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1.
公开(公告)号:US20110048615A1
公开(公告)日:2011-03-03
申请号:US12874659
申请日:2010-09-02
申请人: Hironori Fukaya , Yuzo Shimobeppu , Kazuhiro Yoshimoto , Kazuo Teshirogi , Kazuyuki Uragou , Mika Sakamoto , Masaya Tazawa
发明人: Hironori Fukaya , Yuzo Shimobeppu , Kazuhiro Yoshimoto , Kazuo Teshirogi , Kazuyuki Uragou , Mika Sakamoto , Masaya Tazawa
CPC分类号: H01L21/6836 , H01L21/304 , H01L2221/6834 , Y10T428/24521 , Y10T428/2848
摘要: A method for manufacturing a semiconductor device includes adhering an adhesive layer of a surface protective tape including a base material film, an intermediate layer disposed on the base material film, and the adhesive layer disposed on the intermediate layer to one surface of a semiconductor substrate; curing the intermediate layer while a flat plate is pressed against the base material film of the surface protective tape; grinding the other surface of the semiconductor substrate; curing the adhesive layer; and separating the surface protective tape from the semiconductor substrate.
摘要翻译: 一种半导体器件的制造方法,其特征在于,将设置在基材膜上的中间层和设置在中间层上的粘合剂层的表面保护带的粘合层粘合到半导体基板的一个面上, 固化中间层,同时将平板压在表面保护带的基材膜上; 研磨半导体衬底的另一个表面; 固化粘合层; 并且将表面保护带与半导体衬底分离。
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2.
公开(公告)号:US08444799B2
公开(公告)日:2013-05-21
申请号:US12874659
申请日:2010-09-02
申请人: Hironori Fukaya , Yuzo Shimobeppu , Kazuhiro Yoshimoto , Kazuo Teshirogi , Kazuyuki Uragou , Mika Sakamoto , Masaya Tazawa
发明人: Hironori Fukaya , Yuzo Shimobeppu , Kazuhiro Yoshimoto , Kazuo Teshirogi , Kazuyuki Uragou , Mika Sakamoto , Masaya Tazawa
IPC分类号: B32B37/00
CPC分类号: H01L21/6836 , H01L21/304 , H01L2221/6834 , Y10T428/24521 , Y10T428/2848
摘要: A method for manufacturing a semiconductor device includes adhering an adhesive layer of a surface protective tape including a base material film, an intermediate layer disposed on the base material film, and the adhesive layer disposed on the intermediate layer to one surface of a semiconductor substrate; curing the intermediate layer while a flat plate is pressed against the base material film of the surface protective tape; grinding the other surface of the semiconductor substrate; curing the adhesive layer; and separating the surface protective tape from the semiconductor substrate.
摘要翻译: 一种半导体器件的制造方法,其特征在于,将设置在所述基材膜上的中间层和设置在所述中间层上的所述粘合剂层的表面保护带的粘合层粘合到半导体基板的一个面上, 固化中间层,同时将平板压在表面保护带的基材膜上; 研磨半导体衬底的另一个表面; 固化粘合层; 并且将表面保护带与半导体衬底分离。
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