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    Heat sink system and heat sinking method having auto switching function
    1.
    发明授权
    Heat sink system and heat sinking method having auto switching function 失效
    散热系统和散热方式具有自动切换功能

    公开(公告)号：US08705232B2

    公开(公告)日：2014-04-22

    申请号：US13337148

    申请日：2011-12-25

    Applicant: Kuo-Len Lin ,  Mong-Hua Hung ,  Tien-Chih Tseng ,  Chen-Hsiang Lin ,  Chih-Hung Cheng

    Inventor： Kuo-Len Lin ,  Mong-Hua Hung ,  Tien-Chih Tseng ,  Chen-Hsiang Lin ,  Chih-Hung Cheng

    IPC: H05K7/20

    CPC classification number: G06F1/203 ,  G06F1/1632 ,  G06F1/206 ,  Y02D10/16

    Abstract: A heat sink system and a heat sinking method having auto switching function are disclosed. The heat sink receives a control command sent by an external device. An internal heat sink device is controlled according to content of the control command to control power ON or power OFF of a thermoelectric cooler of the heat sink device or to control power ON, power OFF, or change rotation speed setting of a heat sink fan in the heat sink device. Thus, the heat sink auto switches operations of the heat sink device correspondingly according to temperature changes of the external device.

    Abstract translation: 公开了具有自动切换功能的散热器系统和散热方法。 散热器接收外部设备发送的控制命令。 根据控制命令的内容控制内部散热装置，以控制散热装置的热电冷却器的电源接通或断电，或者控制散热风扇的电源接通，断电或改变转速设定 散热器设备。 因此，根据外部设备的温度变化，散热器自动切换散热器设备的操作。

    Fixing assembly for heat-absorbing surfaces of juxtaposed heat pipes and heat sink having the same
    3.
    发明授权
    Fixing assembly for heat-absorbing surfaces of juxtaposed heat pipes and heat sink having the same 失效
    用于并置热管和具有该热管的散热器的吸热表面的固定组件

    公开(公告)号：US08322403B2

    公开(公告)日：2012-12-04

    申请号：US12554864

    申请日：2009-09-04

    Applicant: Kuo-Len Lin ,  Chen-Hsiang Lin ,  Ken Hsu ,  Chih-Hung Cheng

    Inventor： Kuo-Len Lin ,  Chen-Hsiang Lin ,  Ken Hsu ,  Chih-Hung Cheng

    IPC: F28D15/02

    CPC classification number: F28D15/0233 ,  F28D15/0275 ,  F28F2275/20 ,  H01L23/3672 ,  H01L23/427 ,  H01L23/467 ,  H01L2924/0002 ,  H01L2924/00

    Abstract: A heat sink includes a fixing base, a plurality of heat pipes and a fixing body. The bottom surface of the fixing base is provided with a connecting plane and extends upwards to form a fixing arm. The fixing arm is provided with a plurality of first grooves. The fixing body is provided with a plurality of second grooves and combined with the fixing arm. The second grooves correspond to the first grooves for cooperatively receiving and clamping the upper edges of the evaporating sections of the heat pipes. The evaporating section of the heat pipe is provided with a contacting plane and an adhering plane. The contacting planes of the evaporating sections are adjacent to each other and the evaporating sections are fixed to the connecting plane of the fixing base. With this arrangement, the juxtaposed heat pipes can be assembled with the fixing base. Further, the condensing section of the heat pipe penetrates a plurality of fins to form the heat sink.

    Abstract translation: 散热器包括固定基座，多个热管和固定体。 固定底座的底面设有连接平面并向上延伸以形成固定臂。 固定臂设置有多个第一凹槽。 固定体设置有多个第二凹槽并与固定臂组合。 第二凹槽对应于用于协同地接收和夹紧热管的蒸发部分的上边缘的第一凹槽。 热管的蒸发部设有接触面和粘接面。 蒸发部的接触面彼此相邻，蒸发部固定在固定基体的连接面上。 通过这种布置，并置的热管可以与固定基座组装。 此外，热管的冷凝部穿透多个翅片以形成散热器。

    COOLING RACK STRUCTURE OF THERMOELECTRIC COOLING TYPE
    5.
    发明申请
    COOLING RACK STRUCTURE OF THERMOELECTRIC COOLING TYPE 失效
    热电冷却型冷却架结构

    公开(公告)号：US20110203295A1

    公开(公告)日：2011-08-25

    申请号：US12711341

    申请日：2010-02-24

    Applicant: Ken HSU ,  Chih-Hung Cheng ,  Chen-Hiang Lin ,  Kuo-Len Lin

    Inventor： Ken HSU ,  Chih-Hung Cheng ,  Chen-Hiang Lin ,  Kuo-Len Lin

    IPC: F25B21/02 ,  F28F1/10 ,  F28F13/12

    CPC classification number: F25B21/02 ,  F25B25/00 ,  F25B2321/0251 ,  G06F1/1632 ,  G06F1/203

    Abstract: A cooling rack structure includes a cooling plate (1), a temperature conductor (2), a centrifugal fan (3), a cooling body (4) and a thermoelectric cooling component (5). A temperature-super-conducting component (13) is disposed on an inner surface (11) of the cooling plate (1). The temperature conductor (2) is arranged on the temperature-super-conducting component (13). In addition, a heat-exhausting hole (120) is arranged on an upper side of the cooling plate (1). The centrifugal fan (3) is disposed between the temperature conductor (2) and the heat-exhausting hole (120) while the cooling body (4) is disposed between the fan (3) and the heat-exhausting hole (120). A hot side face (501) of the thermoelectric cooling component (5) closely contacts the cooling body (4) while a cold side face (500) is arranged on the temperature-super-conducting component (13). By quickly conducting the low temperature generated from the thermoelectric cooling component (5) onto the cooling plate (1) through the temperature-super-conducting component (13), a low temperature surface can be uniformly provided to obtain a cooling effect.

    Abstract translation: 冷却架结构包括冷却板（1），温度导体（2），离心风扇（3），冷却体（4）和热电冷却组件（5）。 温度超导部件（13）设置在冷却板（1）的内表面（11）上。 温度导体（2）布置在温度超导部件（13）上。 另外，在冷却板（1）的上侧配置有排热孔（120）。 离心风扇（3）设置在温度导体（2）和排热孔（120）之间，同时冷却体（4）设置在风扇（3）和排热孔（120）之间。 热电冷却部件（5）的热侧面（501）与冷却体（4）紧密接触，而冷侧面（500）配置在温度超导部件（13）上。 通过将热电冷却部件（5）产生的低温通过温度超导部件（13）快速地导通到冷却板（1）上，可以均匀地设置低温面以获得冷却效果。

    Heat-Dissipating Device For Supplying Cold Airflow
    6.
    发明申请
    Heat-Dissipating Device For Supplying Cold Airflow 失效
    用于供应冷气流的散热装置

    公开(公告)号：US20110197596A1

    公开(公告)日：2011-08-18

    申请号：US12707755

    申请日：2010-02-18

    Applicant: Chih-Hung Cheng ,  Ken Hsu ,  Chen-Hsiang Lin ,  Kuo-Len Lin

    Inventor： Chih-Hung Cheng ,  Ken Hsu ,  Chen-Hsiang Lin ,  Kuo-Len Lin

    IPC: F25B21/02 ,  F28D15/00

    CPC classification number: H01L23/427 ,  F28D15/00 ,  F28D15/0275 ,  F28F2013/001 ,  H01L23/38 ,  H01L23/467 ,  H01L2924/0002 ,  H01L2924/00

    Abstract: A heat-dissipating device (1) including a casing (10), a thermal insulation plate (20), a thermoelectric cooling chip (30), a heat-dissipating body (40), super heat pipes (52), a cooler (53), a first fan (54) and a second fan (60). The thermal insulation plate (20) divides the interior of the casing (10) into a hot air zone (ZH) and a cold air zone (ZC). The thermoelectric cooling chip (30) is disposed on the thermal insulation plate (20) with its hot-end surface (32) facing the hot air zone (ZH). The heat-dissipating body (40) is disposed in the hot air zone (ZH) to contact the hot-end surface (32). The super heat pipes (52) and the cooler (53) thermally contact a cold-end surface (31) of the thermoelectric cooling chip (30). Thus, the cold generated by the cold-end surface (31) can be rapidly and uniformly conducted to other places to form a cold airflow.

    Abstract translation: 一种散热装置（1），包括壳体（10），绝热板（20），热电冷却芯片（30），散热体（40），超热管（52），冷却器 53），第一风扇（54）和第二风扇（60）。 绝热板（20）将壳体（10）的内部分成热空气区域（ZH）和冷空气区域（ZC）。 热电冷却片（30）的热端面（32）与热空气区域（ZH）相对配置在绝热板（20）上。 散热体（40）设置在热空气区域（ZH）中以与热端面（32）接触。 超热管（52）和冷却器（53）与热电冷却芯片（30）的冷端表面（31）热接触。 因此，由冷端面（31）产生的冷却可以迅速均匀地传导到其它位置，形成冷气流。

    Vapor chamber
    7.
    发明授权
    Vapor chamber 有权
    蒸气室

    公开(公告)号：US07913748B2

    公开(公告)日：2011-03-29

    申请号：US12128127

    申请日：2008-05-28

    Applicant: Kuo-Len Lin ,  Wen-Jung Liu ,  Chen-Hsiang Lin ,  Chih-Hung Cheng ,  Ju-Tsu Huang

    Inventor： Kuo-Len Lin ,  Wen-Jung Liu ,  Chen-Hsiang Lin ,  Chih-Hung Cheng ,  Ju-Tsu Huang

    IPC: F28D15/00

    CPC classification number: F28D15/0233 ,  F28D15/046 ,  F28D2021/0029 ,  H01L23/427 ,  H01L2924/0002 ,  H01L2924/00

    Abstract: A vapor chamber includes a plate and a wick structure. The plate is provided therein with a working fluid, and the plate has a heated end and a condensed end. The wick structure includes a first wick portion adhered to be opposite to the heated end, a second wick portion overlapping on the first wick portion, and a third wick portion adhered on the rest portion of a chamber. The aperture diameter of the first wick portion is larger than that of the second wick portion, or the aperture density of the first wick portion is smaller than that of the second wick portion. The amount of working fluid attached to the second wick portion is smaller than that of the first wick portion. After heating, the working fluid attached to the second wick portion is vaporized more quickly.

    Abstract translation: 蒸气室包括板和芯结构。 板中设置有工作流体，并且板具有加热端和冷凝端。 芯体结构包括粘附到加热端的第一芯部，与第一芯部重叠的第二芯部，以及粘附在室的其余部分上的第三芯部。 第一灯芯部分的孔径大于第二灯芯部分的孔径直径，或者第一灯芯部分的孔径密度小于第二灯芯部分的开口密度。 附着到第二芯部的工作流体的量小于第一芯部的工作流体的量。 加热后，连接到第二芯部的工作流体更快地蒸发。

    Method for connecting heat-dissipating body and heat pipe and structure thereof
    9.
    发明授权
    Method for connecting heat-dissipating body and heat pipe and structure thereof 失效
    用于连接散热体和热管的方法及其结构

    公开(公告)号：US07730617B2

    公开(公告)日：2010-06-08

    申请号：US11563005

    申请日：2006-11-23

    Applicant: Kuo-Len Lin ,  Ken Hsu ,  Chih-Hung Cheng

    Inventor： Kuo-Len Lin ,  Ken Hsu ,  Chih-Hung Cheng

    IPC: B23P6/00

    CPC classification number: F28D15/02 ,  F28F1/20 ,  F28F2215/10 ,  F28F2275/10 ,  H01L23/427 ,  H01L2924/0002 ,  Y10T29/49353 ,  Y10T29/49368 ,  Y10T29/53109 ,  H01L2924/00

    Abstract: A method for connecting a heat-dissipating body and a heat pipe and the structure thereof are used to improve the efficiency of heat conduction. The structure includes a heat-dissipating body and a heat pipe. The central position of the heat-dissipating body is provided with an accommodating trough for accommodating the heat pipe. A plurality of corresponding slots extends outwardly from the periphery of the trough. The other end of the slot is connected to a through hole. Tools are disposed in the slots to widen the slots and thus the periphery of the trough, so that the inner diameter of the trough is larger than the outer diameter of the heat pipe. After the heat pipe penetrates into the trough, the tools are removed, so that the inner wall surface of the trough abuts tightly against the outer circumferential surface of the heat pipe. Thus, the optimal efficiency of heat conduction between the heat pipe and the heat-dissipating body can be achieved.

    Abstract translation: 用于连接散热体和热管的方法及其结构用于提高热传导的效率。 该结构包括散热体和热管。 散热体的中心位置设置有用于容纳热管的容纳槽。 多个相应的槽从槽的周边向外延伸。 槽的另一端连接到通孔。 工具设置在槽中以加宽槽的槽，从而加宽槽的周边，使得槽的内径大于热管的外径。 在热管穿透槽之后，移除工具，使得槽的内壁表面紧紧地抵靠热管的外周表面。 因此，可以实现热管和散热体之间的热传导的最佳效率。

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