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1.发明申请公开(公告)号：US20110127312A1
公开(公告)日：2011-06-02
申请号：US13025419
申请日：2011-02-11
IPC分类号： B23K3/06
CPC分类号： B23K3/0638 , B23K1/0016
摘要： A flexible unitary mask has a plurality of through holes. A substrate has a plurality of wettable pads in recessed regions defining volumes. The through holes are aligned with the wettable pads. Molten solder is directly injected through the through holes of the flexible unitary mask into the volumes with the wettable pads, such that the through holes and the volumes with the wettable pads are filled with solder. The solder is allowed to solidify, forming a plurality of solder structures adhered to the wettable pads. The flexible unitary mask is peeled from the substrate after the solder has solidified.
摘要翻译： 柔性酉面具有多个通孔。 衬底在限定体积的凹陷区域中具有多个可湿性垫。 通孔与可湿性垫对齐。 熔融的焊料通过柔性整体式掩模的通孔被直接注入到具有可湿性垫的体积中，使得通孔和具有可湿性垫的体积被焊料填充。 允许焊料固化，形成粘附到可湿性垫的多个焊料结构。 焊料固化后，将柔性单位掩模从基板上剥离。
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公开(公告)号：US20100116871A1
公开(公告)日：2010-05-13
申请号：US12269240
申请日：2008-11-12
CPC分类号： B23K3/0638 , B23K1/0016
摘要： A flexible unitary mask has a plurality of through holes. A substrate has a plurality of wettable pads in recessed regions defining volumes. The through holes are aligned with the wettable pads. Molten solder is directly injected through the through holes of the flexible unitary mask into the volumes with the wettable pads, such that the through holes and the volumes with the wettable pads are filled with solder. The solder is allowed to solidify, forming a plurality of solder structures adhered to the wettable pads. The flexible unitary mask is peeled from the substrate after the solder has solidified.
摘要翻译： 柔性酉面具有多个通孔。 衬底在限定体积的凹陷区域中具有多个可湿性垫。 通孔与可湿性垫对齐。 熔融的焊料通过柔性整体式掩模的通孔直接注入到具有可湿性垫片的体积中，使得通孔和具有可湿性垫片的体积用焊料填充。 允许焊料固化，形成粘附到可湿性垫的多个焊料结构。 焊料固化后，将柔性单位掩模从基板上剥离。
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公开(公告)号：US20080150135A1
公开(公告)日：2008-06-26
申请号：US11850767
申请日：2007-09-06
IPC分类号： H01L23/488 , H01L21/60
CPC分类号： H01L24/13 , B23K1/0016 , B23K3/0623 , B23K2101/40 , H01L23/498 , H01L23/49822 , H01L23/4985 , H01L24/11 , H01L24/16 , H01L24/81 , H01L2224/0554 , H01L2224/05568 , H01L2224/05573 , H01L2224/11003 , H01L2224/11334 , H01L2224/1134 , H01L2224/11822 , H01L2224/13016 , H01L2224/1308 , H01L2224/13082 , H01L2224/131 , H01L2224/13111 , H01L2224/13124 , H01L2224/13139 , H01L2224/13144 , H01L2224/13147 , H01L2224/13155 , H01L2224/16225 , H01L2224/7515 , H01L2224/81191 , H01L2224/81193 , H01L2224/8121 , H01L2224/81815 , H01L2924/00013 , H01L2924/00014 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , H01L2924/01327 , H01L2924/014 , H01L2924/14 , H01L2924/15787 , H01L2924/3511 , H05K3/3478 , H05K2201/0367 , H05K2203/0113 , H05K2203/0338 , H05K2203/041 , H05K2203/049 , H01L2224/13099 , H01L2924/00 , H01L2224/05599 , H01L2224/0555 , H01L2224/0556
摘要： A method for mounting a semiconductor part on a circuit substrate is provided, which includes preparing the semiconductor part having a surface thereof provided with a plurality of stud-bumps, preparing a solder substrate having a surface thereof on which solid-solders corresponding to respective ones of the plurality of stud-bumps are arranged, preparing the circuit substrate having a surface thereof provided with connecting pads corresponding to respective ones of the plurality of stud-bumps, attaching the corresponding solid-solders on the solder substrate to respective tip ends of the plurality of stud bumps, separating the solid-solders attached to the tip ends of the stud-bumps from the solder substrate, contacting the solid-solder attached to respective ones of the tip ends of the stud-bumps with the corresponding connecting pads, and heating the solid-solders contacted with the corresponding connecting pads thereby establishing solder connection between respective ones of the stud-bumps and the corresponding connecting pads.
摘要翻译： 提供了一种在电路基板上安装半导体部件的方法，其包括制备其表面设置有多个凸起凸块的半导体部件，制备其表面上的固体焊料对应于其的表面的焊料基板 布置多个柱状突起的准备电路基板，其表面设置有与多个突起凸块中的各个凸起对应的连接焊盘，将相应的固体焊料附着在焊料基板上， 多个柱形凸块，将附接到凸起凸点的末端的固体焊料与焊料基板分离，使与柱连接凸块的相应顶端的固体焊料与相应的连接焊盘接触，以及 加热与相应的连接焊盘接触的固体焊料，从而在各自的焊料之间建立焊接连接 凹凸和相应的连接垫。
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公开(公告)号：US09219041B2
公开(公告)日：2015-12-22
申请号：US13433317
申请日：2012-03-29
CPC分类号： H01L23/66 , H01L2223/6616 , H01L2223/6633 , H01L2223/6683 , H01L2224/48091 , H01L2224/49171 , H01L2224/49175 , H01L2224/73265 , H01L2924/30107 , H01L2924/3011 , H01L2924/30111 , H01L2924/00014 , H01L2924/00
摘要： A mmWave electronics package constructed from common Printed Circuit Board (PCB) technology and a metal cover. Assembly of the package uses standard pick and place technology and heat is dissipated directly to a pad on the package. Input/output of mmWave signal(s) is achieved through a rectangular waveguide. Mounting of the electronic package to an electrical printed circuit board (PCB) is performed using conventional reflow soldering processes and includes a waveguide I/O connected to an mmWave antenna. The electronic package provides for transmission of low frequency, dc and ground signals from the semiconductor chip inside the package to the PCB it is mounted on. An impedance matching scheme matches the chip to high frequency board transition by altering the ground plane within the chip. A ground plane on the high frequency board encircles the high frequency signal bump to confine the electromagnetic fields to the bump region reducing radiation loss.
摘要翻译： 由通用印刷电路板（PCB）技术和金属盖构成的mmWave电子封装。 封装的组装使用标准的拾放技术，热量直接耗散到封装上的焊盘上。 mm波形信号的输入/输出通过矩形波导实现。 使用常规回流焊工艺将电子封装安装到电气印刷电路板（PCB）上，并包括连接到mmWave天线的波导管I / O。 电子封装提供从封装内的半导体芯片到其所安装的PCB的低频，直流和地信号的传输。 阻抗匹配方案通过改变芯片内的接地平面将芯片与高频板转换相匹配。 高频板上的接地层包围高频信号突起，将电磁场限制在凸点区域，减少辐射损耗。
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公开(公告)号：US07674651B2
公开(公告)日：2010-03-09
申请号：US11850767
申请日：2007-09-06
CPC分类号： H01L24/13 , B23K1/0016 , B23K3/0623 , B23K2101/40 , H01L23/498 , H01L23/49822 , H01L23/4985 , H01L24/11 , H01L24/16 , H01L24/81 , H01L2224/0554 , H01L2224/05568 , H01L2224/05573 , H01L2224/11003 , H01L2224/11334 , H01L2224/1134 , H01L2224/11822 , H01L2224/13016 , H01L2224/1308 , H01L2224/13082 , H01L2224/131 , H01L2224/13111 , H01L2224/13124 , H01L2224/13139 , H01L2224/13144 , H01L2224/13147 , H01L2224/13155 , H01L2224/16225 , H01L2224/7515 , H01L2224/81191 , H01L2224/81193 , H01L2224/8121 , H01L2224/81815 , H01L2924/00013 , H01L2924/00014 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , H01L2924/01327 , H01L2924/014 , H01L2924/14 , H01L2924/15787 , H01L2924/3511 , H05K3/3478 , H05K2201/0367 , H05K2203/0113 , H05K2203/0338 , H05K2203/041 , H05K2203/049 , H01L2224/13099 , H01L2924/00 , H01L2224/05599 , H01L2224/0555 , H01L2224/0556
摘要： A method for mounting a semiconductor part on a circuit substrate is provided, which includes preparing the semiconductor part having a surface thereof provided with a plurality of stud-bumps, preparing a solder substrate having a surface thereof on which solid-solders corresponding to respective ones of the plurality of stud-bumps are arranged, preparing the circuit substrate having a surface thereof provided with connecting pads corresponding to respective ones of the plurality of stud-bumps, attaching the corresponding solid-solders on the solder substrate to respective tip ends of the plurality of stud bumps, separating the solid-solders attached to the tip ends of the stud-bumps from the solder substrate, contacting the solid-solder attached to respective ones of the tip ends of the stud-bumps with the corresponding connecting pads, and heating the solid-solders contacted with the corresponding connecting pads thereby establishing solder connection between respective ones of the stud-bumps and the corresponding connecting pads.
摘要翻译： 提供了一种在电路基板上安装半导体部件的方法，其包括制备其表面设置有多个凸起凸块的半导体部件，制备其表面上的固体焊料对应于其的表面的焊料基板 布置多个柱状突起的准备电路基板，其表面设置有与多个突起凸块中的各个凸起对应的连接焊盘，将相应的固体焊料附着在焊料基板上， 多个柱形凸块，将附接到凸起凸点的末端的固体焊料与焊料基板分离，使与柱连接凸块的相应顶端的固体焊料与相应的连接焊盘接触，以及 加热与相应的连接焊盘接触的固体焊料，从而在各自的焊料之间建立焊接连接 凹凸和相应的连接垫。
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6.发明授权公开(公告)号：US08381962B2
公开(公告)日：2013-02-26
申请号：US13025419
申请日：2011-02-11
CPC分类号： B23K3/0638 , B23K1/0016
摘要： A flexible unitary mask has a plurality of through holes. A substrate has a plurality of wettable pads in recessed regions defining volumes. The through holes are aligned with the wettable pads. Molten solder is directly injected through the through holes of the flexible unitary mask into the volumes with the wettable pads, such that the through holes and the volumes with the wettable pads are filled with solder. The solder is allowed to solidify, forming a plurality of solder structures adhered to the wettable pads. The flexible unitary mask is peeled from the substrate after the solder has solidified.
摘要翻译： 柔性酉面具有多个通孔。 衬底在限定体积的凹陷区域中具有多个可湿性垫。 通孔与可湿性垫对齐。 熔融的焊料通过柔性整体式掩模的通孔被直接注入到具有可湿性垫的体积中，使得通孔和具有可湿性垫的体积被焊料填充。 允许焊料固化，形成粘附到可湿性垫的多个焊料结构。 焊料固化后，将柔性单位掩模从基板上剥离。
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7.发明授权公开(公告)号：US07931187B2
公开(公告)日：2011-04-26
申请号：US12269240
申请日：2008-11-12
IPC分类号： B23K31/02
CPC分类号： B23K3/0638 , B23K1/0016
摘要： A flexible unitary mask has a plurality of through holes. A substrate has a plurality of wettable pads in recessed regions defining volumes. The through holes are aligned with the wettable pads. Molten solder is directly injected through the through holes of the flexible unitary mask into the volumes with the wettable pads, such that the through holes and the volumes with the wettable pads are filled with solder. The solder is allowed to solidify, forming a plurality of solder structures adhered to the wettable pads. The flexible unitary mask is peeled from the substrate after the solder has solidified.
摘要翻译： 柔性酉面具有多个通孔。 衬底在限定体积的凹陷区域中具有多个可湿性垫。 通孔与可湿性垫对齐。 熔融的焊料通过柔性整体式掩模的通孔被直接注入到具有可湿性垫的体积中，使得通孔和具有可湿性垫的体积被焊料填充。 允许焊料固化，形成粘附到可湿性垫的多个焊料结构。 焊料固化后，将柔性单位掩模从基板上剥离。
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