公开(公告)号：US07521649B2

公开(公告)日：2009-04-21

申请号：US10984674

申请日：2004-11-09

申请人： Kazushige Umetsu ,  Daisuke Sawaki

发明人： Kazushige Umetsu ,  Daisuke Sawaki

IPC分类号： H01L27/14

CPC分类号： B23K26/0676 ,  B23K26/067 ,  B23K26/0853

摘要： A laser processing apparatus is provided including: a laser generator generating a light beam; a branching means for branching out the light beam to a plurality of beams arranged at equal intervals; a shifting means for shifting the plurality of beams at a pitch equal to a multiple of natural number of the arranged intervals relatively over a target; and a control means for controlling the intensity of the beam synchronously with the shifting pitch of the plurality of beams.

摘要翻译： 提供一种激光加工装置，包括：产生光束的激光发生器; 分支装置，用于将光束分支到以等间隔布置的多个光束; 移位装置，用于以相对于目标的相对于排列间隔的自然数的倍数的间距移动多个光束; 以及控制装置，用于与多个光束的移动间距同步地控制光束的强度。

公开(公告)号：US07468310B2

公开(公告)日：2008-12-23

申请号：US11300108

申请日：2005-12-14

申请人： Yutaka Yamazaki ,  Kazushige Umetsu

发明人： Yutaka Yamazaki ,  Kazushige Umetsu

IPC分类号： H01L21/00

CPC分类号： H01L21/78 ,  B23K26/40 ,  B23K2103/50

摘要： A method of machining a substrate etches a substrate according to a predetermined length and depth from an intersection between a first predetermined dividing line and a second predetermined dividing line, which cross each other in a T-shaped line, along the second predetermined dividing line of the predetermined dividing lines being used to cut the substrate, and divides the substrate along the predetermined dividing lines which are not etched by laser machining.

摘要翻译： 基板的加工方法根据预定的长度和深度，沿着T字形的线中彼此交叉的第一预定分割线和第二预定分割线之间的交点沿着第二预定分割线 预定分割线用于切割基板，并且沿着未被激光加工蚀刻的预定分割线分割基板。

公开(公告)号：US07411649B2

公开(公告)日：2008-08-12

申请号：US11299335

申请日：2005-12-09

申请人： Kazushige Umetsu

发明人： Kazushige Umetsu

IPC分类号： G02F1/13 ,  H04R25/00

CPC分类号： H03H3/02 ,  B23K26/0613 ,  B23K26/40 ,  B23K2103/50 ,  H03H2003/026

摘要： A method of manufacturing a crystal device includes applying substantially simultaneously a first light that is absorbed by a crystal plate and excites an energy level of a substance constituting the crystal plate from a ground state to a first excited state, and a second light that excites the energy level of the substance constituting the crystal plate from the first excited state to a second excited state to generate an ablation, thereby forming one or more grooves in a predetermined pattern on the crystal plate.

摘要翻译： 制造晶体装置的方法包括基本上同时施加被晶体板吸收的第一光，并将构成晶体板的物质的能级从基态激发到第一激发态，并且激发第二光， 构成晶体板的物质从第一激发态到第二激发态的能级，以产生烧蚀，从而在晶体板上形成预定图案中的一个或多个凹槽。

公开(公告)号：US07406756B2

公开(公告)日：2008-08-05

申请号：US10970696

申请日：2004-10-21

申请人： Kazushige Umetsu ,  Kazuto Yoshimura ,  Tsukasa Funasaka ,  Fumitaka Kitamura

发明人： Kazushige Umetsu ,  Kazuto Yoshimura ,  Tsukasa Funasaka ,  Fumitaka Kitamura

IPC分类号： H01L41/22 ,  B23K26/00

CPC分类号： H03H9/21 ,  H03H3/02 ,  H03H2003/026 ,  Y10T29/42 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/4913 ,  Y10T29/49155

摘要： A method for manufacturing a piezoelectric resonator is provided including: forming a resonator element having a plate-like base and a plurality of arms extending laterally from the base on a substrate made of crystal; emitting laser light for irradiating one surface and the other surface of the arms with laser light and for removing a region irradiated with the laser light, so as to form a groove having a predetermined cross sectional shape perpendicular to the longitudinal direction of the groove; forming a driving electrode on the resonator element.

摘要翻译： 提供了一种制造压电谐振器的方法，包括：形成具有板状基体的谐振元件和从由晶体制成的基板上的基部横向延伸的多个臂; 发射用于用激光照射一个表面和另一个表面的激光，并且去除用激光照射的区域，以形成具有垂直于所述凹槽的纵向方向的预定横截面形状的凹槽; 在谐振元件上形成驱动电极。

公开(公告)号：US06918705B2

公开(公告)日：2005-07-19

申请号：US10633623

申请日：2003-08-05

申请人： Kazunori Sakurai ,  Kazushige Umetsu ,  Akihiro Murata

发明人： Kazunori Sakurai ,  Kazushige Umetsu ,  Akihiro Murata

IPC分类号： G02B6/24 ,  G02B6/42 ,  H01L31/0232 ,  H01S5/022 ,  G02B6/36

CPC分类号： G02B6/4201 ,  G02B6/4212 ,  G02B6/4232 ,  G02B6/4238 ,  G02B6/4239 ,  G02B6/4242 ,  G02B6/4253 ,  G02B6/4255 ,  G02B6/4274 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16145 ,  H01L2224/32145 ,  H01L2224/48091 ,  H01L2224/73204 ,  H01L2224/73257 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2224/05599

摘要： An optical module comprising: an optical fiber; an optical element having an optical section and with a fixed position relative to the optical fiber; and a semiconductor chip electrically connected to the optical element, and the optical element and semiconductor chip being packaged. A hole is formed in the semiconductor chip, and the optical element is mounted on the semiconductor chip with the optical section facing the hole, and the optical fiber is inserted in the hole and fitted to the semiconductor chip.

摘要翻译： 一种光学模块，包括：光纤; 具有光学部分并且相对于光纤具有固定位置的光学元件; 以及与光学元件电连接的半导体芯片，并且所述光学元件和半导体芯片被封装。 在半导体芯片中形成孔，并且将光学元件安装在半导体芯片上，其中光学部件面向孔，并且将光纤插入孔中并将其装配到半导体芯片。

公开(公告)号：US06781089B2

公开(公告)日：2004-08-24

申请号：US10273422

申请日：2002-10-17

申请人： Kazushige Umetsu ,  Jun Amako ,  Kenichi Honda

发明人： Kazushige Umetsu ,  Jun Amako ,  Kenichi Honda

IPC分类号： B23K2638

CPC分类号： B23K26/0673 ,  B23K26/067 ,  B23K2101/38 ,  G02F1/136204 ,  H05K3/027 ,  H05K3/225

摘要： An apparatus for cutting an electrical wiring line includes a laser generator for generating a laser beam, an optical beam branching element for branching a laser beam generated by the laser generator into a plurality of branch beams, and a condenser element for condensing the branch beams branched by the optical beam branching element (the optical beam branching element can also serve as the condenser element). The condenser element may be a condenser lens which is separate from the optical beam branching element. The power and the focal depth of the branch beam may be adjusted. When the substrate has a transparency to the laser beam, the branch beam is directed to the electrical wiring line formed on the substrate from the opposite side to the surface having the electrical wiring line.

公开(公告)号：US06690032B1

公开(公告)日：2004-02-10

申请号：US09787744

申请日：2001-03-22

申请人： Kazushige Umetsu

发明人： Kazushige Umetsu

IPC分类号： H01L2915

CPC分类号： G02F1/13452 ,  G02F1/1345 ,  G02F2201/42

摘要： An electro-optical device comprises first and second substrates (10, 20) disposed facing each other, an interconnect (14) formed on the surface of the first substrate (10) opposing the second substrate (20), and a conductive member (40) passing through the second substrate (20) and reaching both surfaces of the second substrate (20), and the conductive member (40) and interconnect (14) are electrically connected between the first and second substrates (10, 20).

摘要翻译： 电光装置包括彼此相对设置的第一和第二基板（10,20），形成在与第二基板（20）相对的第一基板（10）的表面上的互连（14）和导电部件 ）通过第二基板（20）并到达第二基板（20）的两个表面，并且导电部件（40）和互连件（14）电连接在第一和第二基板（10,20）之间。

公开(公告)号：US06677237B2

公开(公告)日：2004-01-13

申请号：US10166703

申请日：2002-06-12

申请人： Kazushige Umetsu ,  Jun Amako ,  Shinichi Yotsuya ,  Katsuji Arakawa

发明人： Kazushige Umetsu ,  Jun Amako ,  Shinichi Yotsuya ,  Katsuji Arakawa

IPC分类号： H01L2144

CPC分类号： B23K26/06 ,  B23K26/064 ,  B23K26/0643 ,  B23K26/0648 ,  B23K26/0665 ,  H01L21/486 ,  H01L21/76898 ,  H01L23/481 ,  H01L25/0657 ,  H01L25/50 ,  H01L2223/54453 ,  H01L2224/16 ,  H01L2225/06513 ,  H01L2225/06541 ,  H01L2924/00014 ,  H01L2224/0401

摘要： A semiconductor chip having a vertical current conduction structure of a high reliability: a semiconductor device, a circuit substrate, and an electronic apparatus each containing such semiconductor chips; and a method for producing them. A prehole (3) is formed in a silicon substrate (10) surface-oriented to a (100) face by laser beam irradiation. The prehole (3) is enlarged by anisotropic etching to thereby form a through-hole (4). An electrically insulating film is formed on an inner wall of the through-hole (4). An electrically conducting material is provided inside the insulating film to thereby form a metal bump (30).

摘要翻译： 具有高可靠性的垂直导电结构的半导体芯片：半导体器件，电路基板和各自包含这种半导体芯片的电子设备; 及其制造方法。 在通过激光束照射对（100）面进行表面取向的硅衬底（10）中形成预孔（3）。 通过各向异性蚀刻使预孔（3）扩大，从而形成通孔（4）。 在通孔（4）的内壁上形成电绝缘膜。 导电材料设置在绝缘膜的内部，从而形成金属凸块（30）。

公开(公告)号：US06596634B2

公开(公告)日：2003-07-22

申请号：US10077820

申请日：2002-02-20

申请人： Kazushige Umetsu ,  Yohei Kurashima ,  Jun Amako

发明人： Kazushige Umetsu ,  Yohei Kurashima ,  Jun Amako

IPC分类号： H01L2144

CPC分类号： H01L21/486 ,  H01L21/76882 ,  H01L21/76898 ,  H01L23/481 ,  H01L24/03 ,  H01L24/05 ,  H01L24/11 ,  H01L24/13 ,  H01L24/16 ,  H01L24/81 ,  H01L25/0657 ,  H01L25/50 ,  H01L2224/0345 ,  H01L2224/0401 ,  H01L2224/051 ,  H01L2224/05563 ,  H01L2224/05567 ,  H01L2224/0557 ,  H01L2224/05572 ,  H01L2224/056 ,  H01L2224/1132 ,  H01L2224/11334 ,  H01L2224/1134 ,  H01L2224/1181 ,  H01L2224/11849 ,  H01L2224/13009 ,  H01L2224/1319 ,  H01L2224/13411 ,  H01L2224/13444 ,  H01L2224/13483 ,  H01L2224/16146 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/16237 ,  H01L2224/17181 ,  H01L2224/811 ,  H01L2224/81191 ,  H01L2224/81193 ,  H01L2224/814 ,  H01L2224/8149 ,  H01L2224/81815 ,  H01L2224/8185 ,  H01L2224/9202 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06541 ,  H01L2225/06565 ,  H01L2924/0002 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01075 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/1016 ,  H01L2924/1017 ,  H01L2924/12042 ,  H01L2924/14 ,  H05K3/3494 ,  H05K3/4038 ,  H05K2201/0305 ,  H05K2201/096 ,  H05K2203/041 ,  H05K2203/082 ,  H05K2203/107 ,  H01L2924/0105 ,  H01L2224/05552 ,  H01L2924/00

摘要： A conductive material is provided to an open end of a penetrating hole penetrating through at least a semiconductor element, on the side of a first surface of the semiconductor element. The conductive material is melted to flow into the penetrating hole. The conductive material is made to flow into the penetrating hole in a state that an atmospheric pressure on the side of a second surface of the semiconductor element opposite to the first surface is lower than an atmospheric pressure on the side of the first surface.

公开(公告)号：US06507003B2

公开(公告)日：2003-01-14

申请号：US09919876

申请日：2001-08-02

申请人： Jun Amako ,  Kazushige Umetsu ,  Hitoshi Nakao

发明人： Jun Amako ,  Kazushige Umetsu ,  Hitoshi Nakao

IPC分类号： B23K2600

CPC分类号： H01S3/005 ,  B23K26/042 ,  B23K26/0604 ,  B23K26/066 ,  B23K26/0676 ,  G02B27/1086 ,  H01S5/4025

摘要： The laser processing apparatus includes lasers for emitting a plurality of laser beams of different wavelengths, a common phase grating for splitting the laser beams of different wavelengths into diffraction beams shaped in designed arrays, and a condenser lens for condensing the diffraction beams. The layout of the focused diffraction beam spots of each wavelength is decided in accordance with the design of the phase grating.