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    METHOD OF DETERMINING A FLATNESS OF AN ELECTRONIC DEVICE SUBSTRATE, METHOD OF PRODUCING THE SUBSTRATE, METHOD OF PRODUCING A MASK BLANK, METHOD OF PRODUCING A TRANSFER MASK, POLISHING METHOD, ELECTRONIC DEVICE SUBSTRATE, MASK BLANK, TRANSFER MASK, AND POLISHING APPARATUS
    3.
    发明授权
    METHOD OF DETERMINING A FLATNESS OF AN ELECTRONIC DEVICE SUBSTRATE, METHOD OF PRODUCING THE SUBSTRATE, METHOD OF PRODUCING A MASK BLANK, METHOD OF PRODUCING A TRANSFER MASK, POLISHING METHOD, ELECTRONIC DEVICE SUBSTRATE, MASK BLANK, TRANSFER MASK, AND POLISHING APPARATUS 有权
    确定电子设备基板的平面的方法，制造基板的方法，制造掩模布的方法，生产转印掩模的方法，抛光方法，电子设备基板，掩模布，转印掩模和抛光装置

    公开(公告)号：US06951502B2

    公开(公告)日：2005-10-04

    申请号：US10401770

    申请日：2003-03-31

    申请人： Kesahiro Koike ,  Masato Ohtsuka ,  Yasutaka Tochihara

    发明人： Kesahiro Koike ,  Masato Ohtsuka ,  Yasutaka Tochihara

    IPC分类号： B24B37/30 ,  B24B49/04 ,  B24B49/16 ,  G03F1/00 ,  B24B49/00

    CPC分类号： B24B49/16 ,  B24B37/30 ,  B24B49/04 ,  G03F1/60 ,  Y10T428/24355

    摘要： A flatness of a substrate is determined to achieve a desired flatness of a mask blank by predicting the variation in flatness resulting from a film stress of a thin film formed on the substrate. The flatness is adjusted by measuring the flatness of the substrate as a measured flatness, selecting a load type with reference to the measured flatness, and polishing the substrate under pressure distribution specified by the load type. A principal surface of the substrate has a flatness greater than 0 μm and not greater than 0.25 μm. A polishing apparatus includes a rotatable surface table, a polishing pad formed thereon, abrasive supplying means for supplying an abrasive to the polishing pad, substrate holding means, and substrate pressing means for pressing the substrate. The substrate pressing means has a plurality of pressing members for individually and desirably pressing a plurality of divided regions of the substrate surface.

    摘要翻译： 通过预测由形成在基板上的薄膜的膜应力导致的平坦度的变化，确定基板的平坦度以实现掩模坯料的期望的平坦度。 通过测量作为测量平面度的基板的平整度，参照所测量的平坦度选择载荷类型，并在由载荷类型规定的压力分布下研磨基板来调整平面度。 基板的主表面具有大于0μm且不大于0.25μm的平坦度。 抛光装置包括可旋转的表台，形成在其上的抛光垫，用于向研磨垫供给研磨剂的磨料供给装置，基板保持装置以及用于按压基板的基板按压装置。 基板按压装置具有多个按压部件，用于分别且期望地按压基板表面的多个分割区域。

    Method of producing a glass substrate for a mask blank and method of producing a mask blank
    4.
    发明授权
    Method of producing a glass substrate for a mask blank and method of producing a mask blank 有权
    用于掩模坯料的玻璃基板的制造方法和掩模坯料的制造方法

    公开(公告)号：US07691279B2

    公开(公告)日：2010-04-06

    申请号：US10809419

    申请日：2004-03-26

    申请人： Kesahiro Koike

    发明人： Kesahiro Koike

    IPC分类号： C03C15/00 ,  G03F9/00 ,  B44C1/22

    CPC分类号： B24B37/08 ,  B24B37/013 ,  B24B49/12 ,  C03B19/1469 ,  C03C15/00 ,  C03C15/02 ,  C03C19/00 ,  G03F1/60

    摘要： A method of producing a glass substrate for a mask blank has the steps of measuring a convex/concave profile of a surface of the glass substrate, controlling a flatness of the surface of the glass substrate to a value not greater than a predetermined reference value by specifying the degree of convexity of a convex portion present on the surface of the glass substrate with reference to a result of measurement obtained in the profile measuring step and executing local machining upon the convex portion under a machining condition depending upon the degree of convexity, and polishing, after the flatness control step, the surface of the glass substrate subjected to the local machining. The surface of the glass substrate subjected to the local machining is subjected to acid treatment after the flatness control step and before the polishing step.

    摘要翻译： 制造掩模坯料用玻璃基板的方法具有以下步骤：测量玻璃基板的表面的凸/凹形轮廓，将玻璃基板的表面的平坦度控制为不大于预定基准值的值，由 参照在轮廓测量步骤中获得的测量结果指定存在于玻璃基板表面上的凸部的凸度，并根据凸度在加工条件下对凸部进行局部加工，以及 在平坦度控制步骤之后，对玻璃基板的表面进行局部加工。 经过局部加工的玻璃基板的表面在平坦度控制步骤之后和抛光步骤之前进行酸处理。

    X-ray membrane for x-ray mask, x-ray mask blank, x-ray mask, manufacturing method thereof and method of polishing silicon carbide film
    5.
    发明授权
    X-ray membrane for x-ray mask, x-ray mask blank, x-ray mask, manufacturing method thereof and method of polishing silicon carbide film 失效
    用于x射线掩模的X射线膜，x射线掩模毛坯，x射线掩模，其制造方法和抛光碳化硅膜的方法

    公开(公告)号：US6127068A

    公开(公告)日：2000-10-03

    申请号：US52352

    申请日：1998-03-31

    申请人： Tsutomu Shoki ,  Kesahiro Koike

    发明人： Tsutomu Shoki ,  Kesahiro Koike

    IPC分类号： G03F1/22 ,  G21K1/10 ,  H01L21/027 ,  G03F9/00 ,  G21K5/00

    CPC分类号： G03F1/22 ,  G21K1/10

    摘要： A surface of a silicon carbide film which is an x-ray membrane 12 is made so that the surface roughness thereof may be 1.0 nm or less in terms of Ra (center-line average roughness) and the surface may have no scratch of 0.25 .mu.m or more in width. The surface of the silicon carbide film, which is the x-ray membrane 12 is polished a diamond particle, of a predetermined particle diameter, and colloidal silica dispersed in a solution containing hydrogen peroxide as an abrasive material, so that the surface is highly precise.

    摘要翻译： 作为X射线膜12的碳化硅膜的表面被制成使得其表面粗糙度以Ra（中心线平均粗糙度）为1.0nm以下，表面可以没有0.25μm的划痕 m以上。 对作为X射线膜12的碳化硅膜的表面进行抛光，将预定粒径的金刚石颗粒和分散在含有过氧化氢的溶液作为研磨材料的胶体二氧化硅进行抛光，使得该表面高精度 。

    METHOD OF PRODUCING A GLASS SUBSTRATE FOR A MASK BLANK, METHOD OF PRODUCING A MASK BLANK, AND METHOD OF PRODUCING A TRANSFER MASK
    7.
    发明申请
    METHOD OF PRODUCING A GLASS SUBSTRATE FOR A MASK BLANK, METHOD OF PRODUCING A MASK BLANK, AND METHOD OF PRODUCING A TRANSFER MASK 有权
    用于制造掩模布的玻璃基板的方法，制造掩模布的方法和生产转印掩模的方法

    公开(公告)号：US20090011681A1

    公开(公告)日：2009-01-08

    申请号：US12182205

    申请日：2008-07-30

    申请人： Kesahiro Koike ,  Junji Miyagaki

    发明人： Kesahiro Koike ,  Junji Miyagaki

    IPC分类号： B24B1/00

    CPC分类号： C09G1/02 ,  B24B37/044

    摘要： In a method of producing a glass substrate for a mask blank, a surface of the glass substrate is polished by the use of a polishing liquid having a pH value between 7.0 and 7.6 that contains abrasive grains, and the abrasive grains include colloidal silica abrasive grains produced by hydrolysis of an organosilicon compound. The polishing process includes a surface roughness control step for initially finishing the surface of the glass substrate to a predetermined surface roughness by moving a polishing member and the glass substrate relative to each other under a predetermined pressure. This is followed by a protrusion suppressing step, carried out immediately before the end of the polishing process, under a pressure lower than the predetermined pressure, to minimize polishing rate and suppress occurrence of a fine convex protrusion. A mask blank and then a transfer mask are formed from this polished glass substrate.

    摘要翻译： 在制造掩模用玻璃基板的方法中，通过使用含有磨粒的pH值为7.0〜7.6的研磨液对玻璃基板的表面进行研磨，磨粒包括胶体二氧化硅磨粒 通过有机硅化合物的水解产生。 抛光工艺包括表面粗糙度控制步骤，用于通过在预定压力下相对于彼此移动抛光构件和玻璃基板来最初将玻璃基板的表面完成到预定的表面粗糙度。 接下来是在低于预定压力的压力下在抛光过程结束之前执行的突起抑制步骤，以最小化抛光速率并抑制细凸起突出的发生。 从该抛光的玻璃基板形成掩模坯料，然后形成转印掩模。

    Method of determining a flatness of an electronic device substrate, method of producing the substrate, method of producing a mask blank, method of producing a transfer mask, polishing method, electronic device substrate, mask blank, transfer mask, and polishing apparatus
    8.
    发明授权
    Method of determining a flatness of an electronic device substrate, method of producing the substrate, method of producing a mask blank, method of producing a transfer mask, polishing method, electronic device substrate, mask blank, transfer mask, and polishing apparatus 有权
    确定电子器件基板的平坦度的方法，制造基板的方法，掩模坯料的制造方法，转印掩模的制造方法，抛光方法，电子器件基板，掩模板，转印掩模和抛光装置

    公开(公告)号：US07455785B2

    公开(公告)日：2008-11-25

    申请号：US11114002

    申请日：2005-04-26

    申请人： Kesahiro Koike ,  Masato Ohtsuka ,  Yasutaka Tochihara

    发明人： Kesahiro Koike ,  Masato Ohtsuka ,  Yasutaka Tochihara

    IPC分类号： B44C1/22 ,  C25F3/00

    CPC分类号： B24B49/16 ,  B24B37/30 ,  B24B49/04 ,  G03F1/60 ,  Y10T428/24355

    摘要： A flatness of a substrate is determined to achieve a desired flatness of a mask blank by predicting the variation in flatness resulting from a film stress of a thin film formed on the substrate. The flatness is adjusted by measuring the flatness of the substrate as a measured flatness, selecting a load type with reference to the measured flatness, and polishing the substrate under pressure distribution specified by the load type. A principal surface of the substrate has a flatness greater than 0 μm and not greater than 0.25 μm. A polishing apparatus includes a rotatable surface table, a polishing pad formed thereon, abrasive supplying means for supplying an abrasive to the polishing pad, substrate holding means, and substrate pressing means for pressing the substrate. The substrate pressing means has a plurality of pressing members for individually and desirably pressing a plurality of divided regions of the substrate surface.

    摘要翻译： 通过预测由形成在基板上的薄膜的膜应力导致的平坦度的变化，确定基板的平坦度以实现掩模坯料的期望的平坦度。 通过测量作为测量平面度的基板的平整度，参照所测量的平坦度选择载荷类型，并在由载荷类型规定的压力分布下研磨基板来调整平面度。 基板的主表面具有大于0μm且不大于0.25μm的平坦度。 抛光装置包括可旋转的表台，形成在其上的抛光垫，用于向研磨垫供给研磨剂的磨料供给装置，基板保持装置以及用于按压基板的基板按压装置。 基板按压装置具有多个按压部件，用于分别且期望地按压基板表面的多个分割区域。

    Method of producing a glass substrate for a mask blank by polishing with an alkaline polishing liquid that contains colloidal silica abrasive grains
    9.
    发明授权
    Method of producing a glass substrate for a mask blank by polishing with an alkaline polishing liquid that contains colloidal silica abrasive grains 有权
    通过用含有胶体二氧化硅磨粒的碱性研磨液研磨制造掩模用玻璃基板的方法

    公开(公告)号：US07732101B2

    公开(公告)日：2010-06-08

    申请号：US12182205

    申请日：2008-07-30

    申请人： Kesahiro Koike ,  Junji Miyagaki

    发明人： Kesahiro Koike ,  Junji Miyagaki

    IPC分类号： G03F1/00 ,  G03F1/14 ,  B24B1/00 ,  B24B7/24 ,  B24C1/08

    CPC分类号： C09G1/02 ,  B24B37/044

    摘要： In a method of producing a glass substrate for a mask blank, a surface of the glass substrate is polished by the use of an alkaline polishing liquid that contains colloidal silica abrasive grains, from which alkali metal is removed to suppress occurrence of an alkali metal gel substance protrusion adhered on the glass substrate. The polishing process may include a surface roughness control step for initially finishing the surface of the glass substrate to a predetermined surface roughness by moving a polishing member and the glass substrate relative to each other under a predetermined pressure. This may be followed by a protrusion suppressing step under a pressure lower than the predetermined pressure, to minimize polishing rate and suppress occurrence of a fine convex protrusion.

    摘要翻译： 在制造掩模用玻璃基板的方法中，通过使用含有胶体二氧化硅磨粒的碱性研磨液对玻璃基板的表面进行研磨，除去碱金属以抑制碱金属凝胶的发生 物质突起粘附在玻璃基板上。 抛光过程可以包括表面粗糙度控制步骤，用于通过在预定压力下相对于彼此移动抛光构件和玻璃基板来最初将玻璃基板的表面完成到预定的表面粗糙度。 这之后可以在低于预定压力的压力下进行突起抑制步骤，以最小化抛光速率并抑制细凸起突出的发生。

    Method of producing a glass substrate for a mask blank, method of producing a mask blank, and method of producing a transfer mask
    10.
    发明授权
    Method of producing a glass substrate for a mask blank, method of producing a mask blank, and method of producing a transfer mask 有权
    制造掩模坯料用玻璃基板的方法，掩模坯料的制造方法以及转印掩模的制造方法

    公开(公告)号：US07413832B2

    公开(公告)日：2008-08-19

    申请号：US10642657

    申请日：2003-08-19

    申请人： Kesahiro Koike ,  Junji Miyagaki

    发明人： Kesahiro Koike ,  Junji Miyagaki

    IPC分类号： C03F1/00 ,  B24B1/00 ,  C03C17/00 ,  C03C19/00 ,  B05D3/12

    CPC分类号： C09G1/02 ,  B24B37/044

    摘要： In a method of producing a glass substrate for a mask blank, a surface of the glass substrate is polished by the use of a polishing liquid having a pH value between 7.0 and 7.6 that contains abrasive grains, and the abrasive grains include colloidal silica abrasive grains produced by hydrolysis of an organosilicon compound. The polishing process includes a surface roughness control step for initially finishing the surface of the glass substrate to a predetermined surface roughness by moving a polishing member and the glass substrate relative to each other under a predetermined pressure. This is followed by a protrusion suppressing step, carried out immediately before the end of the polishing process, under a pressure lower than the predetermined pressure, to minimize polishing rate and suppress occurrence of a fine convex protrusion. A mask blank and then a transfer mask are formed from this polished glass substrate.

    摘要翻译： 在制造掩模用玻璃基板的方法中，通过使用含有磨粒的pH值为7.0〜7.6的研磨液对玻璃基板的表面进行研磨，磨粒包括胶体二氧化硅磨粒 通过有机硅化合物的水解产生。 抛光工艺包括表面粗糙度控制步骤，用于通过在预定压力下相对于彼此移动抛光构件和玻璃基板来最初将玻璃基板的表面完成到预定的表面粗糙度。 接下来是在低于预定压力的压力下在抛光过程结束之前执行的突起抑制步骤，以最小化抛光速率并抑制细凸起突出的发生。 从该抛光的玻璃基板形成掩模坯料，然后形成转印掩模。