摘要:
A method of manufacturing a semiconductor device is provided which is capable of improving productivity and reliability. The method of manufacturing a semiconductor device (1) of the invention includes a sequential stacking process, an individual stacked body-obtaining process, and a base material bonding process. In the sequential stacking process, a block stacked body is obtained. The block stacked body is a block stacked body (2B) in which semiconductor blocks (10B, 12B, 14B, and 16B) are stacked in a state of not being solder-bonded. In the semiconductor blocks (10B, 12B, 14B, and 16B), a plurality of semiconductor components are arranged. In the individual stacked body obtaining process, an individual stacked body (2) is obtained in which terminals of the stacked semiconductor components are solder-bonded and which is cut from the block stacked body (2B) in a stacked semiconductor component unit.
摘要:
The present invention provides a solder resist material, which can suppress the warpage of a semiconductor package upon exposure to heat or impact even when used in a thin wiring board and meets a demand for size reduction in electronic devices and a higher level of integration, and a wiring board comprising the solder resist material and a semiconductor package. The solder resist material of the present invention can effectively suppress the warpage of a semiconductor package through a fiber base material-containing layer interposed between resin layers. The fiber base material-containing layer is preferably unevenly distributed in the thickness direction of the solder resist material.
摘要:
In a process for producing an electronic part which comprises soldering (A) an electronic member having conductor portions I for electric connection having a solder layer or a solder bump (a solder portion) on a surface of a tip and (B) an electronic member to be connected having conductor portions II for electric connection arranged at positions corresponding to positions of conductor portions I by pressing (A) to (B) under heating via an adhesive layer, the solder portion is brought into contact with the adhesive layer, the solder portion is melted by heating at a temperature of or higher than a melting point of the solder, the soldering is conducted by pressing the melted solder portion, and the adhesive layer is cured. An electronic part is obtained in accordance with the process. Electric connection is surely achieved and a highly reliable electronic part can be obtained with excellent productivity.
摘要:
An object of the present invention is to provide a multi-layered printed wiring board which does not require roughening such as black oxide treatment and the like on inner layer circuits. For the purpose of achieving this object, there is adopted a multi-layered printed wiring board characterized by comprising a primer resin layer P comprising exclusively a resin between each inner layer circuit Ci formed without roughening and an insulating resin layer 5 of the multi-layered printed wiring board. The multi-layered printed wiring board is manufactured by taking the steps such as (a) a steps for producing a primer resin sheet with a carrier film including a 2 micron m to 12 micron m thick primer resin layer; (b) a steps for placing the primer resin sheet on the inner-layer circuit board in which the primer resin layer of the primer resin sheet with a carrier film is placed on the inner layer circuit board and then the carrier film is removed; (c) a steps for pressing in which a pre-preg and a metal foil for forming a conductive layer are superposed on the primer resin sheet, and pressed to form the multi-layered metal clad laminate; and (d) a steps for forming an outer layer circuit wherein the outer layer circuit is formed by etching the outer layer metal foil of the multi-layered metal clad laminate to make the multi-layered printed wiring board.
摘要:
The invention relates to a low-cost transfer bump sheet which is capable of transferring copper-cored solder bumps with high reliability of bonding to a semiconductor chip and which is capable of transferring bumps of various structures. The invention also relates to a low-cost semiconductor flip chip in which copper-cored solder bumps with high reliability of bonding are mounted on a semiconductor chip through the use of the transfer bump sheet. In the transfer bump sheet, metal posts of two or more layers are formed on a base sheet. The invention also relates to a method of manufacturing this semiconductor flip chip, which comprises the steps of forming the base sheet on a metal foil, forming a plating mask on the metal foil, forming a first solder layer (solder coating) on the metal foil by electrolytic plating or electroless plating, removing the plating mask, and forming a metal layer (metal core) of metal posts by the etching of the metal foil through the use of the formed first solder layer (solder coating) as an etching mask.
摘要:
A blade-type tensioner for chain drives which is suitable for use as a tensioner on the timing chain of a motor vehicle engine. The present invention is a chain tensioner particularly suited for use in confined spaces having a blade spring element mechanically interlocked with a plastic shoe. The shoe may be of rigid filled nylon and engages the chain to be tensioned. The spring element is interlocked to the plastic shoe by having ends inserted into grooves formed in the opposite ends of the shoe. The shoe is rotatably fixed to a base by way of a pin. The groove at the fixed end of the shoe extends towards the tip of the fixed end of the shoe past the pin attachment point. The groove at the free end of the shoe extends toward the tip of the free end of the shoe past the point at which the free end of the shoe bears upon a sliding surface formed on the base.
摘要:
A tensioner for a camshaft driving chain (a plunger device 17 shown in the first embodiment of the invention) and a hydraulic control valve 21 are disposed close to each other. An oil passage 31 for supplying an oil pressure to the tensioner is caused to branch off from a downstream side of an oil filter 27 provided at an inlet port 28 of the hydraulic control valve. With this construction, the arrangement of the oil passage can be simplified, and therefore not only can man hours required for forming the oil passage be reduced, but also the number of components required can also be reduced by commonizing the oil filter. Accordingly, it is possible to provide an improved assembling arrangement for a tensioner and a hydraulic control valve in an internal combustion engine without involving an increase in production costs.
摘要:
A silent chain having multiple links each having a pair of teeth and apertures, which are connected by connecting pins inserted into the apertures. The links have an sheared link bearing surface which further reduces the wear of the sprocket tooth surface and further prevents defective bending of the silent chain. The bearing surface of the link tooth has a shear surface which may be formed by shaving or fine-blanking. The shear surface length may be at least approximately 70% or at least approximately 90% of the link thickness.
摘要:
An engine having a lower block made of an aluminum-based material and having a bearing cap mounted therein in a cast-in manner abutting against front and rear sidewalls of a cylinder block of the engine and coupled to the cylinder block by a bolt, and a pump body is coupled to a lower surface of the lower block by bolts. The pump body also serves as a balancer shaft supporting member, and a journal portion of a balancer shaft is supported on the balancer shaft supporting member. Thus, the rigidity of supporting of the balancer shaft on the balancer shaft supporting member can be enhanced without an increase in size of the balancer shaft supporting member of the engine.
摘要:
A vehicle brake control system includes a regenerative braking control component, a frictional braking control component, a calculating component and a controlling component. The regenerative braking control component controls a regenerative braking device to provide a regenerative braking torque. The frictional braking control component controls a frictional braking device to provide a frictional braking torque. The calculating component calculates a regenerative braking torque filter processing value based on a fluctuation frequency of the regenerative braking torque. The controlling component, during a first condition, operates a motorized power assist control device based on the regenerative braking torque filter processing value, instead of the regenerative braking torque, to moderate the frictional braking torque, such that the regenerative braking torque and the moderated frictional braking torque provide a target braking torque based on a braking operation.