公开(公告)号：US06273110B1

公开(公告)日：2001-08-14

申请号：US09112259

申请日：1998-07-08

申请人： Jeffry A. Davis ,  Kevin P. Meyer ,  Kert L. Dolechek

发明人： Jeffry A. Davis ,  Kevin P. Meyer ,  Kert L. Dolechek

IPC分类号： B08B700

CPC分类号： H01L21/67754 ,  H01L21/67126 ,  H01L21/67173 ,  H01L21/6719 ,  H01L21/67313 ,  H01L21/67326 ,  H01L21/67769 ,  H01L21/67772 ,  H01L21/67775 ,  H01L21/67778 ,  H01L21/67781 ,  H01L21/68707 ,  Y10S134/902 ,  Y10S414/139 ,  Y10S414/14

摘要： An automated semiconductor processing system has an indexer bay perpendicularly aligned with a process bay within a clean air enclosure. An indexer in the indexer bay provides stocking or storage for work in progress semiconductor wafers. Process chambers are located in the process bay. A process robot moves between the indexer bay and process bay to carry semi-conductor wafers to and from the process chambers. The process robot has a robot arm vertically movable along a lift rail. Semiconductor wafers are carried offset from the robot arm, to better avoid contamination. The automated system is compact and requires less clean room floor space.

摘要翻译： 自动半导体处理系统具有与清洁空气封闭体内的工艺间隔垂直对准的分度器托架。 索引器托架中的索引器为进行中的半导体晶片提供放样或存储。 过程室位于过程托架中。 过程机器人在分度器托架和过程间隔之间移动，以将半导体晶片运送到处理室和从处理室运送。 过程机器人具有可沿升降轨道垂直移动的机器人臂。 半导体晶片从机器人手臂偏移，以更好地避免污染。 自动化系统紧凑，需要较少的洁净室空间。

公开(公告)号：US07193295B2

公开(公告)日：2007-03-20

申请号：US10923131

申请日：2004-08-20

申请人： Kert L. Dolechek ,  Raymon F. Thompson

发明人： Kert L. Dolechek ,  Raymon F. Thompson

IPC分类号： H01L29/06

CPC分类号： H01L29/06 ,  H01L21/302 ,  H01L21/30604 ,  H01L21/3083 ,  H01L21/67126 ,  H01L21/68735 ,  Y10S438/959

摘要： The present invention provides system and apparatus for use in processing wafers. The new system and apparatus allows for the production of thinner wafers that at same time remain strong. As a result, the wafers produced by the present process are less susceptible to breaking. The unique system also offers an improved structure for handling thinned wafers and reduces the number of processing steps. This results in improved yields and improved process efficiency.

摘要翻译： 本发明提供了用于处理晶片的系统和装置。 新的系统和设备允许生产更薄的晶片，同时保持坚固。 结果，由本方法生产的晶片不易破裂。 独特的系统还提供了一种改进的处理薄化晶片的结构，并减少了处理步骤的数量。 这导致产量提高和工艺效率提高。

公开(公告)号：US07898089B2

公开(公告)日：2011-03-01

申请号：US11977909

申请日：2007-10-26

申请人： Kert L. Dolechek ,  Raymon F. Thompson

发明人： Kert L. Dolechek ,  Raymon F. Thompson

IPC分类号： H01L29/40 ,  H01L21/461

CPC分类号： H01L21/6835 ,  H01L2924/3025

摘要： The present invention provides an apparatus and method for use in processing semiconductor workpieces. The new apparatus and method allows for the production of thinner workpieces that at the same time remain strong. Particularly, a chuck is provided that includes a body, a retainer removeably attached to the body and a seal forming member. When a workpiece is placed on the chuck body and the retainer is engaged to the body, a peripheral portion of the back side of the workpiece is covered by the retainer while an interior region of the back side of the workpiece is exposed. The exposed back side of the workpiece is then subjected to a wet chemical etching process to thin the workpiece and form a relatively thick rim comprised of semiconductor material at the periphery of the workpiece. The thick rim or hoop imparts strength to the otherwise fragile, thinned semiconductor workpiece. Semiconductor workpieces made according to the present invention offer an improved structure for handling thinned wafers in conventional automated equipment. This results in improved yields and improved process efficiency.

摘要翻译： 本发明提供一种用于处理半导体工件的装置和方法。 新的设备和方法允许生产更薄的工件，同时保持坚固。 特别地，提供一种卡盘，其包括主体，可移除地附接到主体的保持器和密封形成构件。 当将工件放置在卡盘主体上并且保持器与主体接合时，工件后侧的周边部分被保持器覆盖，同时工件后侧的内部区域被暴露。 然后将工件的暴露的背面进行湿化学蚀刻工艺以使工件变薄，并在工件的周边形成由半导体材料组成的相对较厚的边缘。 较厚的边缘或箍将其强度提升到其他脆弱的，变薄的半导体工件。 根据本发明制造的半导体工件提供了用于在常规自动化设备中处理薄化晶片的改进的结构。 这导致产量提高和工艺效率提高。

公开(公告)号：US07354649B2

公开(公告)日：2008-04-08

申请号：US10923132

申请日：2004-08-20

申请人： Kert L. Dolechek ,  Raymon F. Thompson

发明人： Kert L. Dolechek ,  Raymon F. Thompson

IPC分类号： B32B9/04

CPC分类号： H01L21/68721 ,  H01L21/67126 ,  Y10T428/12528 ,  Y10T428/21 ,  Y10T428/219

摘要： The present invention provides an apparatus and method for use in processing semiconductor workpieces. The new apparatus and method allows for the production of thinner workpieces that at the same time remain strong. Particularly, a chuck is provided that includes a body, a retainer removeably attached to the body and a seal forming member. When a workpiece is placed on the chuck body and the retainer is engaged to the body, a peripheral portion of the back side of the workpiece is covered by the retainer while an interior region of the back side of the workpiece is exposed. The exposed back side of the workpiece is then subjected to a wet chemical etching process to thin the workpiece and form a relatively thick rim comprised of semiconductor material at the periphery of the workpiece. The thick rim or hoop imparts strength to the otherwise fragile, thinned semiconductor workpiece. Semiconductor workpieces made according to the present invention offer an improved structure for handling thinned wafers in conventional automated equipment. This results in improved yields and improved process efficiency.

摘要翻译： 本发明提供一种用于处理半导体工件的装置和方法。 新的设备和方法允许生产更薄的工件，同时保持坚固。 特别地，提供一种卡盘，其包括主体，可移除地附接到主体的保持器和密封形成构件。 当将工件放置在卡盘主体上并且保持器与主体接合时，工件后侧的周边部分被保持器覆盖，同时工件后侧的内部区域被暴露。 然后将工件的暴露的背面进行湿化学蚀刻工艺以使工件变薄，并在工件的周边形成由半导体材料组成的相对较厚的边缘。 较厚的边缘或箍将其强度提升到其他脆弱的，变薄的半导体工件。 根据本发明制造的半导体工件提供了用于在常规自动化设备中处理薄化晶片的改进的结构。 这导致产量提高和工艺效率提高。

公开(公告)号：US06447232B1

公开(公告)日：2002-09-10

申请号：US08994737

申请日：1997-12-19

申请人： Jeffry A. Davis ,  Kert L. Dolechek ,  Gary L. Curtis

发明人： Jeffry A. Davis ,  Kert L. Dolechek ,  Gary L. Curtis

IPC分类号： B65G4907

CPC分类号： H01L21/67754 ,  H01L21/67126 ,  H01L21/67173 ,  H01L21/6719 ,  H01L21/67313 ,  H01L21/67326 ,  H01L21/67769 ,  H01L21/67772 ,  H01L21/67775 ,  H01L21/67778 ,  H01L21/67781 ,  H01L21/68707 ,  Y10S134/902 ,  Y10S414/139 ,  Y10S414/14

摘要： A processor for processing articles, such as semiconductor wafers, in a substantially clean atmosphere is set forth. The processor includes an enclosure defining a substantially enclosed clean processing chamber and at least one processing station disposed in the processing chamber. An interface section is disposed adjacent an interface end of the enclosure. The interface section includes at least one interface port through which a pod containing articles for processing are loaded or unloaded to or from the processor. The interface section is hygienically separated from the processing chamber since the interface section is generally not as clean as the highly hygienic processing chamber. An article extraction mechanism adapted to seal with the pod is employed. The mechanism is disposed to allow extraction of the articles contained within the pod into the processing chamber without exposing the articles to ambient atmospheric conditions in the interface section. The article processor also preferably includes an article insertion mechanism that is adapted to seal with a pod disposed in the interface section. The article insertion mechanism is disposed to allow insertion of the articles into the pod after processing by the at least one processing station. The article insertion mechanism allows the insertion of the articles without exposing the articles to ambient atmospheric conditions in the interface section.

摘要翻译： 阐述了一种用于在基本上清洁的气氛中处理诸如半导体晶片的制品的处理器。 处理器包括限定基本封闭的清洁处理室的外壳和设置在处理室中的至少一个处理站。 接口部分设置在外壳的接口端附近。 接口部分包括至少一个接口端口，通过该至少一个接口端口将包含用于处理的物品的容器装载或者从处理器卸载。 接口部分与处理室卫生地分开，因为界面部分通常不像高度卫生的处理室那么干净。 采用适于与荚密封的物品提取机构。 该机构被设置为允许将容纳在容器内的物品提取到处理室中，而不会使物品暴露于接口部分中的环境大气条件。 物品处理器还优选地包括物品插入机构，其适于与设置在界面部分中的容器密封。 物品插入机构设置成允许在由至少一个处理站处理之后将物品插入容器中。 物品插入机构允许物品的插入，而不会使物品暴露在界面部分中的环境大气条件下。

公开(公告)号：US07625821B2

公开(公告)日：2009-12-01

申请号：US11420591

申请日：2006-05-26

申请人： Kert L. Dolechek ,  Raymon F. Thompson

发明人： Kert L. Dolechek ,  Raymon F. Thompson

IPC分类号： H01L21/302

CPC分类号： H01L29/06 ,  H01L21/302 ,  H01L21/30604 ,  H01L21/3083 ,  H01L21/67126 ,  H01L21/68735 ,  Y10S438/959

摘要： The present invention provides system and apparatus for use in processing wafers. The new system and apparatus allows for the production of thinner wafers that at same time remain strong. As a result, the wafers produced by the present process are less susceptible to breaking. The unique system also offers an improved structure for handling thinned wafers and reduces the number of processing steps. This results in improved yields and improved process efficiency.

摘要翻译： 本发明提供了用于处理晶片的系统和装置。 新的系统和设备允许生产更薄的晶片，同时保持坚固。 结果，由本方法生产的晶片不易破裂。 独特的系统还提供了一种改进的处理薄化晶片的结构，并减少了处理步骤的数量。 这导致产量提高和工艺效率提高。

公开(公告)号：US06799932B2

公开(公告)日：2004-10-05

申请号：US10457944

申请日：2003-06-09

申请人： Jeffry A. Davis ,  Kert L. Dolechek ,  Gary L. Curtis

发明人： Jeffry A. Davis ,  Kert L. Dolechek ,  Gary L. Curtis

IPC分类号： B65G49107

CPC分类号： H01L21/67754 ,  H01L21/67173 ,  H01L21/6732 ,  H01L21/67769 ,  H01L21/67772 ,  H01L21/67775 ,  H01L21/67778 ,  H01L21/67781 ,  H01L21/68707 ,  Y10S414/135 ,  Y10S414/137 ,  Y10S414/139 ,  Y10S414/14

摘要： A processor for processing articles, such as semiconductor wafers, in a substantially clean atmosphere is set forth. The processor includes an enclosure defining a substantially enclosed clean processing chamber and at least one processing station disposed in the processing chamber. An interface section is disposed adjacent an interface end of the enclosure. The interface section includes at least one interface port through which a pod containing articles for processing are loaded or unloaded to or from the processor. The interface section is hygienically separated from the processing chamber since the interface section is generally not as clean as the highly hygienic processing chamber. An article extraction mechanism adapted to seal with the pod is employed. The mechanism is disposed to allow extraction of the articles contained within the pod into the processing chamber without exposing the articles to ambient atmospheric conditions in the interface section. The article processor also preferably includes an article insertion mechanism that is adapted to seal with a pod disposed in the interface section. The article insertion mechanism is disposed to allow insertion of the articles into the pod after processing by the at least one processing station. The article insertion mechanism allows the insertion of the articles without exposing the articles to ambient atmospheric conditions in the interface section.

摘要翻译： 阐述了一种用于在基本上清洁的气氛中处理诸如半导体晶片的制品的处理器。 处理器包括限定基本封闭的清洁处理室的外壳和设置在处理室中的至少一个处理站。 接口部分设置在外壳的接口端附近。 接口部分包括至少一个接口端口，通过该至少一个接口端口将包含用于处理的物品的容器装载或者从处理器卸载。 接口部分与处理室卫生地分开，因为界面部分通常不像高度卫生的处理室那么干净。 采用适于与荚密封的物品提取机构。 该机构被设置为允许将容纳在容器内的物品提取到处理室中，而不会使物品暴露于接口部分中的环境大气条件。 物品处理器还优选地包括物品插入机构，其适于与设置在界面部分中的容器密封。 物品插入机构设置成允许在由至少一个处理站处理之后将物品插入容器中。 物品插入机构允许物品的插入，而不会使物品暴露在界面部分中的环境大气条件下。

公开(公告)号：US07288489B2

公开(公告)日：2007-10-30

申请号：US10923363

申请日：2004-08-20

申请人： Kert L. Dolechek ,  Raymon F. Thompson

发明人： Kert L. Dolechek ,  Raymon F. Thompson

IPC分类号： H01L21/304

CPC分类号： H01L21/6835 ,  H01L2924/3025

摘要： The present invention provides an apparatus and method for use in processing semiconductor workpieces. The new apparatus and method allows for the production of thinner workpieces that at the same time remain strong. Particularly, a chuck is provided that includes a body, a retainer removeably attached to the body and a seal forming member. When a workpiece is placed on the chuck body and the retainer is engaged to the body, a peripheral portion of the back side of the workpiece is covered by the retainer while an interior region of the back side of the workpiece is exposed. The exposed back side of the workpiece is then subjected to a wet chemical etching process to thin the workpiece and form a relatively thick rim comprised of semiconductor material at the periphery of the workpiece. The thick rim or hoop imparts strength to the otherwise fragile, thinned semiconductor workpiece. Semiconductor workpieces made according to the present invention offer an improved structure for handling thinned wafers in conventional automated equipment. This results in improved yields and improved process efficiency.

摘要翻译： 本发明提供一种用于处理半导体工件的装置和方法。 新的设备和方法允许生产更薄的工件，同时保持坚固。 特别地，提供一种卡盘，其包括主体，可移除地附接到主体的保持器和密封形成构件。 当将工件放置在卡盘主体上并且保持器与主体接合时，工件后侧的周边部分被保持器覆盖，同时工件后侧的内部区域被暴露。 然后将工件的暴露的背面进行湿化学蚀刻工艺以使工件变薄，并在工件的周边形成由半导体材料组成的相对较厚的边缘。 较厚的边缘或箍将其强度提升到其他脆弱的，变薄的半导体工件。 根据本发明制造的半导体工件提供了用于在常规自动化设备中处理薄化晶片的改进的结构。 这导致产量提高和工艺效率提高。

公开(公告)号：US06736148B2

公开(公告)日：2004-05-18

申请号：US09862752

申请日：2001-05-22

申请人： Jeffry A. Davis ,  Kevin P. Meyer ,  Kert L. Dolechek

发明人： Jeffry A. Davis ,  Kevin P. Meyer ,  Kert L. Dolechek

IPC分类号： B08B704

CPC分类号： H01L21/68707 ,  A01G18/64 ,  H01L21/67742 ,  H01L21/67754 ,  H01L21/67769 ,  H01L21/67772 ,  H01L21/67775 ,  H01L21/67781 ,  Y10S134/902

摘要： An automated semiconductor processing system has an indexer bay perpendicularly aligned with a process bay within a clean air enclosure. An indexer in the indexer bay provides stocking or storage for work in progress semiconductor wafers. Process chambers are located in the process bay. A process robot moves between the indexer bay and process bay to carry semi-conductor wafers to and from the process chambers. The process robot has a robot arm vertically moveable along a lift rail. Semiconductor wafers are carried offset from the robot arm, to better avoid contamination. The automated system is compact and requires less clean room floor space.

摘要翻译： 自动半导体处理系统具有与清洁空气封闭体内的工艺间隔垂直对准的分度器托架。 索引器托架中的索引器为进行中的半导体晶片提供放样或存储。 过程室位于过程托架中。 过程机器人在分度器托架和过程间隔之间移动，以将半导体晶片运送到处理室和从处理室传送半导体晶片。 过程机器人具有可沿着升降轨道垂直移动的机器人手臂。 半导体晶片从机器人手臂偏移，以更好地避免污染。 自动化系统紧凑，需要较少的洁净室空间。

公开(公告)号：US06652219B2

公开(公告)日：2003-11-25

申请号：US10205158

申请日：2002-07-25

申请人： Jeffry A. Davis ,  Kert L. Dolechek ,  Gary L. Curtis

发明人： Jeffry A. Davis ,  Kert L. Dolechek ,  Gary L. Curtis

IPC分类号： B65G4907

CPC分类号： H01L21/67754 ,  H01L21/67126 ,  H01L21/67173 ,  H01L21/6719 ,  H01L21/67313 ,  H01L21/67326 ,  H01L21/67769 ,  H01L21/67772 ,  H01L21/67775 ,  H01L21/67778 ,  H01L21/67781 ,  H01L21/68707 ,  Y10S134/902 ,  Y10S414/139 ,  Y10S414/14

摘要： A processor for processing articles, such as semiconductor wafers, includes an enclosure defining a substantially enclosed clean processing chamber and at least one processing station disposed in the processing chamber. An interface section is disposed adjacent an interface end of the enclosure. The interface section includes at least one interface port through which a pod containing articles for processing are loaded or unloaded to or from the processor. An article extraction mechanism adapted to seal with the pod removes articles from the pod without exposing the articles to ambient atmospheric conditions in the interface section. The article processor also preferably includes an article insertion mechanism adapted to seal with a pod in the interface section. The article insertion mechanism allows insertion of the articles into the pod after processing by at least one processing station.

摘要翻译： 用于处理诸如半导体晶片的制品的处理器包括限定基本封闭的清洁处理室的外壳和设置在处理室中的至少一个处理站。 接口部分设置在外壳的接口端附近。 接口部分包括至少一个接口端口，通过该至少一个接口端口将包含用于处理的物品的容器装载或者从处理器卸载。 适于与容器密封的物品提取机构将物品从物料盒中取出，而不会使物品暴露在界面部分的环境大气条件下。 物品处理器还优选地包括适于与接口部分中的容器密封的物品插入机构。 物品插入机构允许在由至少一个处理站处理之后将物品插入到容器中。