摘要:
The invention relates to a process for the metallization of an insulator and/or a dielectric, wherein the insulator is firstly activated, it is subsequently coated with another insulator and the latter is patterned, then the first is seeded and lastly metallized.
摘要:
The present invention provides a process for wiring electrical contact sites, in particular on the surface of an electronic or microelectronic component, with the following steps: applying and patterning at least one dielectric on the component surface; currentlessly depositing a conductor starting layer for producing metal wiring interconnects and substitute contact sites with short-circuit contacts for interconnecting the individual metal wiring interconnects and the corresponding electrical contact sites; reinforcing the conductor starting layer by a common electrodepositing process; and separating the short-circuit contacts for separating the electrical contact sites or the contact sites of the wiring from one another.
摘要:
A scintillator layer is applied onto a photosensor layer to produce an x-ray detector or an x-ray detector element for imaging detection of ionizing radiation. The production process is improved by, in the production of the scintillator layer, an adhesive layer with a protective layer is applied onto the scintillator layer. This can occur layer by layer or a transfer adhesive tape that already includes the protective layer as a protective film can also be used.
摘要:
A dielectric for aluminum and copper metalizations is stable at high temperatures. Surprisingly, in spite of the elimination of water during the cyclization, the polymeric dielectrics are very suitable for filling narrow trenches. The filled trenches exhibit no defects and bubbles or cracks. The polybenzoxazoles have dielectric constants of k≦2.7 and are suitable as an electrical insulator. Furthermore, these materials adhere very well on all surfaces relevant for micro-electronics.
摘要:
Poly-o-hydroxyamides are cyclicized to obtain polybenzoxazoles. The poly-o-hydroxyamides provide effective filling of trenches. In particular, the poly-o-hydroxyamides can fill trenches having a width of less than 100 nm and an aspect ratio of more than 4. Further, the polybenzoxazoles of the invention are very suitable for the damascene process. A dielectric can be made from the polybenzoxazole. In turn, semiconductor devices can include the dieletric. Processes for making the poly-o-hydroxyamides, polybenzoxazoles, and semiconductor devices are included.
摘要:
A scintillator-photosensor sandwich is generated by gluing a first support frame onto an adhesive layer (covered with a protective film on the side facing the adhesive layer, the first frame having a size that (in terms of area) surrounds the scintillator-photosensor sandwich to be produced. The first support frame is placed onto a flat base that supports a first function layer (either a scintillator layer or a photosensor layer). The adhesive layer supported on the first support frame and the first function layer are laminarly assembled. The protective film is removed from the adhesive layer and a second function layer (the other of the scintillator layer or the photosensor layer not used as the first function layer) is assembled with the first function layer with the interposed adhesive layer.
摘要:
In a method to produce a scintillator-photosensor sandwich, as well as a scintillator-photosensor sandwich and a radiation detector with such a scintillator-photosensor sandwich, the scintillator-photosensor sandwich is generated by gluing a first support frame onto an adhesive layer (covered on at least one side with a second protective film on the side facing the adhesive layer, the first frame having a size that (in terms of area) surrounds the scintillator-photosensor sandwich to be produced. The first support frame is placed onto a flat base that supports a first function layer (either a scintillator layer or a photosensor layer). The adhesive layer supported on the first support frame and the first function layer are laminarly assembled. The second protective film is removed from the adhesive layer and a second function layer (the other of the scintillator layer or the photosensor layer not used as the first function layer) is assembled with the first function layer with the interposed adhesive layer.
摘要:
Poly-o-hydroxyamides include binaphthyl substituents as repeating units. The poly-o-hydroxyamides can be cyclized to give the polybenzoxazole by heating. Pore formation occurs, so that a dielectric having a very low dielectric constant k of less than 2.5 is obtained.
摘要:
Poly-o-hydroxyamides include binaphthyl substituents as repeating units. The poly-o-hydroxyamides can be cyclized to give the polybenzoxazole by heating. Pore formation occurs, so that a dielectric having a very low dielectric constant k of less than 2.5 is obtained.
摘要:
Novel poly-o-hydroxyamides can be cyclized to give polybenzoxazoles which have a good diffusion barrier effect with respect to metals. The poly-o-hydroxyamides can be applied to a semiconductor substrate by customary techniques and converted into the polybenzoxazole in a simple manner by heating. This results in a good barrier layer with respect to diffusion of metals. This allows the diffusion barrier between conductor track and dielectric to be substantially dispensed.