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    Female side connector for high current
    3.
    发明申请
    Female side connector for high current 失效
    母侧连接器用于高电流

    公开(公告)号：US20050221690A1

    公开(公告)日：2005-10-06

    申请号：US11097215

    申请日：2005-04-04

    Applicant: Katsumi Suzuki ,  Yuji Nakamura ,  Kenji Chihara

    Inventor： Katsumi Suzuki ,  Yuji Nakamura ,  Kenji Chihara

    IPC: H01R4/30 ,  H01R11/12 ,  H01R13/11 ,  H01R13/115 ,  H01R13/187 ,  H01R13/193 ,  H01R13/40 ,  H01R33/76

    CPC classification number: H01R13/112 ,  H01R4/30 ,  H01R11/12 ,  H01R12/721 ,  H01R12/88 ,  H01R13/113 ,  H01R13/193

    Abstract: A female side connector for high current includes at least one contact unit including a contact, a contact support section, and a connection terminal: and a connector housing for placing the contact support section. The contact is provided by superposing a plurality of L-shaped and thin plate-like contact elements in the plate thickness direction, the contact element has a rectangular base end and a pair of elastically deformable arms that extend from the upper part of the rectangular base end and that respectively have opposing contact points at the neighborhood of the tip end. The contact support section supports the contact. The connection terminal is integrated with the contact support section and electrically contacts with outside. The contact is provided such that at least two or more contact elements having respectively different distances from the arm tip end to the contact point are superposed in the plate thickness direction.

    Abstract translation: 用于大电流的阴侧连接器包括至少一个接触单元，其包括接触件，接触支撑部分和连接端子;以及用于放置接触支撑部分的连接器壳体。 通过在板厚方向上重叠多个L形和薄板状接触元件来提供接触，接触元件具有矩形基端和从矩形基部的上部延伸的一对可弹性变形的臂 并且分别在尖端附近具有相对的接触点。 联系支持部分支持联系人。 连接端子与触点支撑部分集成，并与外部电接触。 接触件设置成使得至少两个或更多个具有与臂尖端到接触点的不同距离的接触元件在板厚度方向上重叠。

    Printed wiring board and method for producing the same
    7.
    发明授权
    Printed wiring board and method for producing the same 有权
    印刷电路板及其制造方法

    公开(公告)号：US06715204B1

    公开(公告)日：2004-04-06

    申请号：US09720953

    申请日：2001-02-13

    Applicant: Kiyotaka Tsukada ,  Masaru Takada ,  Kenji Chihara

    Inventor： Kiyotaka Tsukada ,  Masaru Takada ,  Kenji Chihara

    IPC: H05K302

    CPC classification number: H05K1/0265 ,  H01L21/486 ,  H01L2224/16 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/15311 ,  H05K1/113 ,  H05K1/114 ,  H05K3/0035 ,  H05K3/027 ,  H05K3/421 ,  H05K3/4652 ,  H05K2201/0352 ,  H05K2201/0394 ,  H05K2201/09472 ,  H05K2201/09509 ,  H05K2201/09527 ,  H05K2201/09736 ,  H05K2201/10674 ,  H05K2203/0353 ,  H05K2203/0554 ,  Y10T29/49156 ,  Y10T29/49165 ,  Y10T29/49167

    Abstract: A printed circuit board and a method for manufacturing the same that facilitates the formation of an upper surface pattern and prevents a lower surface metal foil from being damaged when forming a blind via hole with a laser. A lower surface and an upper surface of an insulative substrate (5) are respectively coated with a lower surface metal foil (220) and an upper surface metal foil (210), the thickness of which is less than that of the lower surface metal foil (220). Next, an opening (213) is formed in the upper surface metal foil at a location corresponding to a blind via hole formation portion (35) of the insulative substrate. A blind via hole (3), the bottom of which is the lower surface metal foil, is formed by emitting a laser (8) against the blind via hole formation portion (35) through the opening (213). Then, a metal plating film (23) is applied to the wall of the blind via hole (3), and an upper surface pattern (21) and a lower surface pattern (22) are formed through etching.

    Abstract translation: 一种印刷电路板及其制造方法，其有助于形成上表面图案，并且在用激光形成盲孔时防止下表面金属箔被损坏。 绝缘基板（5）的下表面和上表面分别涂覆有下表面金属箔（220）和上表面金属箔（210），其厚度小于下表面金属箔的厚度 （220）。 接着，在与上述绝缘性基板的盲通孔形成部（35）对应的位置，在上表面金属箔上形成有开口部（213）。 通过开口（213）向盲通孔形成部分（35）发射激光器（8），形成底部金属薄片的盲孔（3）。 然后，将金属镀膜（23）施加到盲孔（3）的壁上，通过蚀刻形成上表面图案（21）和下表面图案（22）。

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