公开(公告)号：US20110220405A1

公开(公告)日：2011-09-15

申请号：US12961003

申请日：2010-12-06

申请人： Kazuhisa TSUNOI

发明人： Kazuhisa TSUNOI

IPC分类号： H05K1/11 ,  H05K3/36

CPC分类号： H05K3/4623 ,  H05K1/024 ,  H05K1/0271 ,  H05K3/0047 ,  H05K3/005 ,  H05K3/0097 ,  H05K3/4046 ,  H05K3/4626 ,  H05K2201/0187 ,  H05K2201/0373 ,  H05K2201/09063 ,  H05K2201/09136 ,  H05K2201/096 ,  H05K2203/081 ,  H05K2203/082 ,  Y10T29/49126

摘要： A method for manufacturing a multilayer printed wiring board, the method includes forming a group of first through holes in a first insulating substrate; forming a group of second through holes in a second insulating substrate that has the same shape and the same size as a shape and a size, respectively, of the first insulating substrate, the second through holes having the same shape and the same size as a shape and a size, respectively, of the first through holes and being formed at the same positions as positions at which the first through holes are formed. At least one of the first through holes is filled with a first conductive member and at least one of the second through holes is filled with a second conductive member. And stacking the first insulating substrate and the second insulating substrate together.

摘要翻译： 一种多层印刷线路板的制造方法，其特征在于，在第一绝缘基板中形成一组第一贯通孔， 在第二绝缘基板中形成一组第二绝缘基板，该第二绝缘基板的形状和尺寸分别与第一绝缘基板的形状和尺寸相同，第二绝缘基板的形状和尺寸相同， 形状和尺寸分别形成在与形成第一通孔的位置相同的位置上。 第一通孔中的至少一个填充有第一导电构件，并且第二通孔中的至少一个填充有第二导电构件。 并且将第一绝缘基板和第二绝缘基板堆叠在一起。

公开(公告)号：US20100200643A1

公开(公告)日：2010-08-12

申请号：US12697195

申请日：2010-01-29

申请人： Nobuo Taketomi ,  Shigeo Iriguchi ,  Kazuhisa Tsunoi ,  Kiyoyuki Hatanaka

发明人： Nobuo Taketomi ,  Shigeo Iriguchi ,  Kazuhisa Tsunoi ,  Kiyoyuki Hatanaka

IPC分类号： B23K31/02 ,  B23K1/00

CPC分类号： H05K3/4617 ,  H01L2224/16225 ,  H01L2924/00011 ,  H01L2924/00014 ,  H05K1/186 ,  H05K3/323 ,  H05K3/341 ,  H05K3/368 ,  H05K3/4069 ,  H05K3/4602 ,  H05K3/4658 ,  H05K2201/09481 ,  H05K2203/061 ,  H01L2224/0401

摘要： A method for producing an electronic part unit, the method includes: mounting a first electronic part on a first surface of a first substrate by reflow soldering; mounting a second electronic part on a second surface of a second substrate by reflow soldering; adhering a second surface of the first substrate to a first surface of a third substrate; and adhering a second surface of the second substrate to a second surface of the third substrate.

摘要翻译： 一种电子部件单元的制造方法，所述方法包括：通过回流焊将第一电子部件安装在第一基板的第一面上; 通过回流焊将第二电子部件安装在第二基板的第二表面上; 将第一基板的第二表面粘附到第三基板的第一表面; 以及将所述第二基板的第二表面附着到所述第三基板的第二表面。

公开(公告)号：US06482676B2

公开(公告)日：2002-11-19

申请号：US08886557

申请日：1997-07-01

申请人： Kazuhisa Tsunoi ,  Akira Fujii ,  Shunji Baba ,  Yoshikazu Hirano

发明人： Kazuhisa Tsunoi ,  Akira Fujii ,  Shunji Baba ,  Yoshikazu Hirano

IPC分类号： H01L2148

CPC分类号： H01L24/12 ,  H01L21/563 ,  H01L23/49811 ,  H01L24/11 ,  H01L24/16 ,  H01L24/29 ,  H01L24/83 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/11003 ,  H01L2224/11334 ,  H01L2224/1134 ,  H01L2224/11822 ,  H01L2224/13099 ,  H01L2224/13144 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/81191 ,  H01L2224/81193 ,  H01L2224/83192 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01075 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/07802 ,  H01L2924/00 ,  H01L2224/05599

摘要： A method of mounting a semiconductor chip part on a substrate, which is capable of realizing high efficiency and high reliability of the mounting works. A leading end of a conductive wire is contact-bonded onto each pad of a semiconductor chip part, followed by tearing of the wire, to form a two-step bump having an upper step portion and a lower step portion larger in volume than the upper step portion. Only the upper step portions of the bumps are then brought in press-contact with a single flattening tool member having a flat surface in such a manner that heights of all of the bumps are made nearly equal to each other. A conductive paste is stuck on the bumps, and the substrate is coated with an adhesive. Thus, the semiconductor chip part is heated and pressurized onto the substrate by a mounting tool in such a state in which the pads are aligned with the corresponding lands of the substrate, to plastically deform the whole of the upper step portions and the lower step portions of the bumps.

摘要翻译： 一种将半导体芯片部件安装在基板上的方法，其能够实现安装工作的高效率和高可靠性。 导电线的前端接触接合到半导体芯片部件的每个焊盘上，随后撕裂导线，以形成具有上部台阶部分和下部台阶部分的体积比上部大的两级凸块 步骤部分。 然后仅使凸块的上阶梯部分与具有平坦表面的单个平坦化工具构件压接，使得所有凸块的高度彼此几乎相等。 将导电糊粘贴在凸块上，并且用粘合剂涂覆基底。 因此，通过安装工具将半导体芯片部分加热并加压到衬底上，在这种状态下，焊盘与衬底的相应焊盘对准，使整个上部台阶部分和下部分部分塑性变形 的颠簸。

公开(公告)号：US06458237B1

公开(公告)日：2002-10-01

申请号：US09045115

申请日：1998-03-20

申请人： Kazuhisa Tsunoi ,  Hidehiko Kira ,  Shunji Baba ,  Akira Fujii ,  Toshihiro Kusagaya ,  Kenji Kobae ,  Norio Kainuma ,  Naoki Ishikawa ,  Satoshi Emoto

发明人： Kazuhisa Tsunoi ,  Hidehiko Kira ,  Shunji Baba ,  Akira Fujii ,  Toshihiro Kusagaya ,  Kenji Kobae ,  Norio Kainuma ,  Naoki Ishikawa ,  Satoshi Emoto

IPC分类号： B32B700

CPC分类号： H01L24/81 ,  H01L21/563 ,  H01L24/11 ,  H01L24/29 ,  H01L24/75 ,  H01L2224/1134 ,  H01L2224/11822 ,  H01L2224/13099 ,  H01L2224/13144 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/75 ,  H01L2224/75251 ,  H01L2224/75252 ,  H01L2224/81001 ,  H01L2224/81203 ,  H01L2224/81801 ,  H01L2224/83101 ,  H01L2224/83192 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01015 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01061 ,  H01L2924/01079 ,  H01L2924/07802 ,  H01L2924/07811 ,  H01L2924/00

摘要： A method of mounting a semiconductor device having bumps on a board having pads so that each of the bumps is joined to a corresponding one of the pads is provided. Adhesive to be hardened by heat is provided between the semiconductor device and the board. The method includes the steps of pressing the bumps of the semiconductor device on the pads of the board, and heating a portion in which each of the bumps and a corresponding one of the pads are in contact with each other. A pressure of the bumps to the pads reaches a predetermined value before a temperature of the adhesive to which heat is supplied in the above step reaches a temperature at which the adhesive is hardened.

摘要翻译： 提供了一种将具有凸块的半导体器件安装在具有焊盘的板上，使得每个凸起接合到相应的一个焊盘的方法。 在半导体器件和电路板之间提供通过加热硬化的粘合剂。 该方法包括以下步骤：将半导体器件的凸起按压在板的焊盘上，并且加热其中每个凸块和相应的一个焊盘彼此接触的部分。 在上述步骤中供应热量的粘合剂的温度达到粘合剂硬化的温度之前，焊盘的凸块的压力达到预定值。

公开(公告)号：US06291269B1

公开(公告)日：2001-09-18

申请号：US09409896

申请日：1999-10-01

申请人： Hidehiko Kira ,  Kiyoshi Fukui ,  Kazuhisa Tsunoi ,  Shunji Baba

发明人： Hidehiko Kira ,  Kiyoshi Fukui ,  Kazuhisa Tsunoi ,  Shunji Baba

IPC分类号： H01L2144

CPC分类号： H01L24/29 ,  H01L21/563 ,  H01L24/11 ,  H01L24/13 ,  H01L2224/05624 ,  H01L2224/11 ,  H01L2224/1134 ,  H01L2224/1184 ,  H01L2224/13 ,  H01L2224/13144 ,  H01L2224/16225 ,  H01L2224/45144 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/83192 ,  H01L2924/00013 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/00014 ,  H01L2224/13099 ,  H01L2924/00

摘要： A semiconductor bare chip includes a plurality of stud bumps provided on the surface of the semiconductor bare chip body, each of the stud bumps including a seat and a head protruding from the seat. A height of the head is less than a thickness of electrodes on said board.

摘要翻译： 半导体裸芯片包括设置在半导体裸芯片主体的表面上的多个柱形凸块，每个凸起凸块包括座和从该座突出的头部。 头部的高度小于所述板上的电极的厚度。

公开(公告)号：US4675789A

公开(公告)日：1987-06-23

申请号：US811355

申请日：1985-12-20

申请人： Kiyoshi Kuwabara ,  Mikio Nishihara ,  Kazuhisa Tsunoi

发明人： Kiyoshi Kuwabara ,  Mikio Nishihara ,  Kazuhisa Tsunoi

IPC分类号： H05K3/46 ,  H05K1/11 ,  H05K3/42 ,  H05K1/14

CPC分类号： H05K1/116 ,  H05K2201/09327 ,  H05K2201/09454 ,  H05K3/429

摘要： A high density multilayer printed circuit board comprising generally parallel signal layers, electric source layers, and ground layers, with insulating layers arranged between the signal layers and the electric source layers, between the electric source layers and the ground layers, and between the ground layers and the signal layers respectively. Conductor portions are formed in through holes which are opened in a direction transverse to the signal layers, electric source layers, and ground layers. The conductor portions are electrically connected to the signal layers and/or the electric source layers, and/or the ground layers, through the lands thereof, the connections of the lands being substantially equally distributed among the conductor portions.

摘要翻译： 一种高密度多层印刷电路板，包括大致平行的信号层，电源层和接地层，绝缘层布置在信号层和电源层之间，电源层和接地层之间，以及接地层之间 和信号层。 导体部分形成在与信号层，电源层和接地层横向的方向上开放的通孔中。 导体部分通过其平台与信号层和/或电源层和/或接地层电连接，焊盘的连接基本上均匀分布在导体部分之间。

公开(公告)号：US06787925B2

公开(公告)日：2004-09-07

申请号：US09805559

申请日：2001-03-14

申请人： Kazuhisa Tsunoi ,  Hidehiko Kira ,  Shunji Baba ,  Akira Fujii ,  Toshihiro Kusagaya ,  Kenji Kobae ,  Norio Kainuma ,  Naoki Ishikawa ,  Satoshi Emoto

发明人： Kazuhisa Tsunoi ,  Hidehiko Kira ,  Shunji Baba ,  Akira Fujii ,  Toshihiro Kusagaya ,  Kenji Kobae ,  Norio Kainuma ,  Naoki Ishikawa ,  Satoshi Emoto

IPC分类号： H01L2348

CPC分类号： H01L24/81 ,  H01L21/563 ,  H01L24/11 ,  H01L24/29 ,  H01L24/75 ,  H01L2224/1134 ,  H01L2224/11822 ,  H01L2224/13099 ,  H01L2224/13144 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/75 ,  H01L2224/75251 ,  H01L2224/75252 ,  H01L2224/81001 ,  H01L2224/81203 ,  H01L2224/81801 ,  H01L2224/83101 ,  H01L2224/83192 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01015 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01061 ,  H01L2924/01079 ,  H01L2924/07802 ,  H01L2924/07811 ,  H01L2924/00

摘要： A method of mounting a semiconductor device having bumps on a board having pads so that each of the bumps is joined to a corresponding one of the pads is provided. Adhesive to be hardened by heat is provided between the semiconductor device and the board. The method includes the steps of pressing the bumps of the semiconductor device on the pads of the board, and heating a portion in which each of the bumps and a corresponding one of the pads are in contact with each other. A pressure of the bumps to the pads reaches a predetermined value before a temperature of the adhesive to which heat is supplied in the above step reaches a temperature at which the adhesive is hardened.

摘要翻译： 提供了一种将具有凸块的半导体器件安装在具有焊盘的板上，使得每个凸起接合到相应的一个焊盘的方法。 在半导体器件和电路板之间提供通过加热硬化的粘合剂。 该方法包括以下步骤：将半导体器件的凸起按压在板的焊盘上，并且加热其中每个凸块和相应的一个焊盘彼此接触的部分。 在上述步骤中供应热量的粘合剂的温度达到粘合剂硬化的温度之前，焊盘的凸块的压力达到预定值。

公开(公告)号：US06429516B1

公开(公告)日：2002-08-06

申请号：US08966753

申请日：1997-11-10

申请人： Kazuhisa Tsunoi

发明人： Kazuhisa Tsunoi

IPC分类号： H01L2348

CPC分类号： H01L22/32 ,  G01R1/0408 ,  H01L21/563 ,  H01L22/34 ,  H01L23/49827 ,  H01L23/4985 ,  H01L24/29 ,  H01L24/81 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/1134 ,  H01L2224/131 ,  H01L2224/13144 ,  H01L2224/16225 ,  H01L2224/16237 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/81801 ,  H01L2224/83192 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/15312 ,  H01L2224/13099 ,  H01L2924/00 ,  H01L2224/05599

摘要： A bare chip mounting structure includes a bare chip having inlet or outlet terminals, an interposer having openings at positions corresponding to said inlet or outlet terminals of the bare chip and a circuit board having conductive pads wherein the bare chip is mounted on the circuit board by means of the interposer in such a manner that the inlet or outlet terminals are electrically connected to the conductive pads of the circuit board through the openings of the interposer.

摘要翻译： 裸芯片安装结构包括具有入口或出口端子的裸芯片，在裸芯片的所述入口或出口端子对应的位置处具有开口的插入件，以及具有导电焊盘的电路板，其中裸芯片通过 插入器的装置以使得入口端子或出口端子通过插入件的开口电连接到电路板的导电垫片。

公开(公告)号：US06177730B1

公开(公告)日：2001-01-23

申请号：US09021407

申请日：1998-02-10

申请人： Hidehiko Kira ,  Kiyoshi Fukui ,  Kazuhisa Tsunoi ,  Shunji Baba

发明人： Hidehiko Kira ,  Kiyoshi Fukui ,  Kazuhisa Tsunoi ,  Shunji Baba

IPC分类号： H01L248

CPC分类号： H01L24/29 ,  H01L21/563 ,  H01L24/11 ,  H01L24/13 ,  H01L2224/05624 ,  H01L2224/11 ,  H01L2224/1134 ,  H01L2224/1184 ,  H01L2224/13 ,  H01L2224/13144 ,  H01L2224/16225 ,  H01L2224/45144 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/83192 ,  H01L2924/00013 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/00014 ,  H01L2224/13099 ,  H01L2924/00

摘要： A semiconductor bare chip includes a plurality of stud bumps provided on the surface of the semiconductor bare chip body, each of the stud bumps including a seat and a head protruding from the seat. A height of the head is less than a thickness of electrodes on said board.