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    SURFACE-TREATED COPPER FOIL, METHOD FOR PRODUCING SAME, AND COPPER CLAD LAMINATED BOARD
    1.
    发明申请
    SURFACE-TREATED COPPER FOIL, METHOD FOR PRODUCING SAME, AND COPPER CLAD LAMINATED BOARD 有权
    表面处理铜箔，其生产方法和铜层压板

    公开(公告)号：US20130040162A1

    公开(公告)日：2013-02-14

    申请号：US13574478

    申请日：2011-01-21

    Applicant: Satoshi Fujisawa ,  Takeo Uno ,  Koichi Hattori

    Inventor： Satoshi Fujisawa ,  Takeo Uno ,  Koichi Hattori

    IPC: B32B15/08 ,  B32B37/14 ,  B05D7/14 ,  B05D5/00 ,  B32B15/04 ,  B32B33/00

    CPC classification number: C25D5/34 ,  B32B15/01 ,  B32B15/08 ,  B32B2457/00 ,  C22C19/002 ,  C22C19/03 ,  C25D3/562 ,  C25D5/48 ,  H05K3/384 ,  H05K2201/0154 ,  Y10T156/10 ,  Y10T428/12438 ,  Y10T428/12451 ,  Y10T428/12472 ,  Y10T428/12535 ,  Y10T428/12556 ,  Y10T428/12792 ,  Y10T428/12882 ,  Y10T428/1291

    Abstract: Provided is an industrially excellent surface-treated copper foil which satisfies requirements for adhesiveness to an insulating resin such as polyimide, heat-resistant adhesiveness, chemical resistance and soft etching properties. Also provided is a method for producing a surface-treated copper foil which achieves a high adhesion strength between an insulating resin and the copper foil, shows high chemical resistance in circuit formation and sustains good soft etching properties after forming vias by laser-processing. A base copper foil is subjected to a roughening treatment to give a surface roughness (Rz) of 1.1 μm or below. On the roughened surface, an Ni—Zn alloy layer is formed. The aforesaid roughening treatment is conducted in such a manner that the roughened surface comprises sharp-pointed convexes, which have a width of 0.3-0.8 μm, a height of 0.6-1.8 μm and an aspect ratio of 1.2-3.5, and the surface roughness (Rz) of said base copper foil is increased by 0.05-0.3 μm. The aforesaid Ni—Zn alloy layer has a Zn content of 6-30 wt % and a Zn deposition amount of 0.08 mg/dm2 or more.

    Abstract translation: 提供了一种工业上优异的表面处理铜箔，其满足对聚酰亚胺等绝缘树脂的粘合性，耐热粘合性，耐化学性和软蚀刻性能。 还提供了一种在绝缘树脂和铜箔之间实现高粘合强度的表面处理铜箔的制造方法，在电路形成中表现出高的耐化学性，并且在通过激光加工形成通孔之后保持良好的软蚀刻性能。 对基底铜箔进行粗糙化处理，得到表面粗糙度（Rz）为1.1μm以下。 在粗糙化表面上形成Ni-Zn合金层。 上述粗糙化处理是这样进行的：粗糙表面包括宽度为0.3-0.8μm，高度为0.6-1.8μm，纵横比为1.2-3.5的尖锐凸面，表面粗糙度 所述基底铜箔的（Rz）增加0.05-0.3μm。 上述Ni-Zn合金层的Zn含量为6-30重量％，Zn沉积量为0.08mg / dm 2以上。

    FLEXIBLE CIRCUIT BOARD AND METHOD FOR PRODUCING SAME AND BEND STRUCTURE OF FLEXIBLE CIRCUIT BOARD
    3.
    发明申请
    FLEXIBLE CIRCUIT BOARD AND METHOD FOR PRODUCING SAME AND BEND STRUCTURE OF FLEXIBLE CIRCUIT BOARD 有权
    柔性电路板及其制造方法及柔性电路板的弯曲结构

    公开(公告)号：US20110132643A1

    公开(公告)日：2011-06-09

    申请号：US13001946

    申请日：2009-06-25

    Applicant: Koichi Hattori ,  Naoya Kiwasaki

    Inventor： Koichi Hattori ,  Naoya Kiwasaki

    IPC: H05K1/09 ,  H05K3/00

    CPC classification number: H05K1/028 ,  B21B1/40 ,  B21B2003/005 ,  C22F1/08 ,  H05K1/0393 ,  H05K1/09 ,  H05K2201/0355 ,  H05K2203/0143 ,  Y10T29/49155

    Abstract: Provided are a flexible circuit board with excellent bendability and durability against hard conditions particularly in a repeated bend portion having a small curvature radius, and a method of producing the same. The flexible circuit board includes a resin layer and a wiring formed of a metal foil and is used with a bend portion provided at least one position of the wiring. The metal foil is made of a metal having a cubic crystal structure, and a cross section of the wiring cut in a thickness direction from a ridge line in the bend portion forms a principal orientation on any one of planes within a range of (20 1 0) to (1 20 0) in a rotation direction from (100) to (110) with [001] set as a zone axis. The wiring is formed so that the metal foil is made of a metal having a cubic crystal structure, and that the ridge line in the bend portion has an angle in a range of 2.9° to 87.1° relative to one of fundamental crystal axes in a surface of the metal foil.

    Abstract translation: 提供一种柔性电路板，其具有优异的弯曲性和对硬条件的耐久性，特别是在具有小曲率半径的重复弯曲部分中及其制造方法。 柔性电路板包括树脂层和由金属箔形成的布线，并且与设置有布线的至少一个位置的弯曲部一起使用。 金属箔由具有立方晶体结构的金属制成，并且从弯曲部的棱线在厚度方向上切断的布线的截面在（20l）的范围内的任一平面上形成主取向 （100）〜（110）的旋转方向为（1×20），将[001]设定为区域轴。 布线形成为金属箔由具有立方晶体结构的金属制成，并且弯曲部分中的脊线相对于基本晶轴<100之一具有2.9°至87.1°的范围内的角度 >在金属箔的表面。

    Flexible circuit board and method for producing same and bend structure of flexible circuit board
    4.
    发明授权
    Flexible circuit board and method for producing same and bend structure of flexible circuit board 有权
    柔性电路板及柔性电路板生产方法及弯曲结构

    公开(公告)号：US09060432B2

    公开(公告)日：2015-06-16

    申请号：US13001946

    申请日：2009-06-25

    Applicant: Koichi Hattori ,  Keiichi Kimura ,  Naoya Kuwasaki

    Inventor： Koichi Hattori ,  Keiichi Kimura ,  Naoya Kuwasaki

    IPC: H05K1/09 ,  H05K3/00 ,  H05K1/02 ,  C22F1/08 ,  B21B1/40 ,  B21B3/00 ,  H05K1/03

    CPC classification number: H05K1/028 ,  B21B1/40 ,  B21B2003/005 ,  C22F1/08 ,  H05K1/0393 ,  H05K1/09 ,  H05K2201/0355 ,  H05K2203/0143 ,  Y10T29/49155

    Abstract: Provided are a flexible circuit board with excellent bendability and durability against hard conditions particularly in a repeated bend portion having a small curvature radius, and a method of producing the same. The flexible circuit board includes a resin layer and a wiring formed of a metal foil and is used with a bend portion provided at least one position of the wiring. The metal foil is made of a metal having a cubic crystal structure, and a cross section of the wiring cut in a thickness direction from a ridge line in the bend portion forms a principal orientation on any one of planes within a range of (20 1 0) to (1 20 0) in a rotation direction from (100) to (110) with [001] set as a zone axis. The wiring is formed so that the metal foil is made of a metal having a cubic crystal structure, and that the ridge line in the bend portion has an angle in a range of 2.9° to 87.1° relative to one of fundamental crystal axes in a surface of the metal foil.

    Abstract translation: 提供一种柔性电路板，其具有优异的弯曲性和对硬条件的耐久性，特别是在具有小曲率半径的重复弯曲部分中及其制造方法。 柔性电路板包括树脂层和由金属箔形成的布线，并且与设置有布线的至少一个位置的弯曲部一起使用。 金属箔由具有立方晶体结构的金属制成，并且从弯曲部的棱线在厚度方向上切断的布线的截面在（20l）的范围内的任一平面上形成主取向 （100）〜（110）的旋转方向为（1×20），将[001]设定为区域轴。 布线形成为金属箔由具有立方晶体结构的金属制成，并且弯曲部分中的脊线相对于基本晶轴<100之一具有2.9°至87.1°的范围内的角度 >在金属箔的表面。

    Surface-treated copper foil, method for producing same, and copper clad laminated board
    5.
    发明授权
    Surface-treated copper foil, method for producing same, and copper clad laminated board 有权
    表面处理铜箔，其制造方法和铜包覆层压板

    公开(公告)号：US08852754B2

    公开(公告)日：2014-10-07

    申请号：US13574478

    申请日：2011-01-21

    Applicant: Satoshi Fujisawa ,  Takeo Uno ,  Koichi Hattori

    Inventor： Satoshi Fujisawa ,  Takeo Uno ,  Koichi Hattori

    IPC: B32B15/20 ,  C25D3/56 ,  C22C19/00 ,  B32B15/01 ,  C25D5/48 ,  B32B15/08 ,  C22C19/03 ,  C25D5/34 ,  H05K3/38

    CPC classification number: C25D5/34 ,  B32B15/01 ,  B32B15/08 ,  B32B2457/00 ,  C22C19/002 ,  C22C19/03 ,  C25D3/562 ,  C25D5/48 ,  H05K3/384 ,  H05K2201/0154 ,  Y10T156/10 ,  Y10T428/12438 ,  Y10T428/12451 ,  Y10T428/12472 ,  Y10T428/12535 ,  Y10T428/12556 ,  Y10T428/12792 ,  Y10T428/12882 ,  Y10T428/1291

    Abstract: Provided is an industrially excellent surface-treated copper foil which satisfies requirements for adhesiveness to an insulating resin such as polyimide, heat-resistant adhesiveness, chemical resistance and soft etching properties. Also provided is a method for producing a surface-treated copper foil which achieves a high adhesion strength between an insulating resin and the copper foil, shows high chemical resistance in circuit formation and sustains good soft etching properties after forming vias by laser-processing. A base copper foil is subjected to a roughening treatment to give a surface roughness (Rz) of 1.1 μm or below. On the roughened surface, an Ni—Zn alloy layer is formed. The aforesaid roughening treatment is conducted in such a manner that the roughened surface comprises sharp-pointed convexes, which have a width of 0.3-0.8 μm, a height of 0.6-1.8 μm and an aspect ratio of 1.2-3.5, and the surface roughness (Rz) of said base copper foil is increased by 0.05-0.3 μm. The aforesaid Ni—Zn alloy layer has a Zn content of 6-30 wt % and a Zn deposition amount of 0.08 mg/dm2 or more.

    Abstract translation: 提供了一种工业上优异的表面处理铜箔，其满足对聚酰亚胺等绝缘树脂的粘合性，耐热粘合性，耐化学性和软蚀刻性能。 还提供了一种在绝缘树脂和铜箔之间实现高粘合强度的表面处理铜箔的制造方法，在电路形成中表现出高的耐化学性，并且在通过激光加工形成通孔之后保持良好的软蚀刻性能。 对基底铜箔进行粗糙化处理，得到表面粗糙度（Rz）为1.1μm以下。 在粗糙化表面上形成Ni-Zn合金层。 上述粗糙化处理是这样进行的：粗糙表面包括宽度为0.3-0.8μm，高度为0.6-1.8μm，纵横比为1.2-3.5的尖锐凸面，表面粗糙度 所述基底铜箔的（Rz）增加0.05-0.3μm。 上述Ni-Zn合金层的Zn含量为6-30重量％，Zn沉积量为0.08mg / dm 2以上。

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