METHOD FOR PREPARING AN INORGANIC CRYSTALLINE CERAMIC MATERIAL HAVING AN ORGANIZED STRUCTURE
    3.
    发明申请
    METHOD FOR PREPARING AN INORGANIC CRYSTALLINE CERAMIC MATERIAL HAVING AN ORGANIZED STRUCTURE 审中-公开
    制备无机结构陶瓷材料的方法

    公开(公告)号:US20100304154A1

    公开(公告)日:2010-12-02

    申请号:US12738784

    申请日:2008-10-22

    IPC分类号: C07F7/02 C07F7/10 B32B9/04

    摘要: The present invention provides a method for preparing an inorganic crystalline ceramic material having an organized structure, comprising the steps of: (a) providing nanoparticles of one or more inorganic crystalline ceramic materials; (b) reacting metal hydroxide groups that are present on the nanoparticles with molecules of a chemical compound which molecules each comprisea first and a second reactive moiety, whereby a covalent bond is formed between the first reactive moieties of the molecules and the respective metal hydroxide groups; and (c) subjecting the nanoparticles obtained in step (b) to a treatment which enables the formation of a bond between at least two nanoparticles, whereby the bond is formed directly or indirectly between the second reactive moieties of the covalenty bonded molecules of the chemical compound as obtained in step (b), thereby forming an organized structure.

    摘要翻译: 本发明提供一种制备具有组织结构的无机结晶陶瓷材料的方法,包括以下步骤:(a)提供一种或多种无机结晶陶瓷材料的纳米颗粒; (b)使存在于纳米颗粒上的金属氢氧化物基团与分子各自包含第一和第二反应性部分的化学化合物分子反应,从而在分子的第一反应性部分和相应的金属氢氧化物基团之间形成共价键 ; 和(c)使在步骤(b)中获得的纳米颗粒经受能够在至少两个纳米颗粒之间形成键的处理,由此直接或间接地在化学品的共价键合分子的第二反应性部分之间形成键 化合物,从而形成有组织的结构。

    ACTIVE CARRIER FOR CARRYING A WAFER AND METHOD FOR RELEASE
    10.
    发明申请
    ACTIVE CARRIER FOR CARRYING A WAFER AND METHOD FOR RELEASE 审中-公开
    用于承载波浪的主动载波和释放方法

    公开(公告)号:US20130323907A1

    公开(公告)日:2013-12-05

    申请号:US13876254

    申请日:2011-09-27

    IPC分类号: H01L21/683 H01L21/77

    摘要: In the field of release and pickup of ultrathin semiconductor dies, there is provided an active carrier (1) for carrying a wafer (20) and a method for using such a carrier (1). The wafer (20) comprises a particular die arrangement (P). The active carrier (1) comprises a base plate (2) and a number of energizers (7) constructed on or in this base plate (2). The energizers (7) are laid out in an arrangement corresponding to the die arrangement (P). The energizers (7) can locally energize an adhesive layer (3) in proximity to a selected die (14) from the die arrangement (P). By this local energizing of the adhesive layer (P), the selected die is loosened from the adhesive layer (3). Furthermore the active carrier (1) comprises a plurality of externally addressable contacts (12) and conduction pathways (9). The conduction pathways (9) connect the contacts (12) to the energizers (7) thereby allowing individual control over said energizers (7) by addressing said contacts (12).

    摘要翻译: 在超薄半导体管芯的释放和拾取领域中,提供了用于承载晶片(20)的有源载体(1)和使用这种载体(1)的方法。 晶片(20)包括特定的管芯装置(P)。 活动载体(1)包括基板(2)和在该基板(2)上或底板(2)上构造的多个激发器(7)。 激励器(7)以对应于管芯装置(P)的布置布置。 激发器(7)可以从模具装置(P)局部地激励靠近所选择的模具(14)的粘合剂层(3)。 通过该粘合剂层(P)的局部通电,所选择的模具从粘合剂层(3)松开。 此外,有源载体(1)包括多个可外部寻址的触点(12)和传导路径(9)。 传导路径(9)将触点(12)连接到激励器(7),由此通过寻址所述触点(12)来允许单独控制所述激励器(7)。