the two capacitors and the electrical switch are securely mounted.

摘要翻译： 本发明提供一种电动机，其特征在于，包括：定子，包括供给动力的线圈接线部; 转子，其包括导电棒，磁通屏障和永磁体，并且通过导电棒，磁通屏障和永磁体之间的交互电磁力以及定子的线圈布线部分旋转; 集成电容器，其电连接到线圈布线部分并且包括彼此并联连接的两个电容器，串联连接到两个电容器中的一个的电开关，以及壳体，两个电容器和电开关被牢固地连接在该壳体上 安装。

公开(公告)号：US20090305502A1

公开(公告)日：2009-12-10

申请号：US12476793

申请日：2009-06-02

申请人： Ho-Jin Lee ,  Kang-Wook Lee ,  Myeong-Soon Park ,  Ju-il Choi ,  Son-Kwan Hwang

发明人： Ho-Jin Lee ,  Kang-Wook Lee ,  Myeong-Soon Park ,  Ju-il Choi ,  Son-Kwan Hwang

IPC分类号： H01L21/768

CPC分类号： H01L23/528 ,  H01L21/76898 ,  H01L23/481 ,  H01L23/5226 ,  H01L25/0657 ,  H01L25/50 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/06181 ,  H01L2224/13009 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/48145 ,  H01L2225/06513 ,  H01L2225/06541 ,  H01L2924/15311 ,  H01L2924/00012

摘要： Methods of forming an integrated circuit device include forming an interlayer dielectric layer on a first surface of a semiconductor substrate and then forming an interconnect hole that extends through the interlayer dielectric layer and into the semiconductor substrate. A first sidewall spacer layer is formed on a sidewall of the interconnect hole. The semiconductor substrate at a bottom of the interconnect hole is isotropically etched to define an undercut recess in the semiconductor substrate. This etching step is performed using the first sidewall spacer layer as an etching mask. The interconnect hole and the uncut recess are then filled with a through-via electrode. A second surface of the semiconductor substrate is removed for a sufficient duration to expose the uncut recess containing the through-via electrode.

摘要翻译： 形成集成电路器件的方法包括在半导体衬底的第一表面上形成层间电介质层，然后形成延伸穿过层间电介质层并进入半导体衬底的互连孔。 第一侧壁间隔层形成在互连孔的侧壁上。 在互连孔的底部的半导体衬底被各向同性蚀刻以在半导体衬底中限定底切凹部。 该蚀刻步骤使用第一侧壁间隔层作为蚀刻掩模进行。 然后用通孔电极填充互连孔和未切割的凹部。 去除半导体衬底的第二表面足够的持续时间以露出包含通孔电极的未切割凹部。

公开(公告)号：US07553751B2

公开(公告)日：2009-06-30

申请号：US11529377

申请日：2006-09-29

申请人： Se-Young Jeong ,  Jin-Hak Choi ,  Nam-Seog Kim ,  Kang-Wook Lee

发明人： Se-Young Jeong ,  Jin-Hak Choi ,  Nam-Seog Kim ,  Kang-Wook Lee

IPC分类号： H01L21/44

CPC分类号： H01L24/11 ,  H01L24/02 ,  H01L24/12 ,  H01L2224/0401 ,  H01L2224/05572 ,  H01L2224/1147 ,  H01L2224/13099 ,  H01L2924/0002 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01022 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/0104 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01051 ,  H01L2924/01075 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12042 ,  Y10S438/951 ,  H01L2224/05552 ,  H01L2924/00

摘要： A method of forming a solder bump may involve forming a first photoresist pattern on a wafer having a pad. The first photoresist pattern may have an opening that exposes a portion of the pad. A first under bump metallurgy (UBM) layer may be formed on the pad, and a second UBM layer may be formed on the first photoresist pattern. A second photoresist pattern may be formed that exposes the first UBM layer. A solder bump may be formed in the opening. The second photoresist pattern and the first photoresist pattern may be removed using a stripper, thereby removing the second UBM layer by a lift-off method.

摘要翻译： 形成焊料凸点的方法可以包括在具有焊盘的晶片上形成第一光致抗蚀剂图案。 第一光致抗蚀剂图案可以具有露出垫的一部分的开口。 可以在焊盘上形成第一凸点下冶金（UBM）层，并且可以在第一光致抗蚀剂图案上形成第二UBM层。 可以形成露出第一UBM层的第二光致抗蚀剂图案。 可以在开口中形成焊料凸块。 可以使用剥离剂除去第二光致抗蚀剂图案和第一光致抗蚀剂图案，从而通过剥离方法去除第二UBM层。

公开(公告)号：US20080318363A1

公开(公告)日：2008-12-25

申请号：US12213857

申请日：2008-06-25

申请人： Yong-Chai Kwon ,  Kang-Wook Lee ,  Keum-Hee Ma ,  Seong-II Han

发明人： Yong-Chai Kwon ,  Kang-Wook Lee ,  Keum-Hee Ma ,  Seong-II Han

IPC分类号： H01L21/00

CPC分类号： H01L21/563 ,  H01L21/6835 ,  H01L21/76898 ,  H01L23/481 ,  H01L24/29 ,  H01L24/81 ,  H01L24/83 ,  H01L25/0657 ,  H01L25/50 ,  H01L2221/6834 ,  H01L2221/68354 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/16237 ,  H01L2224/29011 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/73104 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/81001 ,  H01L2224/81191 ,  H01L2224/81203 ,  H01L2224/81801 ,  H01L2224/83102 ,  H01L2224/83191 ,  H01L2224/83192 ,  H01L2224/83194 ,  H01L2224/83856 ,  H01L2224/92125 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06541 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01052 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/0132 ,  H01L2924/014 ,  H01L2924/12044 ,  H01L2924/14 ,  H01L2924/15174 ,  H01L2924/15311 ,  H01L2924/15787 ,  H01L2924/351 ,  H01L2924/00 ,  H01L2224/0401

摘要： A stack circuit member may include a first circuit member and a second circuit member. The first and the second circuit members may be electrically and mechanically connected together using a thermocompression bonding method. A photosensitive polymer layer may be interposed between the first circuit member and the second circuit member. A gap fill process and an electrical connection process may be performed at the same time.

摘要翻译： 堆叠电路构件可以包括第一电路构件和第二电路构件。 第一和第二电路构件可以使用热压接法将电气和机械连接在一起。 感光性聚合物层可以设置在第一电路部件和第二电路部件之间。 间隙填充处理和电连接处理可​​以同时进行。