公开(公告)号：US20100069539A1

公开(公告)日：2010-03-18

申请号：US12517493

申请日：2007-12-04

申请人： Kei Morimoto ,  Yasushi Yamanaka

发明人： Kei Morimoto ,  Yasushi Yamanaka

IPC分类号： C08K5/3492 ,  C08K5/51 ,  C08K5/49

CPC分类号： C08K5/49 ,  C07F9/067 ,  C07F9/301 ,  C08J5/043 ,  C08L71/126 ,  C08L77/00 ,  C08L2666/20

摘要： To provide a flame-retardant polyamide resin composition generally excellent in flame resistance, mechanical characteristics and electrical characteristics, and suitable for electrics/electronics components and vehicles. Used is a flame-retardant polyamide resin composition comprising, a polyamide resin (A), a phosphorus-containing flame retarder (B), and glass fiber having a non-circular cross-section (C), wherein the contents in the composition are 15 to 78% by weight for the polyamide resin (A), 2 to 20% by weight for the phosphorus-containing flame retarder (B), and 20 to 65% by weight for the glass fiber having a non-circular cross-section (C).

摘要翻译： 提供通常具有优异的阻燃性，机械特性和电特性的阻燃聚酰胺树脂组合物，并且适用于电气/电子部件和车辆。 使用的是阻燃聚酰胺树脂组合物，其包含聚酰胺树脂（A），含磷阻燃剂（B）和具有非圆形横截面（C）的玻璃纤维，其中组合物中的含量为 对于聚酰胺树脂（A）为15〜78重量％，含磷阻燃剂（B）为2〜20重量％，对于具有非圆形截面的玻璃纤维为20〜65重量％ （C）。

公开(公告)号：US20100009158A1

公开(公告)日：2010-01-14

申请号：US12302257

申请日：2007-05-24

申请人： Hiroyuki Imaizumi ,  Yasushi Yamanaka ,  Kei Morimoto

发明人： Hiroyuki Imaizumi ,  Yasushi Yamanaka ,  Kei Morimoto

IPC分类号： B29B11/16 ,  C08J5/04 ,  B29C47/00 ,  B29C45/00 ,  B29B9/14

CPC分类号： B29C45/0005 ,  B29B9/14 ,  B29C47/0004 ,  B29C47/0009 ,  B29C70/12 ,  B29K2067/00 ,  B29K2067/006 ,  B29K2077/00 ,  B29K2105/06 ,  B29K2105/08 ,  C08J5/04 ,  C08J5/046 ,  C08J2367/02 ,  C08J2377/00 ,  C08K7/02 ,  Y10T428/249922 ,  Y10T428/24994 ,  Y10T428/249946

摘要： Provided is a fiber-reinforced thermoplastic resin molded article, which contains reinforcing fibers having a given flattened cross-sectional profile, in which the fiber length distribution of the reinforcing fibers is shifted on the side of long fibers, and which is excellent in mechanical strength, heat resistance, dimensional accuracy such as warpage resistance, and surface appearance.A fiber-reinforced thermoplastic resin molded article of a thermoplastic resin composition comprising from 70 to 35% by weight of a thermoplastic resin (A), and from 30 to 65% by weight of reinforcing fibers (B) of which the cross section is flattened to have a degree of flatness, as expressed by the formula mentioned below, of at least 2.3, wherein the weight-average fiber length of the reinforcing fibers in the molded article is at least 1 mm: Degree of flatness=major diameter of reinforcing fiber (a)/minor diameter of reinforcing fiber (b).

摘要翻译： 本发明提供一种纤维增强热塑性树脂成型体，其含有具有给定的扁平截面形状的增强纤维，其中增强纤维的纤维长度分布在长纤维侧移动，机械强度优异 耐热性，抗翘曲性等尺寸精度和表面外观。 一种热塑性树脂组合物的纤维增强热塑性树脂成型体，其包含70〜35重量％的热塑性树脂（A）和30〜65重量％的所述横截面为扁平的增强纤维（B） 具有如下公式所示的平坦度为至少2.3，其中模制品中的增强纤维的重均纤维长度为至少1mm：平坦度=增强纤维的大直径 （a）/增强纤维的小直径（b）。

公开(公告)号：US20070243343A1

公开(公告)日：2007-10-18

申请号：US11662518

申请日：2005-09-07

申请人： Hiroyuki Imaizumi ,  Motonori Ueda ,  Kouji Nishida ,  Kei Morimoto

发明人： Hiroyuki Imaizumi ,  Motonori Ueda ,  Kouji Nishida ,  Kei Morimoto

IPC分类号： B60R13/00

CPC分类号： B29C45/0005 ,  B29C70/16 ,  B29K2067/00 ,  B29K2069/00 ,  B29K2077/00 ,  B29K2101/12 ,  B29L2031/3005 ,  Y10T428/1314 ,  Y10T428/1352 ,  Y10T428/249928 ,  Y10T428/31725

摘要： The object the present invention is to provide an exterior molding body for automobile which is reinforced by a long fiber, is excellent in mechanical properties such as bending elastic modulus and bending strength, chemical resistance and heat resistance, is lightened, has high designability and is reduced in the anisotropy of linear expansion coefficient of molding body caused by the fiber orientation at filling thereof to a mold.

摘要翻译： 本发明的目的是提供一种由长纤维增强的汽车用外用成型体，弯曲弹性模量和弯曲强度，耐化学性，耐热性等机械性能优异，设计性高，成型性高 降低了在将其填充到模具时由纤维取向引起的成型体的线膨胀系数的各向异性。

公开(公告)号：US06855755B1

公开(公告)日：2005-02-15

申请号：US09630998

申请日：2000-08-02

申请人： Kei Morimoto ,  Noriyoshi Watanabe ,  Hiroshi Urabe ,  Masaki Hirono ,  Kazuo Yamamiya

发明人： Kei Morimoto ,  Noriyoshi Watanabe ,  Hiroshi Urabe ,  Masaki Hirono ,  Kazuo Yamamiya

IPC分类号： C08K5/13 ,  C08K5/3435 ,  C08K5/3475 ,  C08L77/00 ,  C08L77/02 ,  C08L77/06 ,  C08L77/10

CPC分类号： C08L77/02 ,  C08K5/13 ,  C08K5/3435 ,  C08K5/3475 ,  C08L77/00 ,  C08L77/06 ,  C08L77/10

摘要： The present invention relates to a polyamide resin composition comprising: 100 parts by weight of a polyamide resin mixture comprising (A) 20 to 90% by weight of a polyamide 6 resin, a polyamide 66 resin or mixture thereof and (B) 10 to 80% by weight of an aromatic polyamide resin; and (C) 0 to 300 parts by weight of an inorganic filler, said aromatic polyamide resin being having diamine units comprising 10 to 50 mol % of paraxylylenediamine units and 50 to 90 mol % of methaxylylenediamine units, and aliphatic dicarboxylic acid units.

摘要翻译： 本发明涉及一种聚酰胺树脂组合物，其包含：100重量份的聚酰胺树脂混合物，其包含（A）20至90重量％的聚酰胺6树脂，聚酰胺66树脂或其混合物，和（B）10至80 重量％的芳族聚酰胺树脂; 和（C）0至300重量份的无机填料，所述芳族聚酰胺树脂具有包含10〜50摩尔％的对苯二甲苯单元和50〜90摩尔％的甲苯二胺单元的二胺单元和脂肪族二羧酸单元。

公开(公告)号：US20050173498A1

公开(公告)日：2005-08-11

申请号：US11068527

申请日：2005-02-28

申请人： Nobuki Mori ,  Kei Morimoto

发明人： Nobuki Mori ,  Kei Morimoto

IPC分类号： B23K1/00 ,  B23K35/02 ,  B23K35/26 ,  H01L21/60 ,  H01L23/488 ,  B23K31/02

CPC分类号： H01L24/83 ,  B23K1/0016 ,  B23K35/0227 ,  B23K35/262 ,  B23K2101/40 ,  H01L23/488 ,  H01L24/29 ,  H01L2224/29 ,  H01L2224/29101 ,  H01L2224/29111 ,  H01L2224/2919 ,  H01L2224/29311 ,  H01L2224/83801 ,  H01L2924/00013 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/0104 ,  H01L2924/01042 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01052 ,  H01L2924/01072 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/10253 ,  H01L2924/15747 ,  H01L2924/00 ,  H01L2924/01026 ,  H01L2924/01028 ,  H01L2924/3512 ,  H01L2924/00015 ,  H01L2924/00012 ,  H01L2924/00014 ,  H01L2224/29099 ,  H01L2224/29199 ,  H01L2224/29299 ,  H01L2224/2929

摘要： In conventional Sn/Sb type brazing filler metals, there are disadvantages that large grains in a β′ phase are likely to deposit and that cracks are likely to occur in the elements and the bonded portion, and that voids are formed when the above described special coating is provided on the die bonding plane of the semiconductor element. The brazing filler metal of the present invention comprises 5 to 20 weight % of Sb and 0.01 to 5 weight % of Te, with the balance being Sn and incidental impurities, or a brazing filler metal comprises 5 to 20 weight % of Sb, 0.01 to 5 weight % of Te, 0.001 to 0.5 weight % of P, with the balance being Sn and incidental impurities.

摘要翻译： 在常规的Sn / Sb型钎料中，存在β'相中的大晶粒很可能沉积并且在元件和接合部分中容易发生裂纹的缺点，并且当上述特殊的 在半导体元件的芯片接合面上设置涂层。 本发明的钎料含有5〜20重量％的Sb和0.01〜5重量％的Te，余量为Sn和偶然的杂质，或者钎料中含有5〜20重量％的Sb，0.01〜 5重量％的Te，0.001〜0.5重量％的P，余量为Sn和杂质。

公开(公告)号：US08053500B2

公开(公告)日：2011-11-08

申请号：US12517493

申请日：2007-12-04

申请人： Kei Morimoto ,  Yasushi Yamanaka

发明人： Kei Morimoto ,  Yasushi Yamanaka

IPC分类号： C08K5/3492 ,  C08K5/49 ,  C08K5/5313 ,  C08K5/04 ,  C08K5/09 ,  C08K7/02 ,  C08K3/38

CPC分类号： C08K5/49 ,  C07F9/067 ,  C07F9/301 ,  C08J5/043 ,  C08L71/126 ,  C08L77/00 ,  C08L2666/20

摘要： To provide a flame-retardant polyamide resin composition generally excellent in flame resistance, mechanical characteristics and electrical characteristics, and suitable for electrics/electronics components and vehicles. Used is a flame-retardant polyamide resin composition comprising, a polyamide resin (A), a phosphorus-containing flame retarder (B), and glass fiber having a non-circular cross-section (C), wherein the contents in the composition are 15 to 78% by weight for the polyamide resin (A), 2 to 20% by weight for the phosphorus-containing flame retarder (B), and 20 to 65% by weight for the glass fiber having a non-circular cross-section (C).

摘要翻译： 提供通常具有优异的阻燃性，机械特性和电特性的阻燃聚酰胺树脂组合物，并且适用于电气/电子部件和车辆。 使用的是阻燃聚酰胺树脂组合物，其包含聚酰胺树脂（A），含磷阻燃剂（B）和具有非圆形横截面（C）的玻璃纤维，其中组合物中的含量为 对于聚酰胺树脂（A）为15〜78重量％，含磷阻燃剂（B）为2〜20重量％，对于具有非圆形截面的玻璃纤维为20〜65重量％ （C）。

公开(公告)号：US07858172B2

公开(公告)日：2010-12-28

申请号：US12302257

申请日：2007-05-24

申请人： Hiroyuki Imaizumi ,  Yasushi Yamanaka ,  Kei Morimoto

发明人： Hiroyuki Imaizumi ,  Yasushi Yamanaka ,  Kei Morimoto

IPC分类号： B32B27/04

CPC分类号： B29C45/0005 ,  B29B9/14 ,  B29C47/0004 ,  B29C47/0009 ,  B29C70/12 ,  B29K2067/00 ,  B29K2067/006 ,  B29K2077/00 ,  B29K2105/06 ,  B29K2105/08 ,  C08J5/04 ,  C08J5/046 ,  C08J2367/02 ,  C08J2377/00 ,  C08K7/02 ,  Y10T428/249922 ,  Y10T428/24994 ,  Y10T428/249946

摘要： Provided is a fiber-reinforced thermoplastic resin molded article, which contains reinforcing fibers having a given flattened cross-sectional profile, in which the fiber length distribution of the reinforcing fibers is shifted on the side of long fibers, and which is excellent in mechanical strength, heat resistance, dimensional accuracy such as warpage resistance, and surface appearance.

摘要翻译： 本发明提供一种纤维增强热塑性树脂成型体，其含有具有给定的扁平截面形状的增强纤维，其中增强纤维的纤维长度分布在长纤维侧移动，机械强度优异 耐热性，抗翘曲性等尺寸精度和表面外观。

公开(公告)号：US20100227122A1

公开(公告)日：2010-09-09

申请号：US12087482

申请日：2006-12-19

申请人： Teruhisa Kumazawa ,  Takahiro Takano ,  Kei Morimoto

发明人： Teruhisa Kumazawa ,  Takahiro Takano ,  Kei Morimoto

IPC分类号： C08K3/40 ,  C08K3/34 ,  B32B3/30

CPC分类号： C08L77/00 ,  B29C45/0001 ,  B29C45/0005 ,  B29K2077/00 ,  B29L2031/445 ,  C08J5/047 ,  C08J5/08 ,  C08J2377/00 ,  C08J2377/02 ,  C08J2377/06 ,  C08K7/14 ,  C08K2201/016 ,  C08L53/02 ,  C08L53/025 ,  C08L77/02 ,  C08L77/06 ,  C08L2205/02 ,  C08L2666/20 ,  C08L2666/24

摘要： Provided is a polyamide resin composition having particularly excellent strength and low warpage by virtue of being compounded with a glass fiber and suited as a material for portable electronic devices that are becoming thinner and lighter in weight in recent years.A polyamide resin composition for a portable electronic device, including (A) a polyamide resin, (B) a glass fiber having an elongated cross-section with an aspect ratio, defined by the formula shown below, of 2.5 or more, and optionally (C) a glass fiber having a circular cross-section with a diameter of 3 to 30 μm, wherein the ratio (by weight) of the component (B) to the component (c) is 3:7 to 10:0, wherein the proportion of the component (A) is 60 to 34% by weight, and the proportion of the component (B) or the proportion of the sum of the components (B) and (C) is 40 to 66% by weight with the proviso that the total sum of the above components is 100% by weight, and wherein the polyamide composition shows a tensile strength of 200 MPa or higher as measured for an ISO test piece thereof, Aspect ratio=(Major axis length D2 of the cross-section of the glass fiber)/(Minor axis length D1 of the cross-section of the glass fiber).

摘要翻译： 本发明提供一种具有特别优异的强度和低翘曲的聚酰胺树脂组合物，其与玻璃纤维复合，并且适合作为近年来变得越来越薄且重量更轻的便携式电子设备的材料。 一种用于便携式电子设备的聚酰胺树脂组合物，其包含（A）聚酰胺树脂，（B）具有由下式表示的纵横比的细长横截面为2.5或更大的玻璃纤维，以及任选（ C）具有直径为3至30μm的圆形横截面的玻璃纤维，其中组分（B）与组分（c）的重量比（重量）为3:7至10:0，其中 成分（A）的比例为60〜34重量％，成分（B）的比例或成分（B）和（C）之和的比例为40〜66重量％，条件是 上述成分的总量为100重量％，其中聚酰胺组合物的ISO试验片的拉伸强度为200MPa以上，纵横比=（截面的主轴长度D2 的玻璃纤维）/（玻璃纤维的横截面的小轴长度D1）。

公开(公告)号：US07644855B2

公开(公告)日：2010-01-12

申请号：US11068527

申请日：2005-02-28

申请人： Nobuki Mori ,  Kei Morimoto

发明人： Nobuki Mori ,  Kei Morimoto

IPC分类号： B23K31/02

CPC分类号： H01L24/83 ,  B23K1/0016 ,  B23K35/0227 ,  B23K35/262 ,  B23K2101/40 ,  H01L23/488 ,  H01L24/29 ,  H01L2224/29 ,  H01L2224/29101 ,  H01L2224/29111 ,  H01L2224/2919 ,  H01L2224/29311 ,  H01L2224/83801 ,  H01L2924/00013 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/0104 ,  H01L2924/01042 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01052 ,  H01L2924/01072 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/10253 ,  H01L2924/15747 ,  H01L2924/00 ,  H01L2924/01026 ,  H01L2924/01028 ,  H01L2924/3512 ,  H01L2924/00015 ,  H01L2924/00012 ,  H01L2924/00014 ,  H01L2224/29099 ,  H01L2224/29199 ,  H01L2224/29299 ,  H01L2224/2929

摘要： In conventional Sn/Sb type brazing filler metals, there are disadvantages that large grains in a β′ phase are likely to deposit and that cracks are likely to occur in the elements and the bonded portion, and that voids are formed when the above described special coating is provided on the die bonding plane of the semiconductor element. The brazing filler metal of the present invention comprises 5 to 20 weight % of Sb and 0.01 to 5 weight % of Te, with the balance being Sn and incidental impurities, or a brazing filler metal comprises 5 to 20 weight % of Sb, 0.01 to 5 weight % of Te, 0.001 to 0.5 weight % of P, with the balance being Sn and incidental impurities.

摘要翻译： 在常规的Sn / Sb型钎料中，存在β'相中的大晶粒很可能沉积并且在元件和接合部分中容易发生裂纹的缺点，并且当上述特殊的 在半导体元件的芯片接合面上设置涂层。 本发明的钎料含有5〜20重量％的Sb和0.01〜5重量％的Te，余量为Sn和偶然的杂质，或者钎料中含有5〜20重量％的Sb，0.01〜 5重量％的Te，0.001〜0.5重量％的P，余量为Sn和杂质。

公开(公告)号：US20090280311A1

公开(公告)日：2009-11-12

申请号：US12302095

申请日：2007-05-25

申请人： Teruhisa Kumazawa ,  Kei Morimoto

发明人： Teruhisa Kumazawa ,  Kei Morimoto

IPC分类号： C08K3/40 ,  C08L77/00 ,  C08K3/34

CPC分类号： C08L77/00 ,  C08K7/00 ,  C08K7/02 ,  C08L77/06 ,  C08L2205/02 ,  C08L2205/14 ,  C08L2205/16 ,  C08L2666/20

摘要： In the present invention, there is provided a polyamide resin composition for portable electronic devices, which is excellent in mechanical strength, thin-wall moldability, crystallinity and warping property.A polyamide resin composition comprising 30 to 80% by weight of a polyamide MP (A), 20 to 70% by weight of a polyamide resin (B) having a melting point not less than 245° C. (with the total amount of both being 100% by weight). The composition additionally comprises a filler (C) comprising a fibrous filler (C1) as an optional component and a plate-like filler (C2) as an essential component, wherein a content ratio (C1):(C2) is 0:10 to 9:1. The filler (C) is present in an amount of 30 to 250 parts by weight per 100 parts by weight of the sum of the polyamide MP (A) and the polyamide resin (B). The polyamide MP (A) is a polyamide resin obtained by polycondensation of a mixed diamine, which comprises 90 to 50% by mole of metaxylylenediamine and 10 to 50% by mole of paraxylylenediamine, with an α,ω-linear aliphatic dibasic acid and/or an aromatic dibasic acid.

摘要翻译： 在本发明中，提供了机械强度，薄壁成型性，结晶性和翘曲性优异的便携式电子器件用聚酰胺树脂组合物。 一种聚酰胺树脂组合物，其包含30〜80重量％的聚酰胺MP（A），20〜70重量％的熔点不低于245℃的聚酰胺树脂（B）（两者的总量 为100重量％）。 所述组合物还含有包含作为任选成分的纤维状填料（C1）和作为必需成分的板状填料（C2））的填料（C），其中，含量比（C1）：（C2）为0:10〜 9：1。 填料（C）的存在量为每100重量份聚酰胺MP（A）和聚酰胺树脂（B）之和为30至250重量份。 聚酰胺MP（A）是通过将包含90〜50摩尔％的间苯二甲胺和10〜50摩尔％的对二甲苯二胺的混合二胺与α，ω-直链脂肪族二元酸和/ 或芳族二元酸。