公开(公告)号：US06573031B2

公开(公告)日：2003-06-03

申请号：US10017450

申请日：2001-12-18

申请人： Hiroshi Shinya ,  Kazuyoshi Mizumoto ,  Kazuhisa Hayashida ,  Eiichi Sekimoto

发明人： Hiroshi Shinya ,  Kazuyoshi Mizumoto ,  Kazuhisa Hayashida ,  Eiichi Sekimoto

IPC分类号： G03F716

CPC分类号： H01L21/67253 ,  G03F7/168

摘要： A substrate coated with a coating solution is placed on a heating plate in a processing chamber in which an inert gas is circulating. The substrate is heated on the heating plate while the inert gas is circulating at an extremely small first circulating amount. The substrate is heated further on the heating plate while the inert gas is circulating at a second circulating amount larger than the first circulating amount. Detected is the density of the solvent in the processing chamber. The supply and exhaust amounts of the inert gas are controlled based on the density detected after the start of heating, so that an exhaust amount of the inert gas becomes a predetermined amount for a predetermined period until the solvent density reaches a predetermined density. A necessary control process is performed so that the solvent density reaches the predetermined density when the solvent density has not reached or exceeded the predetermined density after the predetermined period has elapsed. The two-time thermal-process or solvent-density control promotes evaporation of the resist solvent while restricting scattering of a photo-oxidizing agent included in the resist from being promoted beyond the wafer surface, thus achieving coated-film uniformity for the thermal process.

公开(公告)号：US5435075A

公开(公告)日：1995-07-25

申请号：US043731

申请日：1993-04-07

申请人： Hirofumi Shiraishi ,  Kenji Yokomizo ,  Kazuyoshi Mizumoto ,  Yoshiyuki Honda

发明人： Hirofumi Shiraishi ,  Kenji Yokomizo ,  Kazuyoshi Mizumoto ,  Yoshiyuki Honda

IPC分类号： F26B5/08 ,  H01L21/00 ,  F26B17/24

CPC分类号： H01L21/67034 ,  F26B5/08

摘要： A spindrier comprises a box enclosing a plurality of wafers, a motor for rotating the wafers in the box, upper and lower clamp bars for holding the wafers face to face and substantially perpendicular to a rotating shaft of rotating means, and gas introducing and discharging mechanisms for generating a flow of clean gas in the box. A sectional area of an open bottom of the box is smaller than a sectional area of an open top of the box, and the gas flows from the open top to the open bottom.

摘要翻译： 支架包括封闭多个晶片的盒子，用于使盒中的晶片旋转的电动机，用于将晶片面对面并且基本上垂直于旋转装置的旋转轴保持晶片的上下夹具，以及气体引入和排出机构 用于在箱中产生清洁气体流。 箱的开口底部的截面面积小于箱体开口顶部的截面积，气体从开口顶部流向开口底部。