公开(公告)号：US08177561B2

公开(公告)日：2012-05-15

申请号：US12302867

申请日：2007-05-23

申请人： Yasuhiro Ouchi ,  Shinichi Nikaido ,  Haruo Miyazawa ,  Hirohito Watanabe ,  Katsuya Yamagami

发明人： Yasuhiro Ouchi ,  Shinichi Nikaido ,  Haruo Miyazawa ,  Hirohito Watanabe ,  Katsuya Yamagami

IPC分类号： H05K1/00

CPC分类号： H05K7/1069 ,  H01L2924/3511 ,  H01R12/52 ,  H01R12/714 ,  H01R13/2485 ,  Y10T29/53209

摘要： A socket contact terminal for electrical connection between a connection portion formed of a metal conductor on a printed circuit board and a connection terminal of an IC package. The contact terminal comprises a metal terminal composed of a main columnar portion and arm portions on both sides and having an angular U shape and an elastomeric member attached to the metal terminal. A metal surface is exposed from the outer surface of each arm portion. The elastomeric member is firmly held between the arm portions of the metal terminal and exhibits a repulsive force when the arm portions are pressed in the direction that the arm portions approach each other.

摘要翻译： 一种插座接触端子，用于在由印刷电路板上的金属导体形成的连接部分和IC封装的连接端子之间进行电连接。 接触端子包括由主柱状部分和两侧的臂部分组成的并具有角度U形的金属端子和附接到金属端子的弹性体部件。 金属表面从每个臂部分的外表面露出。 弹性构件牢固地保持在金属端子的臂部之间，并且当臂部沿着臂部彼此接近的方向被按压时呈现排斥力。

公开(公告)号：US20100081342A1

公开(公告)日：2010-04-01

申请号：US12493760

申请日：2009-06-29

申请人： Shinichi NIKAIDO ,  Katsuya YAMAGAMI ,  Yasuhiro OUCHI

发明人： Shinichi NIKAIDO ,  Katsuya YAMAGAMI ,  Yasuhiro OUCHI

IPC分类号： H01R13/40 ,  H01R13/405 ,  H01R9/24

CPC分类号： H05K3/326 ,  H01L23/49827 ,  H01L24/16 ,  H01L24/90 ,  H01L2224/0554 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/13099 ,  H01L2224/16 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/14 ,  H01L2924/30107 ,  H01R12/714 ,  H05K1/114 ,  H05K2201/0133 ,  H05K2201/0367 ,  H05K2201/10378 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

摘要： This double-sided connector is provided with: an insulating member having an insulating substrate and an elastomer insert-molded on both faces of the insulating substrate, and a through-hole formed along a thickness direction of the insulating substrate and the elastomer; a conductive member formed on an inner face of the through-hole, both ends of the conductive member exposed at the both faces; and a contact terminal part provided at one end of the conductive member. A protrusion is formed on at least a first face of the two faces of the insulating member and near one of the two ends of the through-hole, the protrusion formed by a part of the elastomer protruding from the first face. The contact terminal part includes a ring part formed around the end of the through-hole on the first face, a sloping part connected to the ring part and extended slantingly toward a top of the protrusion, and an approximately hemispherical point of contact part connected to the sloping part and covering the top.

摘要翻译： 该双面连接器设置有：具有绝缘基板和在绝缘基板的两个表面上插入成型的弹性体的绝缘构件和沿绝缘基板和弹性体的厚度方向形成的通孔; 形成在所述通孔的内表面上的导电构件，所述导电构件的两端在所述两个面上露出; 以及设置在导电构件的一端的接触端子部。 在所述绝缘构件的两个面的至少第一面和所述贯通孔的两端中的一端附近形成突起，所述突起由从所述第一面突出的所述弹性体的一部分形成。 接触端子部包括形成在第一面上的贯通孔的端部周围的环状部，与环状部连接并向着突起的顶部倾斜延伸的倾斜部，以及大致半球形的接触点部， 倾斜部分并覆盖顶部。

公开(公告)号：US07635268B2

公开(公告)日：2009-12-22

申请号：US11781052

申请日：2007-07-20

申请人： Shinichi Nikaido ,  Haruo Miyazawa ,  Katsuya Yamagami

发明人： Shinichi Nikaido ,  Haruo Miyazawa ,  Katsuya Yamagami

IPC分类号： H01R12/00

CPC分类号： H01R13/2421 ,  H01R12/714 ,  H05K7/1069

摘要： An IC socket includes a plurality of contacts each including a spring formed by winding a conductive material around a winding axis with an effective winding number of at least 1 round, and arms provided on both ends of the spring, and a housing including the same number of holes as the plurality of contacts, the holes each having one of the contacts inserted therein in a state in which the spring is compressed in a direction of the winding axis so as to allow adjacent coil portions in the spring to come into contact with each other and to be electrically conductive.

摘要翻译： IC插座包括多个触点，每个触头包括弹簧，弹簧通过围绕绕线轴线缠绕导电材料而形成，有效绕组数量至少为1圈，并且臂设置在弹簧的两端，以及包括相同数量的壳体 作为多个触点的孔，在弹簧沿着卷绕轴线的方向被压缩的状态下，每个具有插入其中一个触头的孔，以使得弹簧中的相邻线圈部分能够与每个触点接触 另一个并且是导电的。

公开(公告)号：US20080020624A1

公开(公告)日：2008-01-24

申请号：US11781018

申请日：2007-07-20

申请人： Shinichi NIKAIDO ,  Haruo Miyazawa ,  Katsuya Yamagami

发明人： Shinichi NIKAIDO ,  Haruo Miyazawa ,  Katsuya Yamagami

IPC分类号： H01R4/50

CPC分类号： H05K7/1069 ,  H01R12/52 ,  H01R13/24 ,  H05K3/326 ,  H05K3/4092 ,  H05K3/42 ,  H05K2201/0367 ,  H05K2201/0397 ,  H05K2201/09081 ,  H05K2201/10378 ,  H05K2201/10719

摘要： An aspect of the present invention inheres in an IC socket includes a plate-like socket base body which includes through hole forming portions having a plurality of contact housing holes formed so as to penetrate the plate-like socket base in a front-to-back direction, and having through holes formed around the respective contact housing holes so as to penetrate the plate-like socket base in the front-to-back direction, and a plated layer formed continuously on an inner wall of the through hole, on the front and back surfaces of the through hole forming portion, and on a surface of the contact piece.

摘要翻译： 本发明的集成电路插座的一个方面包括一个板状插座底座本体，它包括通孔形成部分，该通孔形成部分具有多个接触容纳孔，该多个接触容纳孔形成为以前后方式穿过该板状插座底座 方向，并且具有围绕各个接触容纳孔形成的通孔，以便沿着前后方向穿透板状插座基座，以及在前面的通孔的内壁上连续形成的镀层 和通孔形成部分的后表面以及接触片的表面上。

公开(公告)号：US07581961B2

公开(公告)日：2009-09-01

申请号：US11889173

申请日：2007-08-09

申请人： Tomonari Ohtsuki ,  Katsuya Yamagami

发明人： Tomonari Ohtsuki ,  Katsuya Yamagami

IPC分类号： H01R12/00

CPC分类号： B23K3/085 ,  B23K2101/38 ,  B23K2103/12 ,  H05K3/341 ,  H05K3/3494 ,  H05K3/4015 ,  H05K2201/10234 ,  H05K2203/107 ,  H05K2203/1121 ,  Y02P70/613 ,  Y10T29/49149 ,  Y10T29/49179 ,  Y10T29/4921 ,  Y10T428/24917

摘要： Method for preventing solder from rising to a portion of an electric contact when the electric contact is being soldered to a copper foil so as to extend therefrom. The portion is plated with a noble metal and adapted to contact a mating object. Cooling means is brought into contact with at least the portion of the electric contact adapted to contact the mating object, and connection portion between the electric contact and the copper foil is heated by heating means. The rising of solder can be prevented and the electric contacts thus obtained are superior in mechanical property (sufficient bonding strength), electrical property (conductive property and low contact resistance), resistance to environmental conditions (impediment to oxidization), and physical property (limitation of rise of solder due to capillary action).

摘要翻译： 当电接触被焊接到铜箔上以从其延伸时，防止焊料上升到电接点的一部分的方法。 该部分镀有贵金属并适于接触配对物体。 冷却装置与适于与配合对象接触的至少电触头的部分接触，并且电接触和铜箔之间的连接部分被加热装置加热。 可以防止焊料的上升，从而获得的机械性能（足够的接合强度），电性能（导电性和接触电阻低），耐环境条件（阻碍氧化）和物理性能（限制） 由于毛细作用引起的焊料的上升）。

公开(公告)号：US20080070014A1

公开(公告)日：2008-03-20

申请号：US11889173

申请日：2007-08-09

申请人： Tomonari Ohtsuki ,  Katsuya Yamagami

发明人： Tomonari Ohtsuki ,  Katsuya Yamagami

IPC分类号： B32B3/00 ,  B23K1/20

CPC分类号： B23K3/085 ,  B23K2101/38 ,  B23K2103/12 ,  H05K3/341 ,  H05K3/3494 ,  H05K3/4015 ,  H05K2201/10234 ,  H05K2203/107 ,  H05K2203/1121 ,  Y02P70/613 ,  Y10T29/49149 ,  Y10T29/49179 ,  Y10T29/4921 ,  Y10T428/24917

摘要： Method for preventing solder from rising to a portion of an electric contact when the electric contact is being soldered to a copper foil so as to extend therefrom. The portion is plated with a noble metal and adapted to contact a mating object. Cooling means is brought into contact with at least the portion of the electric contact adapted to contact the mating object, and connection portion between the electric contact and the copper foil is heated by heating means. The rising of solder can be prevented and the electric contacts thus obtained are superior in mechanical property (sufficient bonding strength), electrical property (conductive property and low contact resistance), resistance to environmental conditions (impediment to oxidization), and physical property (limitation of rise of solder due to capillary action).

摘要翻译： 当电接触被焊接到铜箔上以从其延伸时，防止焊料上升到电接点的一部分的方法。 该部分镀有贵金属并适于接触配对物体。 冷却装置与适于与配合对象接触的至少电触头的部分接触，并且电接触和铜箔之间的连接部分被加热装置加热。 可以防止焊料的上升，从而获得的机械性能（足够的接合强度），电性能（导电性和接触电阻低），耐环境条件（阻碍氧化）和物理性能（限制） 由于毛细作用引起的焊料的上升）。

公开(公告)号：US09380928B2

公开(公告)日：2016-07-05

申请号：US13485109

申请日：2012-05-31

申请人： Wei-Zhi Hu ,  Takeshi Segi ,  Kenichi Nakatate ,  Katsuya Yamagami

发明人： Wei-Zhi Hu ,  Takeshi Segi ,  Kenichi Nakatate ,  Katsuya Yamagami

IPC分类号： A61B1/00 ,  A61B1/05 ,  G02B23/24 ,  A61B1/015 ,  H04N5/225

CPC分类号： A61B1/00018 ,  A61B1/00096 ,  A61B1/0011 ,  A61B1/015 ,  A61B1/051 ,  A61B1/053 ,  A61B1/0684 ,  A61B1/267 ,  G02B23/2423 ,  G02B23/2484 ,  H04N5/2253 ,  H04N5/2254 ,  H04N2005/2255

摘要： An imaging part of an electronic visualized catheter including, an object lens system, and a solid state imaging element which is positioned to receive light output from the object lens system and which photoelectrically converts the light output from the object lens system into an electric signal, wherein an output lens face of the object lens system is planar, and the output lens face is joined to a light receiving surface of the solid state imaging element.

摘要翻译： 一种电子可视化导管的成像部件，包括物镜系统和固态成像元件，其被定位成接收从物镜系统输出的光并将从物镜系统输出的光光电转换成电信号， 其中所述物镜系统的输出透镜面是平面的，并且所述输出透镜面接合到所述固态成像元件的光接收表面。

公开(公告)号：US20120310043A1

公开(公告)日：2012-12-06

申请号：US13485109

申请日：2012-05-31

申请人： Wei-Zhi HU ,  Takeshi SEGI ,  Kenichi NAKATATE ,  Katsuya YAMAGAMI

发明人： Wei-Zhi HU ,  Takeshi SEGI ,  Kenichi NAKATATE ,  Katsuya YAMAGAMI

IPC分类号： A61B1/04

CPC分类号： A61B1/00018 ,  A61B1/00096 ,  A61B1/0011 ,  A61B1/015 ,  A61B1/051 ,  A61B1/053 ,  A61B1/0684 ,  A61B1/267 ,  G02B23/2423 ,  G02B23/2484 ,  H04N5/2253 ,  H04N5/2254 ,  H04N2005/2255

摘要： An imaging part of an electronic visualized catheter including, an object lens system, and a solid state imaging element which is positioned to receive light output from the object lens system and which photoelectrically converts the light output from the object lens system into an electric signal, wherein an output lens face of the object lens system is planar, and the output lens face is joined to a light receiving surface of the solid state imaging element.

摘要翻译： 一种电子可视化导管的成像部件，包括物镜系统和固态成像元件，其被定位成接收从物镜系统输出的光并将从物镜系统输出的光光电转换成电信号， 其中所述物镜系统的输出透镜面是平面的，并且所述输出透镜面接合到所述固态成像元件的光接收表面。

公开(公告)号：US07887336B2

公开(公告)日：2011-02-15

申请号：US12493760

申请日：2009-06-29

申请人： Shinichi Nikaido ,  Katsuya Yamagami ,  Yasuhiro Ouchi

发明人： Shinichi Nikaido ,  Katsuya Yamagami ,  Yasuhiro Ouchi

IPC分类号： H01R12/00 ,  H05K1/00

CPC分类号： H05K3/326 ,  H01L23/49827 ,  H01L24/16 ,  H01L24/90 ,  H01L2224/0554 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/13099 ,  H01L2224/16 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/14 ,  H01L2924/30107 ,  H01R12/714 ,  H05K1/114 ,  H05K2201/0133 ,  H05K2201/0367 ,  H05K2201/10378 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

摘要： A double-sided connector is provided including: an insulating member having an insulating substrate and an elastomer insert-molded on both faces of the insulating substrate, and a through-hole formed along a thickness direction of the insulating substrate and the elastomer; a conductive member formed on an inner face of the through-hole, both ends of the conductive member exposed at the both faces; and a contact terminal part provided at one end of the conductive member. A protrusion is formed on at least a first face of the two faces of the insulating member and near one of the two ends of the through-hole. The protrusion formed by a part of the elastomer protruding from the first face enables an approximately hemispherical point of contact part connected to the sloping part and covering the top.

摘要翻译： 提供一种双面连接器，包括：具有绝缘基板的绝缘构件和在绝缘基板的两个表面上嵌入成型的弹性体，以及沿绝缘基板和弹性体的厚度方向形成的通孔; 形成在所述通孔的内表面上的导电构件，所述导电构件的两端在所述两个面上露出; 以及设置在导电构件的一端的接触端子部。 在绝缘构件的两个面的至少第一面上和贯通孔的两端之一附近，形成突起。 由弹性体的从第一面突出的一部分形成的突起使得可以将大致半球形的接触部分连接到倾斜部分并覆盖顶部。

公开(公告)号：US07748991B2

公开(公告)日：2010-07-06

申请号：US11781018

申请日：2007-07-20

申请人： Shinichi Nikaido ,  Haruo Miyazawa ,  Katsuya Yamagami

发明人： Shinichi Nikaido ,  Haruo Miyazawa ,  Katsuya Yamagami

IPC分类号： H01R12/00

CPC分类号： H05K7/1069 ,  H01R12/52 ,  H01R13/24 ,  H05K3/326 ,  H05K3/4092 ,  H05K3/42 ,  H05K2201/0367 ,  H05K2201/0397 ,  H05K2201/09081 ,  H05K2201/10378 ,  H05K2201/10719

摘要： An aspect of the present invention inheres in an IC socket includes a plate-like socket base body which includes through hole forming portions having a plurality of contact housing holes formed so as to penetrate the plate-like socket base in a front-to-back direction, and having through holes formed around the respective contact housing holes so as to penetrate the plate-like socket base in the front-to-back direction, and a plated layer formed continuously on an inner wall of the through hole, on the front and back surfaces of the through hole forming portion, and on a surface of the contact piece.

摘要翻译： 本发明的集成电路插座的一个方面包括一个板状插座底座本体，它包括通孔形成部分，该通孔形成部分具有多个接触容纳孔，该多个接触容纳孔形成为以前后方式穿过该板状插座底座 方向，并且具有围绕各个接触容纳孔形成的通孔，以便沿着前后方向穿透板状插座基座，以及在前面的通孔的内壁上连续形成的镀层 和通孔形成部分的后表面以及接触片的表面上。