公开(公告)号：US09162247B2

公开(公告)日：2015-10-20

申请号：US13448526

申请日：2012-04-17

申请人： Kousuke Yoshihara ,  Koji Takayanagi ,  Shinichi Hatakeyama ,  Kohei Kawakami

发明人： Kousuke Yoshihara ,  Koji Takayanagi ,  Shinichi Hatakeyama ,  Kohei Kawakami

IPC分类号： B05C11/00 ,  B05C13/02 ,  B05C5/00 ,  B05C11/02 ,  B05D1/00 ,  H01L21/67 ,  G03F7/16 ,  B05D3/12 ,  H01L21/00 ,  H01L51/00

CPC分类号： H01L21/0337 ,  B05C11/023 ,  B05D1/005 ,  G03F7/162 ,  G06F19/00 ,  H01L21/0271 ,  H01L21/6715 ,  H01L51/0003 ,  H01L2224/03418

摘要： A coating treatment apparatus supplying a coating solution to a front surface of a rotated substrate and diffusing the supplied coating solution to an outer periphery side of the substrate to thereby apply the coating solution on the front surface of the substrate includes: a substrate holding part holding a substrate; a rotation part rotating the substrate held on the substrate holding part; a supply part supplying a coating solution to a front surface of the substrate held on the substrate holding part; and an airflow control plate provided at a predetermined position above the substrate held on the substrate holding part for locally changing an airflow above the substrate rotated by the rotation part at an arbitrary position.

摘要翻译： 一种涂布处理装置，其将涂布溶液供给到旋转的基板的前表面，并将供给的涂布溶液扩散到基板的外周侧，从而将涂布液涂布在基板的前表面上，包括：保持基板 底物; 旋转部，旋转保持在所述基板保持部上的所述基板; 供给部，其向保持在所述基板保持部的所述基板的前表面供给涂布液; 以及气流控制板，其设置在保持在所述基板保持部上的所述基板上方的预定位置，用于在任意位置局部地改变由所述旋转部旋转的所述基板上方的气流。

公开(公告)号：US08505479B2

公开(公告)日：2013-08-13

申请号：US12877187

申请日：2010-09-08

申请人： Kousuke Yoshihara ,  Tomohiro Iseki

发明人： Kousuke Yoshihara ,  Tomohiro Iseki

IPC分类号： B05C11/00 ,  B05C11/02

CPC分类号： H01L21/6715 ,  G03F7/162

摘要： A resist coating apparatus supplies a resist solution to substantially the center of a target substrate to be processed while rotating the target substrate at a first rotational speed, then decelerates the rotation of the substrate to a second rotational speed lower than the first rotational speed, or until rotational halt, makes the deceleration smaller in the deceleration step as the rotational speed becomes closer to the second rotational speed or the rotational halt, and accelerates the rotation of the substrate to a third rotational speed higher than the second rotational speed to spin off a residue of the resist solution.

摘要翻译： 抗蚀涂层装置在以第一转速旋转目标基板的同时将抗蚀剂溶液基本上提供到待加工的目标基板的中心，然后使基板的旋转减速到低于第一转速的第二转速，或 直到旋转停止，随着转速变得更接近于第二转速或转动停止，减速步骤中的减速度变小，并且将基板的旋转加速到高于第二转速的第三转速，以使其脱离 抗蚀剂溶液的残留物。

公开(公告)号：US08414972B2

公开(公告)日：2013-04-09

申请号：US12530345

申请日：2008-02-28

申请人： Kousuke Yoshihara ,  Tomohiro Iseki ,  Koji Takayanagi

发明人： Kousuke Yoshihara ,  Tomohiro Iseki ,  Koji Takayanagi

IPC分类号： B05D3/12

CPC分类号： H01L21/02104 ,  B05D1/005 ,  G03F7/162 ,  H01L21/02282 ,  H01L21/6715

摘要： In a coating step, a substrate is rotated at a high speed, and in that state a resist solution is discharged from a first nozzle to a central portion of the substrate to apply the resist solution over the substrate. Subsequently, in a flattening step, the rotation of the substrate is decelerated and the substrate is rotated at a low speed to flatten the resist solution on the substrate. In this event, the discharge of the resist solution by the first nozzle in the coating step is performed until a middle of the flattening step, and when the discharge of the resist solution is finished in the flattening step, the first nozzle is moved to move a discharge position of the resist solution from the central portion of the substrate. According to the present invention, the resist solution can be applied uniformly within the substrate.

摘要翻译： 在涂布步骤中，基板高速旋转，并且在该状态下，将抗蚀剂溶液从第一喷嘴排出到基板的中心部分，以将抗蚀剂溶液涂覆在基板上。 随后，在平坦化步骤中，基板的旋转减速，并且基板以低速旋转以使基板上的抗蚀剂溶液平坦化。 在这种情况下，在涂布步骤中，通过第一喷嘴对抗蚀剂溶液的排出进行到平坦化阶段的中间，并且当在平坦化步骤中完成抗蚀剂溶液的排出时，第一喷嘴移动 抗蚀剂溶液从衬底的中心部分的放电位置。 根据本发明，能够将抗蚀剂溶液均匀地涂布在基板内。

公开(公告)号：US20130068324A1

公开(公告)日：2013-03-21

申请号：US13695844

申请日：2011-03-16

申请人： Toshinobu Furusho ,  Takahiro Ookubo ,  Kousuke Yoshihara ,  Yusuke Yamamoto ,  Steffen Hornig

发明人： Toshinobu Furusho ,  Takahiro Ookubo ,  Kousuke Yoshihara ,  Yusuke Yamamoto ,  Steffen Hornig

IPC分类号： F17D1/00

CPC分类号： B05D1/02 ,  B01D29/56 ,  B01D35/02 ,  B05C9/06 ,  B05C11/10 ,  F17D1/00 ,  H01L21/67017 ,  H01L21/6715 ,  H01L21/67173 ,  H01L21/67178 ,  Y10T137/794

摘要： A chemical supply system comprises: a first container and a second container for storing a chemical solution; a first pump, located on a first pipe connecting the first and second containers, for directing the solution stored in the first container to the second container; and a first filter, located in the first pipe, for filtering the solution flowing through the first pipe from the first container toward the second container. The system further includes: a second pipe for connecting the first container and the second container; and a second pump, located on the second pipe, for directing the solution stored in the second container to the first container.

公开(公告)号：US08333522B2

公开(公告)日：2012-12-18

申请号：US13025490

申请日：2011-02-11

申请人： Hiroshi Arima ,  Kousuke Yoshihara ,  Yuichi Yoshida ,  Yasushi Takiguchi ,  Taro Yamamoto

发明人： Hiroshi Arima ,  Kousuke Yoshihara ,  Yuichi Yoshida ,  Yasushi Takiguchi ,  Taro Yamamoto

IPC分类号： G03D5/00

CPC分类号： G03F7/3021

摘要： There is provided a developing apparatus capable of achieving high throughput. The developing apparatus includes an airtightly sealed processing vessel that forms a processing atmosphere therein; an atmosphere gas supply unit that supplies an atmosphere gas containing mist of a developing solution into the processing vessel in order to form a liquid film of the developing solution on a surface of a substrate loaded into the processing vessel; and a drying unit that dries the substrate in order to stop a developing process by the liquid film. A reaction between a resist and the developing solution can be stopped. Therefore, a developing process can be performed in parallel with a cleaning process performed by a cleaning module and high throughput is achieved.

摘要翻译： 提供了能够实现高产量的显影装置。 显影装置包括在其中形成处理气氛的气密密封处理容器; 气氛气体供给单元，其将含有显影液雾的气氛气体供给到处理容器中，以在装载到处理容器中的基板的表面上形成显影液的液膜; 以及干燥单元，其干燥基板以便通过液膜来停止显影处理。 可以停止抗蚀剂与显影液的反应。 因此，可以与由清洁模块执行的清洁处理并行执行显影处理，并且实现高生产率。

公开(公告)号：US08318247B2

公开(公告)日：2012-11-27

申请号：US12205999

申请日：2008-09-08

申请人： Kousuke Yoshihara ,  Tomohiro Iseki ,  Koji Takayanagi

发明人： Kousuke Yoshihara ,  Tomohiro Iseki ,  Koji Takayanagi

IPC分类号： B05D3/12

CPC分类号： G03F7/162

摘要： The present invention includes: a first step of discharging a coating solution from a nozzle to a center portion of the substrate to apply the coating solution on a surface of the substrate while rotating the substrate; a second step of decelerating, after the first step, the rotation of the substrate and continuously rotating the substrate; and a third step of accelerating, after the second step, the rotation of the substrate to dry the coating solution on the substrate, wherein: the substrate is rotated at a fixed speed of a first speed immediately before the first step; and in the first step, the rotation of the substrate which is at the first speed before start of the first step is gradually accelerated after the start of the first step so as to make the speed continuously change, and the acceleration of the rotation of the substrate is gradually decreased so as to make the speed of the rotation of the substrate converge in a second speed higher than the first speed at end of the first step.

摘要翻译： 本发明包括：第一步骤，将涂布液从喷嘴排出到基板的中心部分，以在旋转基板的同时将涂布溶液施加到基板的表面上; 在第一步骤之后使基板旋转并使基板连续旋转的第二步骤; 以及第三步骤，在所述第二步骤之后加速所述基板的旋转以使所述基板上的所述涂布溶液干燥，其中：所述基板在所述第一步骤之前以一速度的固定速度旋转; 并且在第一步骤中，在第一步骤开始之后以第一速度的基板的旋转在第一步骤开始之后逐渐加速，以使得速度连续变化，并且旋转的加速度 基板逐渐减小，以使得基板的旋转速度在第一步骤结束时以比第一速度高的第二速度会聚。

公开(公告)号：US20120111373A1

公开(公告)日：2012-05-10

申请号：US13288255

申请日：2011-11-03

申请人： Hiroshi ARIMA ,  Yuichi YOSHIDA ,  Kousuke YOSHIHARA

发明人： Hiroshi ARIMA ,  Yuichi YOSHIDA ,  Kousuke YOSHIHARA

IPC分类号： B08B7/00 ,  B08B5/00 ,  B08B3/04

CPC分类号： G03F7/422 ,  H01L21/67051

摘要： A method for cleaning a surface of a substrate having a circuit pattern formed thereon, includes: forming a liquid film on the surface by feeding a cleaning solution onto the center of the surface while rotating the substrate with the substrate kept horizontal; forming a dry region by discharging gas to the center while moving a position of feed of the cleaning solution on the surface by a distance from the center toward the periphery of the substrate with the substrate being rotated; moving the position of feed of the cleaning solution on the surface toward the periphery at a speed equal to a speed at which the dry region is expanded toward the periphery while rotating the substrate; and controlling temperature of the cleaning solution to form the liquid film such that the temperature becomes higher than process atmosphere temperature on the surface during feed of the cleaning solution.

摘要翻译： 一种用于清洗其上形成有电路图案的基板的表面的方法，包括：通过在将基板保持水平的同时旋转基板的同时将清洁溶液馈送到表面的中心而在表面上形成液膜; 通过在基板旋转的同时将清洁溶液的进料位置从基板的中心向外周移动到表面上的方式将气体排出到中心而形成干燥区域; 在旋转基板的同时，以与干燥区域朝向周边膨胀的速度相等的速度将清洁溶液的表面朝向周边移动的位置; 以及控制清洁溶液的温度以形成液膜，使得在清洁溶液的进料期间温度变得高于表面上的处理气氛温度。

公开(公告)号：US20110146572A1

公开(公告)日：2011-06-23

申请号：US13038011

申请日：2011-03-01

申请人： Kousuke YOSHIHARA ,  Tomohiro Iseki

发明人： Kousuke YOSHIHARA ,  Tomohiro Iseki

IPC分类号： B05C9/02 ,  B05C11/00 ,  B05C13/00

CPC分类号： H01L21/6715 ,  G03F7/162

摘要： A resist coating method supplies a resist solution to substantially the center of a target substrate to be processed while rotating the target substrate at a first rotational speed, then reduces a rotational speed of the target substrate to a second rotational speed lower than the first rotational speed, reduces the rotational speed of the target substrate to a third rotational speed lower than the second rotational speed or until rotational halt to adjust the film thickness of the resist solution, and accelerates the rotation of the target substrate to a fourth rotational speed higher than the third rotational speed to spin off a residue of the resist solution.

摘要翻译： 抗蚀剂涂布方法在以第一转速旋转目标基板的同时将抗蚀剂溶液基本上提供到待加工的目标基板的中心，然后将目标基板的转速降低到低于第一转速的第二转速 将目标基板的旋转速度降低到低于第二旋转速度的第三旋转速度，或者直到旋转停止，以调整抗蚀剂溶液的膜厚度，并且将目标基板的旋转加速至高于 第三旋转速度以分离抗蚀剂溶液的残留物。

公开(公告)号：US20110127236A1

公开(公告)日：2011-06-02

申请号：US13024939

申请日：2011-02-10

申请人： Taro YAMAMOTO ,  Kousuke Yoshihara ,  Hideharu Kyouda ,  Hirofumi Takeguchi ,  Atsushi Ookouchi

发明人： Taro YAMAMOTO ,  Kousuke Yoshihara ,  Hideharu Kyouda ,  Hirofumi Takeguchi ,  Atsushi Ookouchi

IPC分类号： C23F1/04

CPC分类号： G03F7/3028 ,  G03F7/3021

摘要： The temperature of a developing solution is varied depending on the type of resist or the resist pattern. The developing solution is applied while scanning a developer nozzle having a slit-shaped ejection port that has a length matching the width of the effective area of the substrate. After leaving the substrate with the developing solution being coated thereon for a predetermined period of time, a diluent is supplied while scanning a diluent nozzle, thereby substantially stopping the development reaction and causing the dissolved resist components to diffuse. A desired amount of resist can be quickly dissolved through the control of the developing solution temperature, while the development can be stopped before the dissolved resist components exhibit adverse effect through the supply of the diluent a predetermined timing, whereby achieving a pattern having a uniform line width and improved throughput.

摘要翻译： 显影液的温度根据抗蚀剂的种类或抗蚀剂图案而变化。 当扫描具有与衬底的有效面积的宽度匹配的长度的狭缝形喷射口的显影剂喷嘴时，施加显影溶液。 在将其上涂覆有显影液的基板离开预定时间后，在扫描稀释剂喷嘴的同时供给稀释剂，从而基本上停止显影反应并使溶解的抗蚀剂组分扩散。 可以通过控制显影液温度来快速溶解所需量的抗蚀剂，同时可以通过在预定时间内提供稀释剂而使溶解的抗蚀剂组分显示出不利影响之前，可以停止显影，从而获得具有均匀线的图案 宽度和提高吞吐量。

公开(公告)号：US07906173B2

公开(公告)日：2011-03-15

申请号：US11549826

申请日：2006-10-16

申请人： Kousuke Yoshihara ,  Tomohiro Iseki

发明人： Kousuke Yoshihara ,  Tomohiro Iseki

IPC分类号： B05D3/12

CPC分类号： H01L21/6715 ,  G03F7/162

摘要： A resist coating method supplies a resist solution to substantially the center of a target substrate to be processed while rotating the target substrate at a first rotational speed, then reduces a rotational speed of the target substrate to a second rotational speed lower than the first rotational speed, reduces the rotational speed of the target substrate to a third rotational speed lower than the second rotational speed or until rotational halt to adjust the film thickness of the resist solution, and accelerates the rotation of the target substrate to a fourth rotational speed higher than the third rotational speed to spin off a residue of the resist solution.

摘要翻译： 抗蚀剂涂布方法在以第一转速旋转目标基板的同时将抗蚀剂溶液基本上提供到待加工的目标基板的中心，然后将目标基板的转速降低到低于第一转速的第二转速 将目标基板的旋转速度降低到低于第二旋转速度的第三旋转速度，或者直到旋转停止，以调整抗蚀剂溶液的膜厚度，并且将目标基板的旋转加速至高于 第三旋转速度以分离抗蚀剂溶液的残留物。