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1.发明申请PHOTOSENSITIVE ADHESIVE COMPOSITION, AND FILM ADHESIVE, ADHESIVE SHEET, ADHESIVE PATTERN, SEMICONDUCTOR WAFER WITH ADHESIVE LAYER AND SEMICONDUCTOR DEVICE USING THE PHOTOSENSITIVE ADHESIVE COMPOSITION 审中-公开光敏胶粘剂组合物和胶粘剂，粘合片，粘合剂图案，具有粘合层和半导体器件的半导体膜，使用感光性粘合剂组合物公开(公告)号：US20110151195A1
公开(公告)日：2011-06-23
申请号：US13060685
申请日：2009-07-30
CPC分类号： C08G73/1042 , C08G73/1046 , C08G73/106 , C08G73/1082 , C08L63/00 , C08L79/08 , C08L2666/02 , C08L2666/22 , C09J7/20 , C09J7/22 , C09J7/38 , C09J9/00 , C09J163/00 , C09J179/08 , C09J2203/326 , C09J2205/31 , C09J2433/00 , C09J2463/00 , C09J2479/00 , C09J2479/08 , G03F7/0387 , G03F7/0388 , H01L24/27 , H01L24/29 , H01L24/48 , H01L24/73 , H01L24/83 , H01L25/0657 , H01L2224/05554 , H01L2224/274 , H01L2224/29 , H01L2224/29101 , H01L2224/2919 , H01L2224/29298 , H01L2224/32145 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/73265 , H01L2224/83101 , H01L2224/83191 , H01L2224/83855 , H01L2224/92247 , H01L2924/00013 , H01L2924/00014 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01012 , H01L2924/01013 , H01L2924/01015 , H01L2924/01019 , H01L2924/0102 , H01L2924/01023 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/0104 , H01L2924/01044 , H01L2924/01046 , H01L2924/01047 , H01L2924/0105 , H01L2924/01051 , H01L2924/01057 , H01L2924/01075 , H01L2924/01077 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01084 , H01L2924/014 , H01L2924/04953 , H01L2924/0665 , H01L2924/07802 , H01L2924/09701 , H01L2924/10253 , H01L2924/12041 , H01L2924/15311 , H01L2924/15788 , H01L2924/16235 , H01L2924/181 , H01L2924/351 , Y10T428/24479 , Y10T428/2809 , Y10T428/31504 , H01L2924/07025 , H01L2924/0635 , H01L2924/00 , H01L2924/00012 , H01L2924/3512 , H01L2224/29099 , H01L2224/29199 , H01L2224/29299 , H01L2224/2929 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： There is provided a photosensitive adhesive composition having a lowest melt viscosity at 20° C. to 200° C. after pattern formation of 30,000 Pa·s or lower.
摘要翻译： 在形成30,000Pa·s或更低的图案之后，提供在20℃至200℃下具有最低熔体粘度的感光性粘合剂组合物。
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2.发明申请PHOTOSENSITIVE ADHESIVE COMPOSITION, FILM-LIKE ADHESIVE, ADHESIVE SHEET, ADHESIVE PATTERN, SEMICONDUCTOR WAFER WITH ADHESIVE LAYER, SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD 审中-公开光敏胶粘剂组合物，薄膜粘合剂，粘合片，粘合剂图案，带粘合层的半导体滤波器，半导体器件和半导体器件制造方法公开(公告)号：US20100143673A1
公开(公告)日：2010-06-10
申请号：US12594461
申请日：2008-03-19
CPC分类号： C09J4/06 , C08G59/686 , C08L63/00 , C08L2666/22 , C09J11/06 , C09J163/00 , C09J179/08 , H01L23/24 , H01L2224/32145 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/73265 , H01L2924/09701 , H01L2924/15311 , Y10T428/24851 , H01L2924/00014 , H01L2924/00
摘要： The photosensitive adhesive composition of the invention comprises (A) an alkali-soluble resin, (B) an epoxy resin, (C) a radiation-polymerizable compound and (D) a photoinitiator, wherein the (D) photoinitiator contains at least (D1) a photoinitiator that exhibits a function which promotes polymerization and/or curing reaction of the epoxy resin by exposure to radiation.
摘要翻译： 本发明的感光性粘合剂组合物包含（A）碱溶性树脂，（B）环氧树脂，（C）可辐射聚合化合物和（D）光引发剂，其中（D）光引发剂至少含有（D1 ）光引发剂，其具有通过暴露于辐射促进环氧树脂的聚合和/或固化反应的功能。
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3.发明申请SEMICONDUCTOR DEVICE, METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR WAFER PROVIDED WITH ADHESIVE LAYER 审中-公开半导体器件，制造半导体器件的方法和具有粘合层的半导体器件公开(公告)号：US20120263946A1
公开(公告)日：2012-10-18
申请号：US13509362
申请日：2010-11-10
CPC分类号： H01L24/27 , C08F220/30 , H01L21/565 , H01L21/67132 , H01L21/6836 , H01L23/3128 , H01L24/29 , H01L24/32 , H01L24/48 , H01L24/73 , H01L24/83 , H01L24/92 , H01L25/0657 , H01L2221/68327 , H01L2221/6834 , H01L2221/68381 , H01L2224/27002 , H01L2224/274 , H01L2224/27416 , H01L2224/27418 , H01L2224/2919 , H01L2224/32145 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/73265 , H01L2224/83191 , H01L2224/83201 , H01L2224/83855 , H01L2224/83856 , H01L2224/92247 , H01L2224/93 , H01L2225/0651 , H01L2225/06568 , H01L2924/00014 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01012 , H01L2924/01013 , H01L2924/01015 , H01L2924/01019 , H01L2924/0102 , H01L2924/01023 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/0104 , H01L2924/01047 , H01L2924/0105 , H01L2924/01051 , H01L2924/01075 , H01L2924/01079 , H01L2924/01084 , H01L2924/014 , H01L2924/04953 , H01L2924/0665 , H01L2924/07802 , H01L2924/09701 , H01L2924/10253 , H01L2924/15311 , H01L2924/181 , H01L2924/351 , Y10T428/2809 , Y10T428/31935 , H01L2924/00 , H01L2924/00012 , H01L2924/3512 , H01L2224/27 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： Disclosed is a method for manufacturing a semiconductor device which includes the steps of: forming an adhesive layer by forming an adhesive composition into a film on a surface opposite to the circuit surface of a semiconductor wafer; bringing the adhesive layer to a B-stage by irradiation with light; cutting the semiconductor wafer together with the adhesive layer brought to the B-stage into a plurality of semiconductor chips; and making the semiconductor chip to adhere to a supporting member or another semiconductor chip by performing compression bonding, with the adhesive layer sandwiched therebetween.
摘要翻译： 本发明公开了一种半导体器件的制造方法，包括以下步骤：通过在与半导体晶片的电路表面相对的表面上形成粘合剂组合物形成粘合剂层; 通过光照射使粘合剂层进入B阶段; 将半导体晶片与带到B级的粘合剂层一起切割成多个半导体芯片; 并且通过进行压接而使半导体芯片粘附到支撑构件或另一半导体芯片上，其中夹着粘合剂层。
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4.发明申请PHOTOSENSITIVE ADHESIVE COMPOSITION, FILMY ADHESIVE, ADHESIVE SHEET, ADHESIVE PATTERN, SEMICONDUCTOR WAFER WITH ADHESIVE LAYER, SEMICONDUCTOR DEVICE, AND PROCESS FOR PRODUCING SEMICONDUCTOR DEVICE 审中-公开光敏性粘合剂组合物，胶粘剂，粘合片，粘合剂图案，具有粘合层的半导体滤波器，半导体器件以及用于制造半导体器件的方法公开(公告)号：US20110121435A1
公开(公告)日：2011-05-26
申请号：US12863068
申请日：2009-01-09
CPC分类号： C09J179/08 , C08G73/1042 , C08G73/1046 , C08G73/106 , C08K5/0025 , C08K5/3417 , C08L79/08 , C08L2312/06 , C09J7/20 , C09J163/00 , C09J2203/326 , C09J2205/102 , C09J2463/00 , C09J2479/08 , H01L24/32 , H01L24/48 , H01L24/73 , H01L24/83 , H01L2224/2919 , H01L2224/32145 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/73265 , H01L2224/8385 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01012 , H01L2924/01013 , H01L2924/01015 , H01L2924/0102 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/0104 , H01L2924/01047 , H01L2924/0105 , H01L2924/01051 , H01L2924/01075 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/04953 , H01L2924/0665 , H01L2924/07802 , H01L2924/09701 , H01L2924/10253 , H01L2924/15311 , H01L2924/15788 , H01L2924/181 , H01L2924/351 , Y10T428/24612 , H01L2924/00 , H01L2924/00012 , H01L2924/3512 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： A photosensitive adhesive composition that comprises (A) a resin with a carboxyl and/or hydroxyl group, (B) a thermosetting resin, (C) a radiation-polymerizable compound and (D) a photoinitiator, wherein the 3% weight reduction temperature of the entire photoinitiator mixture in the composition is 200° C. or greater.
摘要翻译： 一种感光性粘合剂组合物，其包含（A）具有羧基和/或羟基的树脂，（B）热固性树脂，（C）辐射聚合性化合物和（D）光引发剂，其中，3％ 组合物中的整个光引发剂混合物为200℃或更高。
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5.发明授权Photosensitive adhesive composition, film-like adhesive, adhesive sheet, adhesive pattern, semiconductor wafer with adhesive layer, semiconductor device 有权光敏粘合剂组合物，薄膜状粘合剂，粘合片，粘合剂图案，具有粘合剂层的半导体晶片，半导体器件公开(公告)号：US09309446B2
公开(公告)日：2016-04-12
申请号：US13410702
申请日：2012-03-02
IPC分类号： G03F7/00 , G03F7/004 , C09J7/02 , H01L23/00 , G03F7/027 , G03F7/037 , G03F7/038 , C08G73/10 , C09J179/08 , H01L21/683 , H01L25/065 , H01L23/29 , H01L23/31
CPC分类号： C09J7/0203 , C08G73/105 , C08L63/00 , C09J7/35 , C09J179/08 , C09J2203/326 , C09J2205/31 , C09J2433/00 , C09J2463/00 , C09J2479/08 , G03F7/027 , G03F7/037 , G03F7/038 , H01L21/6836 , H01L23/293 , H01L23/3128 , H01L24/27 , H01L24/29 , H01L24/32 , H01L24/48 , H01L24/73 , H01L24/92 , H01L25/0657 , H01L2221/68327 , H01L2221/68377 , H01L2224/05554 , H01L2224/27002 , H01L2224/27416 , H01L2224/27436 , H01L2224/27622 , H01L2224/32145 , H01L2224/32225 , H01L2224/48227 , H01L2224/73265 , H01L2224/92247 , H01L2225/0651 , H01L2225/06568 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01012 , H01L2924/01013 , H01L2924/01019 , H01L2924/0102 , H01L2924/01023 , H01L2924/01029 , H01L2924/01033 , H01L2924/0104 , H01L2924/01044 , H01L2924/01047 , H01L2924/0105 , H01L2924/01051 , H01L2924/01073 , H01L2924/01077 , H01L2924/01078 , H01L2924/01079 , H01L2924/014 , H01L2924/09701 , H01L2924/10253 , H01L2924/12042 , H01L2924/1461 , H01L2924/15788 , H01L2924/181 , Y10T428/24802 , Y10T428/2817 , H01L2924/00012 , H01L2924/00 , H01L2924/3512 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： The present invention relates to a photosensitive adhesive composition that has thermal press bondability to an adherent after being patterned by exposure and development and enables alkali development, wherein a storage elastic modulus at 110° C. after exposure and further heat curing is not less than 10 MPa.
摘要翻译： 本发明涉及一种感光性粘合剂组合物，其通过曝光和显影进行图案化后具有对粘合剂的热压粘合性，并且能够进行碱显影，其中在曝光和进一步热固化后110℃下的储能弹性模量不小于10 MPa。
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6.发明授权Method of producing semiconductor device with patterned photosensitive adhesive 有权用图案化感光胶制造半导体器件的方法公开(公告)号：US08507323B2
公开(公告)日：2013-08-13
申请号：US13551816
申请日：2012-07-18
CPC分类号： C09J4/00 , C08G65/3322 , C08G65/33306 , C08G2650/50 , C08L71/02 , C08L79/08 , C08L2666/20 , C08L2666/22 , C09J171/02 , C09J179/08 , H01L21/6836 , H01L23/3121 , H01L24/27 , H01L24/29 , H01L24/48 , H01L24/73 , H01L24/83 , H01L24/85 , H01L2221/68327 , H01L2224/05554 , H01L2224/274 , H01L2224/2919 , H01L2224/32145 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/73265 , H01L2224/83191 , H01L2224/83855 , H01L2224/85 , H01L2224/92247 , H01L2924/00014 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01012 , H01L2924/01015 , H01L2924/01019 , H01L2924/01023 , H01L2924/01027 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01047 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/014 , H01L2924/04953 , H01L2924/0665 , H01L2924/07802 , H01L2924/181 , H01L2924/351 , H01L2924/00 , H01L2924/00012 , H01L2224/45015 , H01L2924/207 , H01L2224/45099
摘要： A photosensitive adhesive capable of alkali development, the photosensitive adhesive exhibiting adhesion property for an adherend after it has been patterned by light exposure and development, the photosensitive adhesive being used in a method for producing a semiconductor device 100 comprising a step of patterning the photosensitive adhesive 1 provided on a circuit surface of a semiconductor chip 20 by light exposure and development; and a step of directly bonding another semiconductor chip 21 to the patterned photosensitive adhesive 1.
摘要翻译： 一种能够进行碱显影的感光性粘合剂，该感光性粘合剂在通过曝光和显影进行图案化后，对被粘物具有粘合性，该感光性粘接剂用于半导体装置100的制造方法中，其特征在于， 1，通过曝光和显影设置在半导体芯片20的电路表面上; 以及将另一半导体芯片21直接结合到图案化感光性粘接剂1的工序。
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7.发明申请ADHESIVE COMPOSITION, SEMICONDUCTOR DEVICE MAKING USE THEREOF, AND PRODUCTION METHOD THEREOF 审中-公开胶粘组合物，其半导体器件及其制造方法公开(公告)号：US20120256326A1
公开(公告)日：2012-10-11
申请号：US13509355
申请日：2010-11-10
IPC分类号： C09J163/00 , H01L29/02 , C09J163/02 , H01L21/50
CPC分类号： H01L23/3128 , C08F220/32 , C08F222/1006 , C09J4/06 , H01L21/565 , H01L21/67115 , H01L21/6836 , H01L24/27 , H01L24/29 , H01L24/32 , H01L24/48 , H01L24/73 , H01L24/83 , H01L24/94 , H01L25/0657 , H01L25/50 , H01L2224/29 , H01L2224/2919 , H01L2224/2929 , H01L2224/29311 , H01L2224/29339 , H01L2224/29344 , H01L2224/29347 , H01L2224/29355 , H01L2224/29386 , H01L2224/32145 , H01L2224/32225 , H01L2224/48091 , H01L2224/48221 , H01L2224/48227 , H01L2224/73265 , H01L2224/83191 , H01L2224/838 , H01L2224/92 , H01L2224/92247 , H01L2224/94 , H01L2225/0651 , H01L2924/00013 , H01L2924/00014 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01012 , H01L2924/01013 , H01L2924/01019 , H01L2924/0102 , H01L2924/01023 , H01L2924/01029 , H01L2924/01033 , H01L2924/0104 , H01L2924/01047 , H01L2924/0105 , H01L2924/01051 , H01L2924/01075 , H01L2924/01079 , H01L2924/01084 , H01L2924/0665 , H01L2924/09701 , H01L2924/10253 , H01L2924/181 , H01L2224/83 , H01L2224/85 , H01L2224/03 , H01L2924/00 , H01L2924/00012 , H01L2924/3512 , H01L2924/05432 , H01L2224/29099 , H01L2224/29199 , H01L2224/29299 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： Disclosed is an adhesive composition used for adhesion of a semiconductor chip which contains a radiation polymerizable compound, a photoinitiator, and a thermosetting resin. When the adhesive composition forming an adhesive layer is brought to a B-stage by irradiation with light, the surface of the adhesive layer has a tack force of 200 gf/cm2 or less at 30° C. and 200 gf/cm2 or more at 120° C.
摘要翻译： 公开了一种用于粘合含有可辐射聚合化合物，光引发剂和热固性树脂的半导体芯片的粘合剂组合物。 当通过照射使形成粘合剂层的粘合剂组合物达到B阶时，粘合剂层的表面在30℃下具有200gf / cm 2以下的粘合力，在30℃下具有200gf / cm 2以上的粘着力 120°C
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8.发明申请METHOD FOR MANUFACTURING FILM-LIKE ADHESIVE, ADHESIVE SHEET, SEMICONDUCTOR DEVICE, AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE 审中-公开制造薄膜粘合剂的方法，粘合片，半导体器件以及制造半导体器件的方法公开(公告)号：US20120248634A1
公开(公告)日：2012-10-04
申请号：US13509370
申请日：2010-11-10
CPC分类号： H01L24/27 , H01L21/6836 , H01L24/29 , H01L24/32 , H01L24/73 , H01L24/83 , H01L25/0657 , H01L2221/68327 , H01L2224/274 , H01L2224/2919 , H01L2224/32145 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/73265 , H01L2224/83191 , H01L2224/83855 , H01L2224/92247 , H01L2225/0651 , H01L2225/06568 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01012 , H01L2924/01013 , H01L2924/01015 , H01L2924/01019 , H01L2924/0102 , H01L2924/01023 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/0104 , H01L2924/01047 , H01L2924/0105 , H01L2924/01051 , H01L2924/01075 , H01L2924/01079 , H01L2924/01082 , H01L2924/01084 , H01L2924/04953 , H01L2924/0665 , H01L2924/07802 , H01L2924/09701 , H01L2924/10253 , H01L2924/12042 , H01L2924/12044 , H01L2924/15747 , H01L2924/181 , H01L2924/3025 , Y10T428/2809 , H01L2924/00014 , H01L2924/00 , H01L2924/3512 , H01L2924/00012
摘要： The method for manufacturing a film-like adhesive according to the present invention includes: applying an adhesive composition comprising (A) a radiation-polymerizable compound, (B) a photoinitiator and (C) a thermosetting resin, and having a solvent content of 5% by mass or lower and being liquid at 25° C., on a base material to thereby form an adhesive composition layer; and irradiating the adhesive composition layer with light to thereby form the film-like adhesive.
摘要翻译： 根据本发明的膜状粘合剂的制造方法包括：涂布粘合剂组合物，其包含（A）辐射聚合性化合物，（B）光引发剂和（C）热固性树脂，溶剂含量为5 质量％以下，在25℃下为液体，在基材上形成粘合剂组合物层; 并用光照射粘合剂组合物层，从而形成膜状粘合剂。
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9.发明申请PHOTOSENSITIVE ADHESIVE COMPOSITION, PHOTOSENSITIVE FILM ADHESIVE, ADHESIVE PATTERN, SEMICONDUCTOR WAFER WITH ADHESIVE, SEMICONDUCTOR DEVICE AND ELECTRONIC COMPONENT 审中-公开光敏胶粘剂组合物，感光胶粘剂，粘合剂图案，带有粘合剂，半导体器件和电子部件的半导体滤波器公开(公告)号：US20110159238A1
公开(公告)日：2011-06-30
申请号：US13060679
申请日：2009-08-26
CPC分类号： C09J4/00 , C08G73/1042 , C08G73/1046 , C08G73/106 , C08G73/1082 , C08L63/00 , C08L79/08 , C08L2666/02 , C08L2666/20 , C08L2666/22 , C09J4/06 , C09J163/00 , C09J179/08 , G03F7/038 , G03F7/70383 , H01L21/6836 , H01L24/27 , H01L24/29 , H01L24/48 , H01L24/73 , H01L24/83 , H01L25/50 , H01L2224/16 , H01L2224/274 , H01L2224/2919 , H01L2224/32145 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/73265 , H01L2224/83191 , H01L2224/83192 , H01L2224/83194 , H01L2224/83856 , H01L2224/92247 , H01L2225/06513 , H01L2924/00014 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01012 , H01L2924/01013 , H01L2924/01019 , H01L2924/0102 , H01L2924/01023 , H01L2924/01029 , H01L2924/01033 , H01L2924/0104 , H01L2924/01044 , H01L2924/01046 , H01L2924/01047 , H01L2924/0105 , H01L2924/01051 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/0665 , H01L2924/10253 , H01L2924/12041 , H01L2924/15788 , H01L2924/181 , H01L2924/351 , Y10T428/24355 , Y10T428/287 , Y10T428/31518 , H01L2924/00 , H01L2924/3512 , H01L2924/00012 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： A photosensitive adhesive composition that can form an adhesive layer on an adherend and allows an adhesive pattern to be formed by exposure treatment with radiation and developing treatment with a developing solution, the photosensitive adhesive composition having solubility and developability, and the film thickness T1 (μm) of the adhesive pattern formed after development satisfying the conditions represented by the following expression (1). (T1/T0)×100≧90 (1) [In expression (1), T0 represents the film thickness (μm) of the adhesive layer before developing treatment.]
摘要翻译： 一种感光性粘合剂组合物，其可以在被粘物上形成粘合剂层，并通过曝光处理形成粘合剂图案，并用显影液进行显影处理，该感光性粘合剂组合物具有溶解性和显影性，并且膜厚度T1（μm ）形成的粘合剂图案满足以下表达式（1）表示的条件。 （T1 / T0）×100≥90（1）[表达式（1）中，T0表示显影处理前的粘合剂层的膜厚（μm）]
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公开(公告)号：US20120282547A1
公开(公告)日：2012-11-08
申请号：US13551816
申请日：2012-07-18
IPC分类号： G03F7/004
CPC分类号： C09J4/00 , C08G65/3322 , C08G65/33306 , C08G2650/50 , C08L71/02 , C08L79/08 , C08L2666/20 , C08L2666/22 , C09J171/02 , C09J179/08 , H01L21/6836 , H01L23/3121 , H01L24/27 , H01L24/29 , H01L24/48 , H01L24/73 , H01L24/83 , H01L24/85 , H01L2221/68327 , H01L2224/05554 , H01L2224/274 , H01L2224/2919 , H01L2224/32145 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/73265 , H01L2224/83191 , H01L2224/83855 , H01L2224/85 , H01L2224/92247 , H01L2924/00014 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01012 , H01L2924/01015 , H01L2924/01019 , H01L2924/01023 , H01L2924/01027 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01047 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/014 , H01L2924/04953 , H01L2924/0665 , H01L2924/07802 , H01L2924/181 , H01L2924/351 , H01L2924/00 , H01L2924/00012 , H01L2224/45015 , H01L2924/207 , H01L2224/45099
摘要： A photosensitive adhesive capable of alkali development, the photosensitive adhesive exhibiting adhesion property for an adherend after it has been patterned by light exposure and development, the photosensitive adhesive being used in a method for producing a semiconductor device 100 comprising a step of patterning the photosensitive adhesive 1 provided on a circuit surface of a semiconductor chip 20 by light exposure and development; and a step of directly bonding another semiconductor chip 21 to the patterned photosensitive adhesive 1.
摘要翻译： 一种能够进行碱显影的感光性粘合剂，该感光性粘合剂在通过曝光和显影进行图案化后，对被粘物具有粘合性，该感光性粘接剂用于半导体装置100的制造方法中，其特征在于， 1，通过曝光和显影设置在半导体芯片20的电路表面上; 以及将另一半导体芯片21直接结合到图案化感光性粘接剂1的工序。
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