Abstract:
A method for fabricating a semiconductor device, including forming gate patterns over a substrate, forming conductive layer covering top and sidewalls of each gate pattern, forming a metal layer for a silicidation process over the conductive layer, and silicifying the conductive layer and the gate patterns using the metal layer.
Abstract:
A method for transmitting control information in a multi-component carrier system comprises: configuring downlink control information containing a format indicator that indicates the number of Orthogonal Frequency Division Multiplexing (OFDM) symbols for a control domain; configuring the control domain in accordance with the number of OFDM symbols; transmitting a physical downlink control channel (PDCCH) containing the thus-configured downlink control information; and transmitting a physical control format indicator channel, containing the format indicator, to the control domain. According to the exemplary embodiments, multiple errors in detecting a PDCCH and a physical downlink shared channel (PDSCH) caused by an error in detecting a physical control format indicator channel (PCFICH) for a sub-component carrier can be easily resolved.
Abstract:
A method for transmitting resource allocation information for an aperiodic transmission of a sounding reference signal (SRS) includes: determining, by a base station (BS), resource to be allocated for a transmission of an aperiodic SRS to a user equipment (UE) to which an aperiodic SRS is to be transmitted; transmitting indication information regarding the determined resource by using extra information of a physical control channel; and receiving an aperiodic SRS transmitted by the UE in the determined resource after the transmission of the physical control channel.
Abstract:
A method for fabricating a semiconductor device includes forming a multilayer, forming a plurality of patterns by etching the multilayer and a portion of the substrate, forming a supporter to support the plurality of patterns, and removing residues formed during the etching.
Abstract:
Method for improving a TFCI transportation performance, including the steps of (1) coding TFCI information bits to be transported through each radio frame, (2) repeating a TFCI code word produced by the coding for an arbitrary times, (3) applying puncturing patterns different from each other to the repeated code words produced as many as the repeated times, and puncturing the repeated code words at locations different from each other, and (4) dividing, inserting, and transporting the punctured fixed length repeated code words in each slot of the radio frame, whereby improving TFCI information transportation performance, and embodying the receiver side decoder to be identical to a case when a 32 bit code word are transported perfectly.
Abstract:
A method and system for transmitting/receiving data in a heterogeneous communication system. A terminal accesses a first controller of a first communication system supporting a first communication service to make a communication path to the first communication system. After making the communication path to the terminal, the first controller determines whether it is possible to provide the first communication service to the terminal over the first communication system. If it is not possible, the first controller transmits to an interworking unit a first request indicating that the terminal requires the first communication service over the second communication system. The interworking unit transmits a second request to a second controller of the second communication system in response to the first request, the second request indicating that the second controller provides the first communication service to the terminal. Upon receiving a response to the second request, the interworking unit controls the first controller to provide the first communication service to the terminal over the second communication system according to the response.
Abstract:
A nonvolatile memory device includes a pipe insulation layer having a pipe channel hole, a pipe gate disposed over the pipe insulation layer, a pair of cell strings each having a columnar cell channel, and a pipe channel coupling the columnar cell channels and surrounding inner sidewalls and a bottom of the pipe channel hole.
Abstract:
A dielectric structure in a nonvolatile memory device and a method for fabricating the same are provided. The dielectric structure includes: a first oxide layer; a first high-k dielectric film formed on the first oxide layer, wherein the first high-k dielectric film includes one selected from materials with a dielectric constant of approximately 9 or higher and a compound of at least two of the materials; and a second oxide layer formed on the first high-k dielectric film.
Abstract:
A method for fabricating a vertical channel type nonvolatile memory device includes: stacking a plurality of interlayer insulating layers and a plurality of gate electrode conductive layers alternately over a substrate; etching the interlayer insulating layers and the gate electrode conductive layers to form a channel trench exposing the substrate; forming an undoped first channel layer over the resulting structure including the channel trench; doping the first channel layer with impurities through a plasma doping process; and filling the channel trench with a second channel layer.
Abstract:
Provided is a method for forming a dielectric film in a semiconductor device, wherein the method can improve a dielectric characteristic and a leakage current characteristic. According to specific embodiments of the present invention, the method for forming a dielectric film includes: forming a zirconium dioxide (ZrO2) layer over a wafer in a predetermined thickness that does not allow continuous formation of the ZrO2 layer; and forming an aluminum oxide (Al2O3) layer over portions of the wafer where the ZrO2 layer is not formed, in a predetermined thickness that does not allow continuous formation of the Al2O3 layer.
Abstract translation:提供一种在半导体器件中形成电介质膜的方法,其中该方法可以改善介电特性和漏电流特性。 根据本发明的具体实施方案,形成电介质膜的方法包括:在不允许连续形成ZrO 2层的预定厚度的晶片上形成二氧化锆(ZrO 2)层; 并且在没有形成ZrO 2层的晶片的部分上形成氧化铝(Al 2 O 3)层,其厚度不能连续地形成Al 2 O 3层。