摘要:
A cooling device is disclosed. The cooling device includes a thermal diffusing unit operable to radiate heat taken from a heating element, and a heat transporting part, laminated in a thickness direction of the heat diffusing unit and diffused thereby. The thermal diffusing unit has an upper plate, a lower plate opposite thereto, a vapor diffusion path to diffuse an evaporated refrigerant, and a capillary channel to circulate a condensed refrigerant. The heat transporting part has an upper plate, a lower plate opposite thereto, a vapor diffusion path to diffuse an evaporated refrigerant, and a capillary channel to circulate a condensed refrigerant. Either the upper plate or the lower plate is formed with the same member of the lower plate or the upper plate of the heat transporting part.
摘要:
A circuit element is arranged on an organic substrate and connected to a wiring pattern arranged on the organic substrate. An internal connection electrode is formed on a conductive support body by electroforming so as to obtain a unitary block of the internal connection electrode and the support body. Each end of each of the internal connection electrodes connected into a unitary block by the support body is connected to the wiring pattern. After the circuit element is sealed by resin, the support body is peeled off, so as to obtain individual internal connection electrodes separately and the other end of each of the internal connection electrodes is used as an external connection electrode on the front surface while the external connection electrode on the rear surface is connected to the wiring pattern.
摘要:
A heat transporting unit comprises an upper plate, a lower plate opposing the upper plate, an internal space formed by the upper plate and the lower plate and operable to enter a refrigerant, a plurality of paths dividing the internal space in a first direction, and a plurality of grooves being provided at a bottom surface of the internal space. The plurality of the paths and the plurality of the grooves are connected by capillary channels in a region, and are divided by sidewalls in another region.
摘要:
[Problems] An object of the present invention is to perform switching of audio and subtitle and so on automatically or by simple operation when a recording medium such as a DVD, on which a plurality of streams of audio and subtitle are recorded, is reproduced.[Means for Solving Problems] A playback pattern based on combination of streams of video, audio, and subtitle which was reproduced in the past is stored in a flash memory 12. Then, a microcontroller 10 makes an audio/video/subtitle processing section 7 reproduce a playback pattern based on combination of the streams different from the playback pattern stored in the flash memory 12.
摘要:
A method of manufacturing a lead frame comprises the steps of preparing a three-layered material comprising a metal base, an etching stopper layer made of a metal material different from that of the metal layer formed on a first surface of the metal base and a chromium layer formed on the etching stopper layer, forming a resist layer having a negative pattern relative to an inner lead to be formed on the chromium layer of the three-layered material, forming an inner lead by plating copper by using the resist layer as a mask, forming an outer lead on the metal base, removing a back of a region in which an inner lead of the metal base is formed by etching, removing the etching stopper layer, and removing the chromium layer.
摘要:
A heat pipe capable of being remarkably increased in service life by surely exerting sealing effect even under high temperature, and a method of manufacturing the heat pipe. A heat pipe remarkably reduced in cost by increasing productivity and capable of being increased in service life. In the heat pipe (1), an upper plate reinforcement part (50), intermediate plate reinforcement parts (52), reinforcement parts (55) with slits, and a lower plate reinforcement part (60) are fitted to each other in a steam diffusing flow passage (44) facing the peripheral areas of a refrigerant filling hole (4) and an air exhaust hole (5) to form a column structure. Since an external force from a press (75) is supported by the column structure composed of the upper plate reinforcement part (50), the intermediate plate reinforcement parts (52), the reinforcement parts (55) with slits, and the lower plate reinforcement part (60), such disadvantages can be prevented that an upper plate (2) or a lower plate (3) is damaged by the external force, and thereby an internal space (10a) is collapsed.
摘要:
A heatsink is provided with a base body opposed to a heat generating body and absorbing heat from the heat generating body. Thermal resistance of that opposed portion of the base body which is opposed to the heat generating body is higher than thermal resistance of a surrounding portion surrounding the opposed portion.
摘要:
A cooling unit main body having vapor diffusion flow paths which extend to the peripheral portion and capillary flow paths formed between the vapor diffusion flow paths and in a concave portion opposite region is provided with a thin concave portion in which an LED chip is mounted. Accordingly, heat from the LED chip can be easily transferred by what corresponds to the thinning of the concave portion, and successive circulating phenomenon caused by a refrigerant is repeated by the heat, and the heat is surely drawn from the LED chip by latent heat at a time when the refrigerant vaporizes, so that a heat pipe can maintain the light emitting state of the LED chip stably.
摘要:
A small and thin heat pipe with enhanced heat conductivity. Between an upper member having a grid-like upper concave portion on an inside lower surface and a lower member having a grid-like lower concave portion on an inside upper surface are provided intermediate plate members. The members are each formed with multiple vapor diffusion flow paths extending in a planar direction, communicating with the concave portions of the members, respectively. Thus, a sealed space is defined therebetween so that a refrigerant is enclosed therein. Capillary flow paths are formed through a portion of the members except where the vapor diffusion flow paths are formed such that the capillary flow paths extend vertically or both vertically and horizontally, communicating with the concave portions of the members.
摘要:
A thin and flat type heat pipe with aced conductivity. Between an upper member 22 having a rectangular area 24b on a lower surface and a lower member 20 having a rectangular area 24a on an upper area are provided intermediate plate members 32, 30. The members 32, 30 are each formed with slits 8, constructing a vapor path extending a planar direction, communicating with e rectangular areas 24a, 24b of the members 22, 20, respectively. Thus, a sealed space is defined by the slits 8 and the rectangular areas 24a, 24b so tat a refrigerant is enclosed in the sealed space. Capillary holes 10 are formed through non-slitted portions of the intermediate plate members 32, 30 so that each capillary hole 10 serves as a capillary path of flow extending vertically to communicate with the rectangular areas 24a, 24b of the members 22, 20.