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公开(公告)号：US20140104586A1
公开(公告)日：2014-04-17
申请号：US14132592
申请日：2013-12-18
申请人： Koji KANEYAMA
发明人： Koji KANEYAMA
IPC分类号： G03F7/20
CPC分类号： G03F7/70975 , G03B27/58 , G03F7/70741 , H01L21/67046 , H01L21/67051 , H01L21/67745 , H01L21/68707 , Y10S134/902
摘要： A substrate processing method for a substrate having a photosensitive film on a top surface thereof, includes cleaning a back surface of the substrate after the formation of the photosensitive film and before exposure processing; transporting the substrate to a temperature adjuster such as a cooling unit, while holding the substrate with a first holder; adjusting a temperature of the substrate with the temperature adjuster; transporting the substrate from the temperature adjuster to the exposure device with a second holder; and transporting the substrate after the exposure processing to a first platform while holding the substrate with a third holder.
摘要翻译： 一种用于在其顶表面上具有感光膜的基板的基板处理方法，包括在形成感光膜之后和曝光处理之前清洁基板的背面; 将基板传送到诸如冷却单元的温度调节器，同时用第一保持器保持基板; 用温度调节器调节基板的温度; 将所述基板从所述温度调节器传送到具有第二保持器的所述曝光装置; 以及在曝光处理之后将所述基板传送到第一平台，同时用第三保持器保持所述基板。
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公开(公告)号：US08496761B2
公开(公告)日：2013-07-30
申请号：US12754872
申请日：2010-04-06
申请人： Koji Kaneyama , Akihiro Hisai , Toru Asano , Hiroshi Kobayashi , Tsuyoshi Okumura , Shuichi Yasuda , Masashi Kanaoka , Tadashi Miyagi , Kazuhito Shigemori
发明人： Koji Kaneyama , Akihiro Hisai , Toru Asano , Hiroshi Kobayashi , Tsuyoshi Okumura , Shuichi Yasuda , Masashi Kanaoka , Tadashi Miyagi , Kazuhito Shigemori
CPC分类号： G03F7/70991 , G03F7/70341
摘要： A substrate processing apparatus comprises an indexer block, an anti-reflection film processing block, a resist film processing block, a development processing block, and an interface block. An exposure device is arranged adjacent to an interface block. The interface block comprises a drying processing group including two drying processing units and an interface transport mechanism. After a substrate is subjected to exposure processing by the exposure device, the substrate is transported to the drying processing units in the drying processing group by the interface transport mechanism, where the substrate is subjected to cleaning and drying processings.
摘要翻译： 基板处理装置包括分度器块，抗反射膜处理块，抗蚀剂膜处理块，显影处理块和界面块。 曝光装置被布置成与界面块相邻。 接口块包括干燥处理组，其包括两个干燥处理单元和界面输送机构。 在通过曝光装置对基板进行曝光处理之后，通过界面传送机构将基板输送到干燥处理组中的干燥处理单元，其中对基板进行清洁和干燥处理。
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公开(公告)号：US08034190B2
公开(公告)日：2011-10-11
申请号：US12719788
申请日：2010-03-08
申请人： Shuichi Yasuda , Masashi Kanaoka , Koji Kaneyama , Tadashi Miyagi , Kasuhito Shigemori , Toru Asano , Akihiro Hisai , Hiroshi Kobayashi , Tsuyoshi Okumura
发明人： Shuichi Yasuda , Masashi Kanaoka , Koji Kaneyama , Tadashi Miyagi , Kasuhito Shigemori , Toru Asano , Akihiro Hisai , Hiroshi Kobayashi , Tsuyoshi Okumura
CPC分类号： G03F7/70991 , G03F7/7075 , Y10S438/906 , Y10S438/908
摘要： A substrate processing apparatus comprises an indexer block, an anti-reflection film processing block, a resist film processing block, a development processing block, and an interface block. An exposure device is arranged adjacent to the interface block. The interface block comprises washing processing units and an interface transport mechanism. Before a substrate is subjected to exposure processing by the exposure device, the substrate is transported to a washing processing unit by the interface transport mechanism. The substrate is washed and dried by the washing processing unit.
摘要翻译： 基板处理装置包括分度器块，抗反射膜处理块，抗蚀剂膜处理块，显影处理块和界面块。 曝光装置设置在接口块附近。 接口块包括洗涤处理单元和接口传送机构。 在通过曝光装置对基板进行曝光处理之前，通过界面传送机构将基板输送到洗涤处理单元。 洗涤基体并通过洗涤处理单元干燥。
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公开(公告)号：US20100239986A1
公开(公告)日：2010-09-23
申请号：US12813251
申请日：2010-06-10
CPC分类号： G03F7/70991 , H01L21/67051 , H01L21/67173 , H01L21/67178
摘要： The transporting process from cleaning and drying processing of a substrate in a cleaning/drying processing unit in a cleaning/drying processing group to post-exposure bake (PEB) of the substrate in a thermal processing group for post-exposure bake in a cleaning/drying processing block is described below. First, after the substrate after exposure processing is subjected to the cleaning and drying processing in the cleaning/drying processing group, a sixth central robot takes out the substrate from the cleaning/drying processing group and carries that substrate into the thermal processing group for post-exposure bake in the cleaning/drying processing block.
摘要翻译： 在清洁/干燥处理组中的清洁/干燥处理单元中的基板的清洁和干燥处理到在热处理组中的曝光后烘烤（PEB）的后处理组中的曝光后烘烤处理的传送过程， 干燥处理块如下所述。 首先，在清洗/干燥处理组中对曝光处理后的基板进行清洗干燥处理后，第六中央机器人从清洗/干燥处理组中取出基板，将该基板搬送到热处理组中 - 在清洁/干燥处理块中进行曝光烘烤。
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5.发明授权Substrate drying apparatus, substrate cleaning apparatus and substrate processing system 有权基板干燥装置，基板清洗装置及基板处理系统公开(公告)号：US07766565B2
公开(公告)日：2010-08-03
申请号：US11475598
申请日：2006-06-27
申请人： Koji Kaneyama
发明人： Koji Kaneyama
CPC分类号： H01L21/02057 , H01L21/67034 , H01L21/67051
摘要： A substrate processing system includes a substrate processing apparatus and a cleaning/drying apparatus. The substrate processing apparatus includes an indexer block, an anti-reflection film processing block, a resist film processing block, a development processing block, a resist cover film processing block, a resist cover film removal block and a first interface block. The cleaning/drying apparatus includes a cleaning/drying processing block and a second interface block. An exposure device is arranged adjacent to the second interface block. In the cleaning/drying processing block, cleaning processing is applied to a substrate before exposure processing and drying processing is applied to the substrate after the exposure processing.
摘要翻译： 基板处理系统包括基板处理装置和清洁/干燥装置。 基板处理装置包括分度器块，抗反射膜处理块，抗蚀剂膜处理块，显影处理块，抗蚀剂覆盖膜处理块，抗蚀剂覆盖膜去除块和第一界面块。 清洁/干燥装置包括清洁/干燥处理块和第二接口块。 曝光装置被布置成与第二接口块相邻。 在清洁/干燥处理块中，在曝光处理之前对基板进行清洁处理，并且在曝光处理之后对基板进行干燥处理。
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公开(公告)号：US07726891B2
公开(公告)日：2010-06-01
申请号：US11273439
申请日：2005-11-10
申请人： Koji Kaneyama , Akihiro Hisai , Toru Asano , Hiroshi Kobayashi
发明人： Koji Kaneyama , Akihiro Hisai , Toru Asano , Hiroshi Kobayashi
CPC分类号： G03F7/70991 , Y10S414/135
摘要： A substrate processing apparatus comprises an indexer block, an anti-reflection film processing block, a resist film processing block, a development processing block, a resist cover film processing block, a resist cover film removal block, and an interface block. An exposure device is arranged adjacent to the interface block. A resist film is formed on a substrate in the resist film processing block. A resist cover film is formed on the resist film in the resist cover film processing block before the substrate is subjected to exposure processing by the exposure device.
摘要翻译： 基板处理装置包括分度器块，抗反射膜处理块，抗蚀剂膜处理块，显影处理块，抗蚀剂覆盖膜处理块，抗蚀剂覆盖膜去除块和界面块。 曝光装置设置在接口块附近。 在抗蚀剂膜处理块中的基板上形成抗蚀剂膜。 在通过曝光装置对基板进行曝光处理之前，在抗蚀剂覆盖膜处理块的抗蚀剂膜上形成抗蚀剂覆盖膜。
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7.发明申请Substrate drying apparatus, substrate cleaning apparatus and substrate processing system 有权基板干燥装置，基板清洗装置及基板处理系统公开(公告)号：US20070003278A1
公开(公告)日：2007-01-04
申请号：US11475598
申请日：2006-06-27
申请人： Koji Kaneyama
发明人： Koji Kaneyama
IPC分类号： G03D5/00
CPC分类号： H01L21/02057 , H01L21/67034 , H01L21/67051
摘要： A substrate processing system includes a substrate processing apparatus and a cleaning/drying apparatus. The substrate processing apparatus includes an indexer block, an anti-reflection film processing block, a resist film processing block, a development processing block, a resist cover film processing block, a resist cover film removal block and a first interface block. The cleaning/drying apparatus includes a cleaning/drying processing block and a second interface block. An exposure device is arranged adjacent to the second interface block. In the cleaning/drying processing block, cleaning processing is applied to a substrate before exposure processing and drying processing is applied to the substrate after the exposure processing.
摘要翻译： 基板处理系统包括基板处理装置和清洁/干燥装置。 基板处理装置包括分度器块，抗反射膜处理块，抗蚀剂膜处理块，显影处理块，抗蚀剂覆盖膜处理块，抗蚀剂覆盖膜去除块和第一界面块。 清洁/干燥装置包括清洁/干燥处理块和第二接口块。 曝光装置被布置成与第二接口块相邻。 在清洁/干燥处理块中，在曝光处理之前对基板进行清洁处理，并且在曝光处理之后对基板进行干燥处理。
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公开(公告)号：US20060098978A1
公开(公告)日：2006-05-11
申请号：US11273463
申请日：2005-11-10
申请人： Schuichi Yasuda , Masashi Kanaoka , Koji Kaneyama , Tadashi Miyagi , Kazuhito Shigemori , Toru Asano , Akihiro Hisai , Hiroshi Kobayashi , Tsuyoshi Okumura
发明人： Schuichi Yasuda , Masashi Kanaoka , Koji Kaneyama , Tadashi Miyagi , Kazuhito Shigemori , Toru Asano , Akihiro Hisai , Hiroshi Kobayashi , Tsuyoshi Okumura
IPC分类号： G03D5/00
CPC分类号： G03F7/70991 , G03F7/7075 , Y10S438/906 , Y10S438/908
摘要： A substrate processing apparatus comprises an indexer block, an anti-reflection film processing block, a resist film processing block, a development processing block, and an interface block. An exposure device is arranged adjacent to the interface block. The interface block comprises washing processing units and an interface transport mechanism. Before a substrate is subjected to exposure processing by the exposure device, the substrate is transported to a washing processing unit by the interface transport mechanism. The substrate is washed and dried by the washing processing unit.
摘要翻译： 基板处理装置包括分度器块，抗反射膜处理块，抗蚀剂膜处理块，显影处理块和界面块。 曝光装置设置在接口块附近。 接口块包括洗涤处理单元和接口传送机构。 在通过曝光装置对基板进行曝光处理之前，通过界面传送机构将基板输送到洗涤处理单元。 洗涤基体并通过洗涤处理单元干燥。
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公开(公告)号：US09375748B2
公开(公告)日：2016-06-28
申请号：US13943198
申请日：2013-07-16
CPC分类号： C23C16/56 , B05C11/00 , C23C16/0227 , G03F7/0002 , G03F7/162 , G03F7/20 , G03F7/3021 , G03F7/32 , H01J37/02 , H01L21/0335 , H01L21/0337 , H01L21/0338 , H01L21/67115 , H01L21/67126 , H01L21/6715 , H01L21/67178
摘要： An underlayer is formed to cover the upper surface of a substrate and a guide pattern is formed on the underlayer. A DSA film constituted by two types of polymers is formed in a region on the underlayer where the guide pattern is not formed. Thermal processing is performed while a solvent is supplied to the DSA film on the substrate. Thus, a microphase separation of the DSA film occurs. As a result, patterns made of the one polymer and patterns made of another polymer are formed. Exposure processing and development processing are performed in this order on the DSA film after the microphase separation such that the patterns made of another polymer are removed.
摘要翻译： 形成底层以覆盖基板的上表面，并且在底层上形成引导图案。 在未形成引导图案的底层上的区域中形成由两种类型的聚合物构成的DSA膜。 在向基板上的DSA膜供给溶剂的同时进行热处理。 因此，发生DSA膜的微相分离。 结果，形成由一种聚合物制成的图案和由另一种聚合物制成的图案。 在微相分离之后，在DSA膜上依次进行曝光处理和显影处理，从而除去由另一种聚合物制成的图案。
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公开(公告)号：US08635968B2
公开(公告)日：2014-01-28
申请号：US13019711
申请日：2011-02-02
申请人： Koji Kaneyama
发明人： Koji Kaneyama
CPC分类号： G03F7/70975 , G03B27/58 , G03F7/70741 , H01L21/67046 , H01L21/67051 , H01L21/67745 , H01L21/68707 , Y10S134/902
摘要： A substrate subjected to back surface cleaning by a back surface cleaning processing unit is held by a hand of an interface transport mechanism and transported to a cooling unit. The substrate whose temperature has been adjusted by the cooling unit is held by a hand of the interface transport mechanism and transported to an exposure device. The substrate subjected to exposure processing by the exposure device is held by a hand of the interface transport mechanism and transported from the exposure device to a substrate platform.
摘要翻译： 通过背面清洁处理单元进行后表面清洁的基板由界面输送机构的手保持并被输送到冷却单元。 温度由冷却单元调节的基板由界面输送机构的手保持并被输送到曝光装置。 通过曝光装置进行曝光处理的基板由界面输送机构的手保持并从曝光装置传送到基板平台。
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