CLEANING APPARATUS AND CLEANING METHOD
    7.
    发明申请
    CLEANING APPARATUS AND CLEANING METHOD 审中-公开
    清洁装置和清洁方法

    公开(公告)号:US20120024317A1

    公开(公告)日:2012-02-02

    申请号:US13191739

    申请日:2011-07-27

    IPC分类号: B08B7/04 H01L21/02 B08B3/00

    摘要: According to one embodiment, a cleaning apparatus includes a removing unit whose tip portion is harder than a constituent material of a surface layer on a back surface side of a semiconductor wafer (wafer) and which is configured to clean a back surface of the wafer held by a holding unit and a moving mechanism that relatively moves the removing unit and the wafer in a direction parallel to the wafer back surface. The removing unit grinds and removes a protrusion that is formed of a material same as the surface layer of the wafer back surface, by the moving mechanism relatively moving the removing unit and the wafer and causing the tip portion of the removing unit to come into contact with the protrusion.

    摘要翻译: 根据一个实施例,一种清洁装置包括一个去除单元,其顶端部分比半导体晶片(晶片)的背面侧的表面层的构成材料硬,并且被构造成清洁晶片保持的背面 通过保持单元和移动机构使得移动单元和晶片沿平行于晶片背面的方向相对移动。 移动单元通过使移除单元和晶片相对移动并使去除单元的末端部分接触的移动机构研磨并除去由与晶片背面的表面层相同的材料形成的突起 与突起。