Abstract:
Electrostatic discharge (ESD) protection structures utilizing bipolar conduction are disclosed. The structures each include a parasitic p-n-p bipolar transistor (102); some of the disclosed embodiments include this transistor within a silicon-controlled-rectifier (SCR) type of ESD protection structure. A p+ doped region (116, 216, 316, 416, 516) is disposed at a surface of an n-well (112, 212, 312, 412, 512) overlying a location (115, 215, 315, 415, 515) that receives both the n-well (112, 212, 312, 412, 512) implants and also the p-well (213, 313, 413, 513) implants. Preferably, the well implants are designed to provide retrograde doping profiles. The number of net impurities is reduced, and thus the base Gummel number is lowered, at the compensated well portion (112′, 212′, 312′, 412′, 512′), resulting in improved gain for the vertical bipolar device.
Abstract translation:公开了利用双极导电的静电放电(ESD)保护结构。 所述结构各自包括寄生p-n-p双极晶体管(102); 一些所公开的实施例包括在硅控整流器(SCR)类型的ESD保护结构内的该晶体管。 p +掺杂区域(116,216,316,416,516)设置在覆盖位置(115,215,315,415,515)上的n阱(112,212,312,412,512)的表面上, 其接收n阱(112,212,312,412,512)植入物以及p阱(213,313,413,513)植入物。 优选地,井注入被设计成提供逆向掺杂分布。 在补偿的井部分(112',212',312',412',512'),净杂质的数量减少,从而碱基Gummel数降低,导致垂直双极器件的增益增加。
Abstract:
A output driver architecture (100) is proposed that uses thin gate-oxide core and thin gate-oxide Drain-extended transistors that can directly interface with voltage supplies up to six times the normal rating of the transistor. A bias generator (101), level shifter (103) and output stage (105) are adapted to buffer an input signal with a voltage swing of less than the normal operating voltage of the transistors to an output signal with a voltage swing of up to approximately six times the normal operating voltage of the transistors. The bias generator is interfaced directly with a high voltage power supply and generates a bias voltage with a magnitude of less than the dielectric breakdown of the transistors internal to the level shifter and output stage. Further, the bias generator is adapted to sense the magnitude of the high voltage supply, and to automatically and continuously self-adjust the bias voltage in response to changes sensed in the magnitude of the high voltage supply such that the bias generator can be used for a continuous range of high voltage supplies up to 6 times the normal operating voltage of the transistors.
Abstract:
Electrostatic discharge (ESD) protection structures utilizing bipolar conduction are disclosed. The structures each include a parasitic p-n-p bipolar transistor (102); some of the disclosed embodiments include this transistor within a silicon-controlled-rectifier (SCR) type of ESD protection structure. A p+ doped region (116, 216, 316, 416, 516) is disposed at a surface of an n-well (112, 212, 312, 412, 512) overlying a location (115, 215, 315, 415, 515) that receives both the n-well (112, 212, 312, 412, 512) implants and also the p-well (213, 313, 413, 513) implants. Preferably, the well implants are designed to provide retrograde doping profiles. The number of net impurities is reduced, and thus the base Gummel number is lowered, at the compensated well portion (112′, 212′, 312′, 412′, 512′), resulting in improved gain for the vertical bipolar device.
Abstract translation:公开了利用双极导电的静电放电(ESD)保护结构。 所述结构各自包括寄生p-n-p双极晶体管(102); 一些所公开的实施例包括在硅控整流器(SCR)类型的ESD保护结构内的该晶体管。 p +掺杂区域(116,216,316,416,516)设置在覆盖位置(115,215,315,415,515)上的n阱(112,212,312,412,512)的表面上, 其接收n阱(112,212,312,412,512)植入物以及p阱(213,313,413,513)植入物。 优选地,井注入被设计成提供逆向掺杂分布。 在补偿的井部分(112',212',312',412',512'),净杂质的数量减少,从而碱基Gummel数降低,导致垂直双极器件的增益增加。
Abstract:
A semiconductor circuit for multi-voltage operation having built-in electrostatic discharge (ESD) protection is described, comprising a drain extended nMOS transistor and a pnpn silicon controlled rectifier (SCR) merged with the transistor so that a dual npn structure is created and both the source of the transistor and the cathode of the SCR are connected to electrical ground potential, forming a dual cathode, whereby the ESD protection is enhanced. The rectifier has a diffusion region, forming an abrupt junction, resistively coupled to the drain, whereby the electrical breakdown-to-substrate of the SCR can be triggered prior to the breakdown of the nMOS transistor drain. The SCR has anode and cathode regions spaced apart by semiconductor surface regions and insulating layers positioned over the surface regions with a thickness suitable for high voltage operation and ESD protection.
Abstract:
Variable gain circuitry includes a first input transistor (M1) having a source coupled to a first conductor (32), a gate coupled to a first input voltage (Vin+), and a drain coupled to a second conductor (30). An input of a first current mirror (M3,M4) is coupled to the second conductor to receive a current corresponding to the difference between the first input voltage and a second input voltage (Vin−). An output of the first current mirror is coupled to a source of current (M2). A first transistor (M5) has a gate coupled to a third conductor (31), a source coupled to a reference voltage (VSS), and a drain coupled to conduct output current (Iout). A second transistor (M6) and a resistive element (M7) are coupled in series between the third conductor and the first reference voltage (VSS), a gate of the second transistor being coupled to the third conductor to produce a nonlinear relationship between currents of the first transistor and the second transistor.
Abstract:
An LDO regulator (10) produces an output voltage (Vout) by applying the output voltage to a feedback input (6) of a differential input stage (10A) and applying an output (3) of the differential input stage to a gate of a first follower transistor (MP4) having a source coupled to an input (8) of a class AB output stage (10C) which generates the output voltage. Demanded load current is supplied by the output voltage during a dip in its value to a gate of a second follower transistor (MP5) having a gate coupled to the output of the input stage to decrease current in a current mirror (MN5,6) having an output coupled to a current source (I1) and a gate of an amplifying transistor (MN7). This causes the current source to rapidly turn on the amplifying transistor to cause it to rapidly turn on a cascode transistor (MN3), causing it to turn on a pass transistor (MP3) of the output stage.
Abstract:
A protection structure (30; 30′; 30″) for safely conducting charge from electrostatic discharge (ESD) at a terminal (IN) is disclosed. The protection structure (30; 30′; 30″) includes a pair of drain-extended metal-oxide-semiconductor (MOS) transistors (32, 34). In a pump transistors (32), the gate electrode (45) overlaps a portion of a well (42) in which the drain (44) is disposed, to provide a significant gate-to-drain capacitance. The drains of the transistors (32, 34) are connected together and to the terminal (IN), while the gates of the transistors (32, 34) are connected together. The source of one transistor (32) is connected to a guard ring (50), of the same conductivity type as the substrate (40) within which the channel region of the other transistors (34) is disposed. An ESD event received at the terminal (IN) is thus coupled to the gate of the transistors (32, 34), causing conduction to the substrate (40) via the guard ring (50), and turning on a parasitic bipolar transistor at the other transistor (34), safely conducting the ESD current. One alternative structure (30′) includes a junction capacitor (65) coupled between the terminal (IN) and the gates of the transistors (32, 34) to improve the coupling. Another alternative structure (30″) includes a clamping diode (92) that also presents a parasitic bipolar transistor (95) enhancing the current conducted to the substrate (40).
Abstract:
An LDO regulator (10) produces an output voltage (Vout) by applying the output voltage to a feedback input (6) of a differential input stage (10A) and applying an output (3) of the differential input stage to a gate of a first follower transistor (MP4) having a source coupled to an input (8) of a class AB output stage (10C) which generates the output voltage. Demanded load current is supplied by the output voltage during a dip in its value to a gate of a second follower transistor (MP5) having a gate coupled to the output of the input stage to decrease current in a current mirror (MN5,6) having an output coupled to a current source (I1) and a gate of an amplifying transistor (MN7). This causes the current source to rapidly turn on the amplifying transistor to cause it to rapidly turn on a cascode transistor (MN3), causing it to turn on a pass transistor (MP3) of the output stage.
Abstract:
An LDO regulator (10) produces an output voltage (Vout) by applying the output voltage to a feedback input (6) of a differential input stage (10A) and applying an output (3) of the differential input stage to a gate of a first follower transistor (MP4) having a source coupled to an input (8) of a class AB output stage (10C) which generates the output voltage. Demanded load current is supplied by the output voltage during a dip in its value to a gate of a second follower transistor (MP5) having a gate coupled to the output of the input stage to decrease current in a current mirror (MN5,6) having an output coupled to a current source (I1) and a gate of an amplifying transistor (MN7). This causes the current source to rapidly turn on the amplifying transistor to cause it to rapidly turn on a cascode transistor (MN3), causing it to turn on a pass transistor (MP3) of the output stage.
Abstract:
A semiconductor circuit for multi-voltage operation having built-in electrostatic discharge (ESD) protection is described, comprising a drain extended nMOS transistor and a pnpn silicon controlled rectifier (SCR) merged with the transistor so that a dual npn structure is created and both the source of the transistor and the cathode of the SCR are connected to electrical ground potential, forming a dual cathode, whereby the ESD protection is enhanced. The rectifier has a diffusion region, forming an abrupt junction, resistively coupled to the drain, whereby the electrical breakdown-to-substrate of the SCR can be triggered prior to the breakdown of the nMOS transistor drain. The SCR has anode and cathode regions spaced apart by semiconductor surface regions and insulating layers positioned over the surface regions with a thickness suitable for high voltage operation and ESD protection.