公开(公告)号：US20110104361A1

公开(公告)日：2011-05-05

申请号：US13001071

申请日：2009-06-23

申请人： Toshio Miyazawa ,  Tsuyoshi Yamaguchi ,  Katsuyuki Matsumoto ,  Shuichi Muranishi

发明人： Toshio Miyazawa ,  Tsuyoshi Yamaguchi ,  Katsuyuki Matsumoto ,  Shuichi Muranishi

IPC分类号： A23L1/237 ,  C07C62/04 ,  C07C233/09 ,  A23L1/221 ,  A23L2/56

CPC分类号： A23L27/105 ,  A23L2/56 ,  A23L5/20 ,  A23L27/12 ,  A23L27/40 ,  A23L27/45 ,  A23L27/88 ,  A23V2002/00 ,  A23V2200/16

摘要： The invention improves the unpleasant taste characteristic of potassium salts without affecting the original flavor of foods or drinks and increases the value of potassium salt as a salt substitute, in order to provide means and a salt composition for reducing sodium in foods and drinks.By adding one or more of the following: quinic acid or a quinic acid-containing composition, spilanthol or a spilanthol-containing plant extract or plant essential oil, or an Allium plant extract, to a potassium salt or a potassium salt-containing food or drink, the unpleasant tastes such as acrid taste and metallic taste characteristic of potassium salts are improved while the salt flavor and taste are augmented.

摘要翻译： 本发明改善了钾盐的令人不愉快的味道特征，而不影响食品或饮料的原始风味，并提高了作为盐替代物的钾盐的价值，以提供用于减少食品和饮料中的钠的方法和盐组合物。 通过添加一种或多种以下物质：将含有奎尼酸或含奎尼酸的组合物，西兰替康或含有稀释素的植物精油或植物精油或葱属植物提取物加入钾盐或含钾盐的食物中，或 饮料中，改善了钾盐的刺激味道和金属味道特征的不愉快的味道，同时增加了盐味和味道。

公开(公告)号：US06904532B2

公开(公告)日：2005-06-07

申请号：US09745667

申请日：2000-12-26

申请人： Katsuyuki Matsumoto

发明人： Katsuyuki Matsumoto

IPC分类号： G06F1/26 ,  G06F15/02 ,  G06F1/32

CPC分类号： G06F1/266

摘要： A portable electronic device including a USB connector, an internal power source, a USB controller to execute data communication processing for data communication with a personal computer connected to the USB connector, a main CPU to execute device operation processing for usual operation of the device. When the USB controller executes data communication processing, the device is supplied with power at high voltage from the personal computer through the USB connector. When the main CPU executes device operation processing, the device is supplied with power at low voltage from the internal power source. Accordingly, this makes not only high speed data communication available, but also prolongs the life of the internal power source.

摘要翻译： 一种便携式电子设备，包括USB连接器，内部电源，USB控制器，用于执行与连接到USB连接器的个人计算机进行数据通信的数据通信处理，主CPU执行用于设备的通常操作的设备操作处理。 当USB控制器执行数据通信处理时，设备将通过USB连接器从个人计算机以高电压供电。 当主CPU执行设备操作处理时，从内部电源向低电压供电。 因此，不仅可以提供高速数据通信，而且可以延长内部电源的寿命。

公开(公告)号：US6120301A

公开(公告)日：2000-09-19

申请号：US686503

申请日：1996-07-24

申请人： Masahiro Ichitani ,  Ryo Haruta ,  Katsuyuki Matsumoto ,  Arata Kinjyo ,  Tsutomu Kakimoto

发明人： Masahiro Ichitani ,  Ryo Haruta ,  Katsuyuki Matsumoto ,  Arata Kinjyo ,  Tsutomu Kakimoto

IPC分类号： H01L23/28 ,  H01L21/56 ,  H01L23/12 ,  H01L23/31 ,  H01L23/498 ,  H01L21/20

CPC分类号： H01L23/3128 ,  H01L21/565 ,  H01L23/49816 ,  H01L23/49827 ,  H01L23/49838 ,  H01L2224/05553 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2224/48235 ,  H01L2224/48465 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L2924/00014 ,  H01L2924/01078 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/19105

摘要： In the BGA in which the bonding portions of the support frame bonded to the wiring substrate via adhesive layer are molded by a resin, the areas of the bonding portions are each selected to be from 0.5 to 3.1 mm.sup.2. Furthermore, holes are formed in the substrate under the frame corresponding to the bonding portions.

摘要翻译： 在其中通过粘合剂层粘合到布线基板的支撑框架的接合部分由树脂模制的BGA中，接合部分的面积各自被选择为0.5至3.1mm 2。 此外，在对应于接合部分的框架下方的基板中形成孔。

公开(公告)号：US07842397B2

公开(公告)日：2010-11-30

申请号：US11524781

申请日：2006-09-21

申请人： Yasuyuki Ito ,  Katsuyuki Matsumoto ,  Koji Nukaga ,  Yasuhiro Kusano ,  Kenji Yokomizo ,  Shingo Watanabe ,  Hiroyuki Ogawara ,  Katsumi Nomura

发明人： Yasuyuki Ito ,  Katsuyuki Matsumoto ,  Koji Nukaga ,  Yasuhiro Kusano ,  Kenji Yokomizo ,  Shingo Watanabe ,  Hiroyuki Ogawara ,  Katsumi Nomura

IPC分类号： B32B15/20 ,  H05K1/03 ,  C25D3/12 ,  C25D7/06

CPC分类号： C25D3/12 ,  C25D3/562 ,  H05K3/384 ,  H05K3/389 ,  H05K2201/0355 ,  H05K2203/0307 ,  H05K2203/0723 ,  Y10S428/935 ,  Y10T428/12438 ,  Y10T428/12472 ,  Y10T428/12569 ,  Y10T428/12611 ,  Y10T428/12792 ,  Y10T428/1291

摘要： A nickel plating solution preparation method has the steps of: dissolving in water 100 g/L or more and less than 200 g/L of nickel sulfate, and 10 g/L or more and less than 30 g/L of sodium citrate or 8 g/L or more and less than 25 g/L of citric acid, but adding no nickel chloride; and adjusting a pH of the resultant solution to 2 or more and less than 4. Another nickel plating solution preparation method has the steps of: dissolving in water 100 g/L or more and less than 200 g/L of nickel sulfate, and 10 g/L or more and less than 30 g/L of sodium citrate or 8 g/L or more and less than 25 g/L of citric acid, but adding no boric acid; and adjusting a pH of the resultant solution to 2 or more and less than 4.

摘要翻译： 镍镀液制备方法的步骤为：将100g / L以上且小于200g / L的硫酸镍和10g / L以上且小于30g / L的柠檬酸钠或8 g / L以上且小于25g / L的柠檬酸，但不添加氯化镍; 并将所得溶液的pH调节至2以上且小于4.另一种镀镍溶液制备方法具有以下步骤：将100g / L以上且小于200g / L的硫酸镍溶解于水中，将10 g / L以上且小于30g / L的柠檬酸钠或8g / L以上且小于25g / L的柠檬酸，但不添加硼酸; 并将所得溶液的pH调节至2以上且小于4。

公开(公告)号：US06904488B2

公开(公告)日：2005-06-07

申请号：US09741018

申请日：2000-12-21

申请人： Katsuyuki Matsumoto ,  Masanao Yoshida

发明人： Katsuyuki Matsumoto ,  Masanao Yoshida

IPC分类号： G06F1/26 ,  G06F3/00 ,  G06F13/14 ,  G06F13/38 ,  G06F13/40 ,  H04N5/225 ,  G06F13/20

CPC分类号： G06F13/4068

摘要： A portable electronic device according to the invention comprises a USB connector 4, a USB controller 6 for executing predetermined data communication processing attendant on data communication with a personal computer 2 connected to the USB connector 4, and a main CPU 7 for executing device operation processing for the usual operation of the device, and is adapted to receive a power supply from the personal computer 2 or an external power source 3 as connected to the USB connector 4. Discriminating between the sources of supply of power, the main CPU 7 causes the USB controller 6 to execute the predetermined data communication processing while power is supplied from the personal computer 2, or executes the usual device operation processing while power is supplied from the external power source 3. This assures more rapid and simplified processing even when the USB connector is used also as a connector for the external power source.

摘要翻译： 根据本发明的便携式电子设备包括USB连接器4，用于执行与连接到USB连接器4的个人计算机2进行数据通信的预定数据通信处理的USB控制器6以及用于执行设备操作处理的主CPU7 用于通常的设备操作，并适于从个人计算机2或连接到USB连接器4的外部电源3接收电源。 鉴于供电源之间，主CPU7使得USB控制器6在从个人计算机2供电的同时执行预定的数据通信处理，或者在从外部电源供电的情况下执行通常的设备操作处理 来源3。 即使USB连接器也用作外部电源的连接器，这保证了更快速和简化的处理。

公开(公告)号：US06621160B2

公开(公告)日：2003-09-16

申请号：US10046258

申请日：2002-01-16

申请人： Masanori Shibamoto ,  Masahiro Ichitani ,  Ryo Haruta ,  Katsuyuki Matsumoto ,  Junichi Arita ,  Ichiro Anjo

发明人： Masanori Shibamoto ,  Masahiro Ichitani ,  Ryo Haruta ,  Katsuyuki Matsumoto ,  Junichi Arita ,  Ichiro Anjo

IPC分类号： H01L2334

CPC分类号： H01L24/50 ,  H01L23/13 ,  H01L23/16 ,  H01L23/24 ,  H01L23/293 ,  H01L23/3128 ,  H01L23/34 ,  H01L23/36 ,  H01L23/3672 ,  H01L23/3675 ,  H01L23/3732 ,  H01L23/3735 ,  H01L23/3736 ,  H01L23/3737 ,  H01L23/49572 ,  H01L23/49816 ,  H01L23/4985 ,  H01L24/48 ,  H01L24/73 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/29144 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2224/73269 ,  H01L2224/92247 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01058 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/01322 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/15311 ,  H01L2924/15312 ,  H01L2924/1532 ,  H01L2924/16195 ,  H01L2924/181 ,  H01L2924/30107 ,  H01L2924/351 ,  H01L2924/0105 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2924/01014 ,  H01L2224/45099

摘要： A semiconductor device in which a semiconductor chip 1 is bonded by a metal bond 2 to one surface of a heat sink 4 formed of a material with a thermal expansion coefficient is close to he semiconductor chip 1, the heat sink 4 is glued to a stiffener with a silicon adhesive 5 with an elastic modulus of 10 MPa or less, a TAB tape 9 is glued to the stiffener 3 with an epoxy adhesive 6, and the semiconductor chip 1 is sealed with an epoxy sealing resin 8 with an elastic modulus of 10 GPa or more for protection from outside.

摘要翻译： 其中半导体芯片1通过金属接合2接合到由具有热膨胀系数的材料形成的散热器4的一个表面接近半导体芯片1的半导体器件，散热器4被胶合到加强件 使用弹性模量为10MPa以下的硅粘合剂5，用环氧树脂粘合剂6将TAB带9胶合到加强件3，并用环氧树脂密封树脂8密封弹性模量为10的半导体芯片1 GPa或更多用于保护外部。

公开(公告)号：US6104678A

公开(公告)日：2000-08-15

申请号：US108221

申请日：1998-07-01

申请人： Katsuyuki Matsumoto ,  Masanao Yoshida ,  Yoshimasa Ono ,  Shinya Miyazona ,  Hitoshi Miyamoto ,  Shigeru Ueuchi

发明人： Katsuyuki Matsumoto ,  Masanao Yoshida ,  Yoshimasa Ono ,  Shinya Miyazona ,  Hitoshi Miyamoto ,  Shigeru Ueuchi

IPC分类号： G11B27/00 ,  G11B27/10 ,  G11B27/34 ,  G11B27/36 ,  G11B31/00 ,  G11B17/22

CPC分类号： G11B31/00 ,  G11B27/002 ,  G11B27/105 ,  G11B27/34 ,  G11B27/36 ,  G11B2220/2545

摘要： A system control circuit checks a memory for data therein through a memory control circuit upon a pickup reaching the end of the disk. When at least a predetermined quantity of data remains in the memory, signaling sound generating means produces a signaling sound three times and a display portion is caused to flash. On the other hand, if the quantity of data remaining in the memory is not greater than a predetermined amount, the sound generating means produces a prolonged signaling sound once and causes the display portion to flash. The display operation is terminated if no disk change is made within a specified period of time thereafter.

摘要翻译： 一旦拾取器到达盘的端部，系统控制电路通过存储器控制电路检查存储器中的数据。 当至少预定数量的数据保留在存储器中时，信令声音产生装置产生三次信令声，并且使显示部分闪烁。 另一方面，如果存储器中剩余的数据量不大于预定量，则声音产生装置产生一次延长的信号音，并使显示部分闪烁。 如果在此后的指定时间段内没有进行任何更改，则终止显示操作。

公开(公告)号：US20130224361A1

公开(公告)日：2013-08-29

申请号：US13857160

申请日：2013-04-05

申请人： Toshio MIYAZAWA ,  Tsuyoshi Yamaguchi ,  Katsuyuki Matsumoto ,  Shuichi Muranishi

发明人： Toshio MIYAZAWA ,  Tsuyoshi Yamaguchi ,  Katsuyuki Matsumoto ,  Shuichi Muranishi

IPC分类号： A23L1/237

CPC分类号： A23L27/105 ,  A23L2/56 ,  A23L5/20 ,  A23L27/12 ,  A23L27/40 ,  A23L27/45 ,  A23L27/88 ,  A23V2002/00 ,  A23V2200/16

摘要： The invention improves the unpleasant taste characteristic of potassium salts without affecting the original flavor of foods or drinks and increases the value of potassium salt as a salt substitute, in order to provide means and a salt composition for reducing sodium in foods and drinks.By adding one or more of the following: quinic acid or a quinic acid-containing composition, spilanthol or a spilanthol-containing plant extract or plant essential oil, or an Allium plant extract, to a potassium salt or a potassium salt-containing food or drink, the unpleasant tastes such as acrid taste and metallic taste characteristic of potassium salts are improved while the salt flavor and taste are augmented.

摘要翻译： 本发明改善了钾盐的令人不愉快的味道特征，而不影响食品或饮料的原始风味，并提高了作为盐替代物的钾盐的价值，以提供用于减少食品和饮料中的钠的方法和盐组合物。 通过添加一种或多种以下物质：将含有奎尼酸或含奎尼酸的组合物，西兰替康或含有稀释素的植物精油或植物精油或葱属植物提取物加入钾盐或含钾盐的食物中，或 饮料中，改善了钾盐的刺激味道和金属味道特征的不愉快的味道，同时增加了盐味和味道。

公开(公告)号：US20070071999A1

公开(公告)日：2007-03-29

申请号：US11524781

申请日：2006-09-21

申请人： Yasuyuki Ito ,  Katsuyuki Matsumoto ,  Koji Nukaga ,  Yasuhiro Kusano ,  Kenji Yokomizo ,  Shingo Watanabe ,  Hiroyuki Ogawara ,  Katsumi Nomura

发明人： Yasuyuki Ito ,  Katsuyuki Matsumoto ,  Koji Nukaga ,  Yasuhiro Kusano ,  Kenji Yokomizo ,  Shingo Watanabe ,  Hiroyuki Ogawara ,  Katsumi Nomura

IPC分类号： C25D3/56 ,  C25D3/12

CPC分类号： C25D3/12 ,  C25D3/562 ,  H05K3/384 ,  H05K3/389 ,  H05K2201/0355 ,  H05K2203/0307 ,  H05K2203/0723 ,  Y10S428/935 ,  Y10T428/12438 ,  Y10T428/12472 ,  Y10T428/12569 ,  Y10T428/12611 ,  Y10T428/12792 ,  Y10T428/1291

摘要： A nickel plating solution preparation method has the steps of: dissolving in water 100 g/L or more and less than 200 g/L of nickel sulfate, and 10 g/L or more and less than 30 g/L of sodium citrate or 8 g/L or more and less than 25 g/L of citric acid, but adding no nickel chloride; and adjusting a pH of the resultant solution to 2 or more and less than 4. Another nickel plating solution preparation method has the steps of: dissolving in water 100 g/L or more and less than 200 g/L of nickel sulfate, and 10 g/L or more and less than 30 g/L of sodium citrate or 8 g/L or more and less than 25 g/L of citric acid, but adding no boric acid; and adjusting a pH of the resultant solution to 2 or more and less than 4.

摘要翻译： 镍镀液制备方法的步骤为：将100g / L以上且小于200g / L的硫酸镍和10g / L以上且小于30g / L的柠檬酸钠或8 g / L以上且小于25g / L的柠檬酸，但不添加氯化镍; 并将所得溶液的pH调节至2以上且小于4.另一种镀镍溶液制备方法具有以下步骤：将100g / L以上且小于200g / L的硫酸镍溶解于水中，将10 g / L以上且小于30g / L的柠檬酸钠或8g / L以上且小于25g / L的柠檬酸，但不添加硼酸; 并将所得溶液的pH调节至2以上且小于4。

公开(公告)号：US06563212B2

公开(公告)日：2003-05-13

申请号：US10046204

申请日：2002-01-16

申请人： Masanori Shibamoto ,  Masahiro Ichitani ,  Ryo Haruta ,  Katsuyuki Matsumoto ,  Junichi Arita ,  Ichiro Anjo

发明人： Masanori Shibamoto ,  Masahiro Ichitani ,  Ryo Haruta ,  Katsuyuki Matsumoto ,  Junichi Arita ,  Ichiro Anjo

IPC分类号： H01L2334

CPC分类号： H01L24/50 ,  H01L23/13 ,  H01L23/16 ,  H01L23/24 ,  H01L23/293 ,  H01L23/3128 ,  H01L23/34 ,  H01L23/36 ,  H01L23/3672 ,  H01L23/3675 ,  H01L23/3732 ,  H01L23/3735 ,  H01L23/3736 ,  H01L23/3737 ,  H01L23/49572 ,  H01L23/49816 ,  H01L23/4985 ,  H01L24/48 ,  H01L24/73 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/29144 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2224/73269 ,  H01L2224/92247 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01058 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/01322 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/15311 ,  H01L2924/15312 ,  H01L2924/1532 ,  H01L2924/16195 ,  H01L2924/181 ,  H01L2924/30107 ,  H01L2924/351 ,  H01L2924/0105 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2924/01014 ,  H01L2224/45099

摘要： A semiconductor device in which a semiconductor chip 1 is bonded by a metal bond 2 to one surface of a heat sink 4 formed of a material with a thermal expansion coefficient is close to he semiconductor chip 1, the heat sink 4 is glued to a stiffener with a silicon adhesive 5 with an elastic modulus of 10 MPa or less, a TAB tape 9 is glued to the stiffener 3 with an epoxy adhesive 6, and the semiconductor chip 1 is sealed with an epoxy sealing resin 8 with an elastic modulus of 10 GPa or more for protection from outside.

摘要翻译： 其中半导体芯片1通过金属接合2接合到由具有热膨胀系数的材料形成的散热器4的一个表面接近半导体芯片1的半导体器件，散热器4被胶合到加强件 使用弹性模量为10MPa以下的硅粘合剂5，用环氧树脂粘合剂6将TAB带9胶合到加强件3，并用环氧树脂密封树脂8密封弹性模量为10的半导体芯片1 GPa或更多用于保护外部。