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公开(公告)号:US20130065011A1
公开(公告)日:2013-03-14
申请号:US13583820
申请日:2011-03-08
申请人: Hidenori Suzuki , Kouichi Mikurino
发明人: Hidenori Suzuki , Kouichi Mikurino
CPC分类号: H01L23/36 , H01L23/3737 , H01L23/433 , H01L2924/0002 , H01L2924/09701 , Y10T428/31569 , Y10T428/31587 , Y10T428/31598 , Y10T428/31601 , Y10T428/31605 , Y10T428/31612 , Y10T428/31641 , Y10T428/31649 , Y10T428/31663 , Y10T428/31667 , Y10T428/31699 , Y10T428/31707 , Y10T428/31826 , Y10T428/31913 , Y10T428/31935 , H01L2924/00
摘要: A heat insulation/heat dissipation sheet including a pressure-sensitive adhesive layer or a heat-conducting pressure-sensitive adhesive layer, a heat-conducting layer, a pressure-sensitive adhesive layer or a heat-insulating pressure-sensitive adhesive layer, a heat-insulating layer, and a pressure-sensitive adhesive layer or a heat-insulating pressure-sensitive adhesive layer laminated in order between the heat-generating component and the component to be protected, adjacent to the heat-generating component, for connecting the components. Further, an intra-device structure including the heat insulation/heat dissipation sheet with the pressure-sensitive adhesive layer on a heat-conducting layer side thereof adhered to a heat-generating component side and the pressure-sensitive adhesive layer on a heat-insulating layer side thereof adhered to a component to be protected.
摘要翻译: 包括粘合剂层或导热粘合剂层,导热层,压敏粘合剂层或绝热压敏粘合剂层的隔热/散热片,热 绝缘层,以及在发热部件和与发热部件相邻的被保护部件之间依次层叠的用于连接部件的压敏粘合剂层或绝热压敏粘合剂层。 此外,包括其导热层侧的粘合剂层的绝热/散热片与发热部件侧粘合的绝热散热片和在隔热层上的压敏粘合剂层的装置间结构 其一侧粘附到待保护的部件上。