摘要:
An image forming apparatus includes plural image holders that hold an image; plural development devices that produce an image on the plural image holders; an intermediate transfer body supported by plural support members; plural first transfer devices that transfer images that are present on the plural image holders to the intermediate transfer body; a second transfer device that transfers a composite image from the intermediate transfer body onto a recording medium; a fixing device that fixes the composite image onto the recording medium; an ejection device that ejects the recording medium having the composite image transferred thereto out of the image forming apparatus main body; and a recording medium stacking part where ejected recording media are stacked.
摘要:
To provide an embossing device, an embossing method and an embossed can which are capable of conducting embossing having a non-shaped section and an arbitral number of embossed areas, and are capable of improving quality or productivity.An embossed can 10 is a double-embossed surface can in which on a can barrel 101 a first pattern 104 is printed; a first concave part 105 is formed in the state that it is so positioned as to almost conform to the first pattern 104; a second pattern 106 is printed at a position which is distant in the circumferential direction with the non-shaped section therebetween; and a second concave portion 107 is formed in the state that it is so positioned as to almost conform to the second pattern 106.
摘要:
An image forming apparatus includes: an image holder that holds an image; a conveying member that conveys an image transferred from the image holder or a recording medium with the image transferred from the image holder thereto; an image holder supporting part that supports the image holder; and a conveying member supporting part that is a separate body from the image holder supporting part and supports the conveying member such that the conveying member is openable and closable.
摘要:
An expansion valve unit having a pressure detecting function includes a supercooling control expansion valve disposed in a flow path of a refrigerant sent into an evaporator of a refrigeration system constituting a refrigerating cycle to control the flow rate of the refrigerant. A pressure detector is provided at one end of the supercooling control expansion valve to detect the pressure of the refrigerant sent thereto through a passage in the expansion valve. The supercooling control expansion valve and the pressure detector are integrated with each other by a joining means.
摘要:
A manufacturing method for rayon having ion-generating characteristics, featuring a ceramic content comprising 10-40% tourmaline by weight, 10-40% serpentine by weight, and 40-80% silica by weight. The ceramics are subjected to dry pulverization processing to achieve particle diameters of 2-10 &mgr;m, and then to wet pulverization processing to make ceramic fine particle powder with average particle diameters under 0.5 &mgr;m. The ceramic fine particle powder is then mixed as ceramic solids in viscose so that the ceramic content by weight is 15-35% that of cellulose. The viscose is mixed by quantitatively and continuously adding the above dispersion of ceramic in water with a vacuum-sealed agitator device installed in the viscose pipe circuit just prior to spinning of the viscose.
摘要:
The object of the present invention is to provide a pressure sensor comprising a pressure sensing element of a plurality of resistors on a semiconductor board, wherein said pressure sensing element is fixed inside the housing firmly and airtightly. A pressure sensor 10 comprising a housing 11 made of metal material, and a pressure sensing element mounted on a semiconductor board 13 positioned in the interior of said housing for sensing pressure, wherein said housing 11 comprises a liquid induction hole 11d, an inner area connecting to said liquid induction hole and having an opening in an upper portion, and an annular protrusion 11g formed in the peripheral of an opening of said liquid induction hole at a bottom portion of said inner area, characterized in that said pressure sensing element 13 is welded airtightly to said protrusion 11g of said housing 11 through a seat 21 comprising an opening 21a at the center thereof formed of a pressure sensing element mounting member 21-1 and a stem connecting member 20d, and a stem 20 having an opening 20d at the center thereof.
摘要:
A semiconductor pressure detecting device comprises a package having a pressure introducing hole; a base plate which has a first through hole and is mounted in the package; a base mounted on the base plate; and a semiconductor pressure sensor chip which is mounted on the base; wherein the base plate has a thickened portion formed around the first through hole and is fixed by welding the circumference of the thickened portion onto the package.
摘要:
A pressure sensor comprises a pressure-sensitive coupler body 2 having one end provided with a diaphragm 8 and strain gage 9 stacked together, an intermediate body 3 containing a printed board 21 and encircling the strain gate 9, and a signal-detective coupler body 4 opposed to the pressure-sensitive coupler body 2 via the intermediate body 3 to define a closed chamber in the intermediate body 3. The printed board 21 and the strain gage 9 are electrically connected by terminal elements 13 extended from the strain gage 9 into slidable contact with conductive elements 25 attached to an edge of the printed board 21. Vibrations or impulses produced in the diaphragm 8 are therefore absorbed by a relative displacement between the terminal elements 13 and the conductive elements 25 to protect the printed board 21 against such vibrations or impulses.
摘要:
To achieve higher packaging density and one wafer level for a full-sized wafer memory, or wafer-scale integration memory system, the wafers are vertically stacked with each other at a predetermined interval. A packaging technique is improved in such a way that a memory system layout can be precisely realized and a precise through hole can be formed. Moreover, other chips are fixed on the wafer so as to achieve furthermore the high packaging density.
摘要:
The present invention provides microprocessing and the device therefor which is characterized by radiating proessing pulse laser together with trapping laser to perform the modification and processing of particles and microcapsules.In the case of using such method for implosion, the reaction group is caused to be released by imploding the microcapsule with the reactive goup enclosed to implosion, permitting specified reaction and processing.