Apparatus and process for producing zinc oxide film
    1.
    发明授权
    Apparatus and process for producing zinc oxide film 失效
    用于生产氧化锌膜的设备和方法

    公开(公告)号:US06733650B2

    公开(公告)日:2004-05-11

    申请号:US09897012

    申请日:2001-07-03

    IPC分类号: C25D706

    CPC分类号: C25D9/08 C25D7/0614 C25D21/18

    摘要: Disclosed are a process for producing a zinc oxide film comprising the steps of transporting a conductive long substrate via above at least one electrode comprised of zinc in an electrodeposition bath held in an electrodeposition tank and applying an electric field between the electrode and the conductive long substrate, thereby forming a zinc oxide film on the conductive long substrate, the process comprising a first step of forming the zinc oxide film on a part of the conductive long substrate; a second step of stopping the application of the electric field and the transportation; and a third step of bringing at least a region of a part of the conductive long substrate being in contact with the electrodeposition bath in the second step into non-contact with the electrodeposition bath, and an apparatus suitably used for the process. The process and apparatus enables high-quality zinc oxide films to be produced.

    摘要翻译: 公开了一种生产氧化锌膜的方法,包括以下步骤:将导电长基材经由上述至少一个由锌组成的电极输送到保持在电沉积槽中的电沉积浴中并在电极和导电长基板之间施加电场 从而在导电性长基板上形成氧化锌膜,该方法包括在导电性长基板的一部分上形成氧化锌膜的第一工序; 停止电场和运输的应用的第二步; 以及第三步骤,使得在第二步骤中的导电长基板的与电沉积浴接触的部分的至少一部分区域与电沉积浴非接触,以及适合用于该方法的设备。 该方法和装置能够生产出高质量的氧化锌膜。

    Process and apparatus for forming zinc oxide film, and process and apparatus for producing photovoltaic device
    2.
    发明授权
    Process and apparatus for forming zinc oxide film, and process and apparatus for producing photovoltaic device 失效
    用于形成氧化锌膜的方法和设备,以及用于生产光伏器件的工艺和设备

    公开(公告)号:US06592739B1

    公开(公告)日:2003-07-15

    申请号:US09722652

    申请日:2000-11-28

    IPC分类号: C25D706

    摘要: Disclosed are an electrodeposition process comprising the steps of transporting a substrate in an electrodeposition bath, and forming a film on the substrate, which process further comprises the step of removing particles from the surface of the substrate; and an electrodeposition apparatus comprising an electrodeposition tank for holding therein an electrodeposition bath, a mechanism for transporting a continuous-length-substrate while holding the substrate thereon, and an opposing electrode, which apparatus further comprises a mechanism for removing particles from the surface of the continuous-length substrate. These can provide a process and an apparatus by and in which dust in the bath or any particles due to film-peeling from electrodes can be prevented from causing difficulties such as impact marks in a film-deposited substrate during its transport, to form a good-quality electrodeposited film.

    摘要翻译: 公开了电沉积方法,其包括以下步骤:在电沉积浴中输送基底,并在基底上形成膜,该方法还包括从基底表面去除颗粒的步骤; 以及电沉积装置,其包括用于保持电沉积浴的电沉积槽,用于在保持基板的同时保持基板的同时输送连续长度基板的机构,以及相对电极,该装置还包括用于从其表面去除颗粒的机构 连续长度衬底。 这些可以提供一种工艺和装置,其中可以防止浴中的灰尘或由于电极的膜剥离引起的任何颗粒在运输过程中在膜沉积基材中引起诸如冲击痕的困难,形成良好的 质量电沉积膜。

    Aqueous solution for the formation of an indium oxide film by electroless deposition
    3.
    发明授权
    Aqueous solution for the formation of an indium oxide film by electroless deposition 失效
    用于通过无电沉积形成氧化铟膜的水溶液

    公开(公告)号:US06464762B1

    公开(公告)日:2002-10-15

    申请号:US09819039

    申请日:2001-03-21

    申请人: Kozo Arao

    发明人: Kozo Arao

    IPC分类号: C25D900

    摘要: A method for forming an indium oxide film on an electrically conductive substrate by immersing the substrate and a counter electrode in an aqueous solution containing at least nitrate and indium ions and flowing an electric current between the substrate and the counter electrode thereby causing indium oxide film formation on the substrate is provided. A substrate for a semiconductor element and a photovoltaic element produced using the film forming method are also provided An aqueous solution for the formation of an indium oxide film by an electroless deposition process, containing at least nitrate and indium ions and tartrate is also disclosed. A film-forming method for the formation of an indium oxide film on a substrate by an electroless deposition process, using the aqueous solution, and a substrate for a semiconductor element and a photovoltaic element produced using the film forming method are further provided.

    摘要翻译: 一种通过将基板和对电极浸入至少含有硝酸盐和铟离子的水溶液中并在基板和对电极之间流动电流从而形成氧化铟膜的方法,用于在导电基板上形成氧化铟膜 在基板上提供。 还提供了一种用于半导体元件的基板和使用该膜形成方法制造的光电元件。还公开了通过无电沉积方法形成氧化铟膜的水溶液,其至少含有硝酸盐和铟离子和酒石酸盐。 还提供了一种通过使用该水溶液的无电沉积工艺在衬底上形成氧化铟膜的薄膜形成方法,以及使用该成膜方法制造的半导体元件用基板和光电元件。

    Electrodeposition method
    10.
    发明授权
    Electrodeposition method 失效
    电沉积法

    公开(公告)号:US06475367B1

    公开(公告)日:2002-11-05

    申请号:US09501522

    申请日:2000-02-09

    IPC分类号: C25D706

    摘要: There is disclosed an electrodeposition method capable of suppressing the drop in the power supply voltage and minimizing the heat loss by the electrodeposition current, thereby achieving uniform film formation with satisfactory characteristics. A conductive substrate is dipped in an electrodeposition bath held in an electrodeposition tank, and an oxide is electrolytically deposited on the conductive substrate. An electricity feed means as at least one electrode of the electrodeposition tank is composed of a conductive member so provided as to be in contact with a back surface of the conductive substrate, wherein the contact position of the electricity feed means and the conductive substrate is outside the electrodeposition bath, and wherein the resistance, including contact resistance, between the closer to the electricity feed means of a position of entry of the conductive substrate into the electrodeposition bath and a position of discharge of the conductive substrate from the electrodeposition bath, and the contact position of the conductive substrate with the electricity feed means is 20&OHgr; or less.

    摘要翻译: 公开了一种能够抑制电源电压降低并且通过电沉积电流最小化热损失的电沉积方法,从而获得具有令人满意的特性的均匀成膜。 将导电性基材浸渍在保持在电沉积槽中的电沉积浴中,氧化物电解沉积在导电性基材上。 一种供电装置,其特征在于,所述电沉积槽的至少一个电极由导电构件构成,所述导电构件设置为与所述导电基板的背面接触,其中所述供电装置和所述导电基板的接触位置在外部 电沉积浴,并且其中在导电基底进入电沉积浴的位置更接近馈电装置之间的电阻(包括接触电阻)和导电基底从电沉积浴放电的位置,以及 导电基板与供电装置的接触位置为20OMEGA以下。