Three-dimensional structure forming method
    1.
    发明授权
    Three-dimensional structure forming method 失效
    三维结构成型方法

    公开(公告)号:US07027227B2

    公开(公告)日:2006-04-11

    申请号:US10761293

    申请日:2004-01-22

    IPC分类号: G02B27/10

    摘要: A method for forming a three-dimensional structure made of a photosensitive material on a substrate includes the steps of determining a film thickness of the photosensitive material necessary to form the desired three-dimensional structure, comparing a predetermined maximum film thickness with the film thickness determined by the determining step, and applying, when the film thickness determined by the determining step is greater than the predetermined maximum film thickness, the photosensitive material within the maximum film thickness plural times until the photosensitive material has the film thickness on the substrate.

    摘要翻译: 用于在基板上形成由感光材料制成的三维结构的方法包括以下步骤:确定形成所需三维结构所需的感光材料的膜厚度,将预定最大膜厚与确定的膜厚进行比较 通过确定步骤,并且当由确定步骤确定的膜厚度大于预定最大膜厚度时,将最大膜厚度内的感光材料多次施加,直到感光材料在基板上具有膜厚度为止。

    X-ray mask and fabrication process using it
    2.
    发明授权
    X-ray mask and fabrication process using it 失效
    X射线掩模和使用它的制作工艺

    公开(公告)号:US5870448A

    公开(公告)日:1999-02-09

    申请号:US855473

    申请日:1997-05-13

    CPC分类号: G03F1/22 G21K1/10

    摘要: The present X-ray mask comprises an X-ray transmitting film, and a mask pattern formed on the X-ray transmitting film, wherein the mask pattern includes a mixture of a high-contrast pattern and a low-contrast pattern against X-rays and wherein the high-contrast pattern is comprised of stacked films the number of which is larger than that of the low-contrast pattern and which are made of different kinds of materials. A fabrication process of this X-ray mask comprises a step of forming a first metal film; a step of forming a second metal film of a different kind of material from the first metal film, thereon; and a step of successively performing a resist application process and an etching process to form a portion where the both first and second metal films are removed, a portion where only the first metal layer is left, and a portion where the both first and second metal layers are left, thereby forming a mask pattern.

    摘要翻译: 本X射线掩模包括X射线透射膜和形成在X射线透射膜上的掩模图案,其中掩模图案包括针对X射线的高对比度图案和低对比度图案的混合物 并且其中所述高对比度图案包括数量大于所述低对比度图案并且由不同种类的材料制成的堆叠薄膜。 该X射线掩模的制造工艺包括形成第一金属膜的步骤; 在其上形成与第一金属膜不同种类的材料的第二金属膜的步骤; 以及连续进行抗蚀剂涂布处理和蚀刻工序以形成去除了第一和第二金属膜两者的部分,仅剩下第一金属层的部分,以及第一和第二金属 留下层,从而形成掩模图案。

    Lithographic mask structure and method of producing the same comprising
W and molybdenum alloy absorber
    3.
    发明授权
    Lithographic mask structure and method of producing the same comprising W and molybdenum alloy absorber 失效
    平版印刷掩模结构及其制造方法,包括W和钼合金吸收体

    公开(公告)号:US5733688A

    公开(公告)日:1998-03-31

    申请号:US570686

    申请日:1995-12-11

    IPC分类号: G03F1/22 G03F9/00

    CPC分类号: G03F1/22

    摘要: A mask suitably usable in X-ray lithography has a membrane and a radiation absorbing material pattern formed on the membrane, wherein the radiation absorbing material pattern contains an alloy including tungsten (W) and molybdenum (Mo), the proportion of the molybdenum content to the alloy being in a range of 0.1-50 wt %, the alloy having crystal precedence orientation of {110}. In one preferred form, the absorbing material pattern is provided on an amolphous metal layer formed on the mask membrane.

    摘要翻译: 适用于X射线光刻的掩模具有在膜上形成的膜和辐射吸收材料图案,其中辐射吸收材料图案包含包含钨(W)和钼(Mo)的合金,钼含量与 该合金的范围为0.1-50wt%,晶体优先取向为{110}的合金。 在一个优选形式中,吸收材料图案设置在形成在掩模膜上的淀粉金属层上。

    Lithographic mask structure and lithographic process
    4.
    发明授权
    Lithographic mask structure and lithographic process 失效
    平版印刷掩模结构和光刻工艺

    公开(公告)号:US4735877A

    公开(公告)日:1988-04-05

    申请号:US915376

    申请日:1986-10-06

    IPC分类号: G03F1/22 G03F7/20 G03F7/10

    摘要: There is disclosed a lithographic mask structure which comprises a masking material support film and an annular support substrate for supporting the masking material support film at the periphery, the masking material support film containing a fluorescent substance. Also disclosed is a lithographic process for exposing a photosensitive material to irradiation with a radiation beam through a masking material support film provided with a masking material pattern-wise.

    摘要翻译: 公开了一种光刻掩模结构,其包括掩模材料支撑膜和用于在外围支撑掩模材料支撑膜的环形支撑基板,所述掩模材料支撑膜含有荧光物质。 还公开了一种光刻工艺,用于将感光材料暴露于通过图案化地设置有掩模材料的掩模材料支撑膜的辐射束照射。

    X-ray mask structure, and X-ray exposure method and apparatus using the same
    8.
    发明授权
    X-ray mask structure, and X-ray exposure method and apparatus using the same 失效
    X射线掩模结构和X射线曝光方法及使用其的装置

    公开(公告)号:US06605392B2

    公开(公告)日:2003-08-12

    申请号:US09335494

    申请日:1999-06-18

    IPC分类号: G03F900

    摘要: An X-ray mask structure for use in X-ray lithography includes an X-ray transmission film to be disposed opposed to a workpiece in X-ray exposure, the X-ray transmission film having an X-ray absorptive material corresponding to a pattern to be printed on the workpiece, and a thin film covering at least a portion of the X-ray transmission film, the thin film having an anti-reflection function with respect to alignment light to be projected to the thin film for direct or indirect detection of relative positional deviation between the mask structure and the workpiece.

    摘要翻译: 用于X射线光刻的X射线掩模结构包括在X射线曝光中与工件相对设置的X射线透射膜,X射线透射膜具有对应于图案的X射线吸收材料 被印刷在工件上,薄膜覆盖至少一部分X射线透射膜,薄膜具有相对于对准光的抗反射功能,以投射到薄膜上用于直接或间接检测 掩模结构和工件之间的相对位置偏差。

    Method of manufacturing semiconductor devices by performing coating,
heating, exposing and developing in a low-oxygen or oxygen free
controlled environment
    9.
    发明授权
    Method of manufacturing semiconductor devices by performing coating, heating, exposing and developing in a low-oxygen or oxygen free controlled environment 失效
    通过在低氧或无氧的受控环境中进行涂覆,加热,曝光和显影来制造半导体器件的方法

    公开(公告)号:US6087076A

    公开(公告)日:2000-07-11

    申请号:US968589

    申请日:1997-11-13

    CPC分类号: G03F7/0048

    摘要: A method of manufacturing semiconductor devices includes a coating step for coating a substrate using a resist solution including a base resin and a low-oxygen or oxygen-free solvent in which oxygen is removed by nitrogen bubbling, a heating step for heating the substrate coated with the resist, an exposing step for exposing the substrate with radiation to transfer a pattern, and a developing step for developing the exposed substrate. The coating step, the heating step, the exposing step and the developing step are performed under an environment controlled in a low-oxygen or oxygen-free state.

    摘要翻译: 一种制造半导体器件的方法包括:涂覆步骤,用于使用包含基础树脂的抗蚀剂溶液和通过氮气鼓泡除去氧的低氧或无氧溶剂的涂覆步骤,用于加热涂覆有 抗蚀剂,用于用辐射曝光衬底以转印图案的曝光步骤,以及用于显影曝光的衬底的显影步骤。 涂布步骤,加热步骤,曝光步骤和显影步骤在控制在低氧或无氧状态的环境下进行。

    X-ray mask structure and manufacturing methods including forming a metal
oxide film on a portion of an X-ray permeable film having no X-ray
absorber thereon
    10.
    发明授权
    X-ray mask structure and manufacturing methods including forming a metal oxide film on a portion of an X-ray permeable film having no X-ray absorber thereon 失效
    X射线掩模结构和包括在其上没有X射线吸收体的X射线透过膜的一部分上形成金属氧化物膜的制造方法

    公开(公告)号:US5422921A

    公开(公告)日:1995-06-06

    申请号:US975521

    申请日:1992-11-12

    申请人: Keiko Chiba

    发明人: Keiko Chiba

    CPC分类号: G03F1/22

    摘要: An X-ray mask structure includes an X-ray absorber having a masking pattern, an X-ray permeable film for supporting the X-ray absorber on a surface of the X-ray permeable film, and a supporting frame for supporting the X-ray permeable film. The X-ray mask structure has a metal oxide film formed on a portion of the surface of the X-ray permeable film having no X-ray absorber thereon. Also disclosed is a method for manufacturing such an X-ray mask structure.

    摘要翻译: X射线掩模结构包括具有掩模图案的X射线吸收体,用于在X射线透过膜的表面上支撑X射线吸收体的X射线透过膜,以及用于支撑X射线透过膜的支撑框架, 透射膜。 X射线掩模结构在其上没有X射线吸收体的X射线透过膜的表面的一部分上形成有金属氧化物膜。 还公开了一种用于制造这种X射线掩模结构的方法。