公开(公告)号：US20150103974A1

公开(公告)日：2015-04-16

申请号：US14455858

申请日：2014-08-08

申请人： SANG-YOUNG KIM ,  KYUNG-SOO RHO ,  HO-JEONG MOON ,  HYUCK SHIN ,  SUN-NYEONG JUNG

发明人： SANG-YOUNG KIM ,  KYUNG-SOO RHO ,  HO-JEONG MOON ,  HYUCK SHIN ,  SUN-NYEONG JUNG

IPC分类号： G21K1/10 ,  G01N23/04

CPC分类号： H01L22/12 ,  G01N23/04 ,  G21K1/10 ,  H01L23/3114 ,  H01L24/48 ,  H01L25/0657 ,  H01L2224/48153

摘要： An X-ray source is disposed and a detector is disposed adjacent to the X-ray source. A test specimen holder is disposed between the X-ray source and the detector. A filter is disposed between the X-ray source and the test specimen holder. The filter has a plate-shaped semiconductor, a granular semiconductor, or a combination thereof.

摘要翻译： 设置X射线源，并且将检测器设置为与X射线源相邻。 试样夹持器设置在X射线源和检测器之间。 过滤器设置在X射线源和测试样本架之间。 滤光器具有板状半导体，粒状半导体或其组合。

公开(公告)号：US20050260795A1

公开(公告)日：2005-11-24

申请号：US10973385

申请日：2004-10-27

申请人： Sang-Bae Park ,  Yong-Gill Lee ,  Hyung-Jun Park ,  Kyung-Soo Rho ,  Jin-Hee Won

发明人： Sang-Bae Park ,  Yong-Gill Lee ,  Hyung-Jun Park ,  Kyung-Soo Rho ,  Jin-Hee Won

IPC分类号： H01L21/58 ,  H01L23/31 ,  H01L23/495

CPC分类号： H01L24/97 ,  H01L23/3107 ,  H01L23/49503 ,  H01L23/49568 ,  H01L23/49582 ,  H01L24/15 ,  H01L24/48 ,  H01L2224/0401 ,  H01L2224/05599 ,  H01L2224/05639 ,  H01L2224/05644 ,  H01L2224/05655 ,  H01L2224/13099 ,  H01L2224/16245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2224/484 ,  H01L2224/85399 ,  H01L2224/85439 ,  H01L2224/85444 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01023 ,  H01L2924/01028 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/181 ,  H01L2924/18301 ,  H01L2924/351 ,  H01L2224/45099 ,  H01L2924/00 ,  H01L2924/00012

摘要： A method for fabricating leadless packages with mold locking characteristics is disclosed. A provided leadless leadframe has a plurality of units in a matrix, each unit includes an improved die pad with a plurality of indentations, such as semi-vias in the sidewall thereof and a plurality of leads around the die pad. After chip attachment and electrical connection, a plurality of package bodies for semiconductor packages are individually formed on the corresponding units and covered the indentations in order to enhance the horizontal mold locking capability of the die pad. Using punching, connecting bars of the leadless leadframe are removed to isolate the leadless packages.

摘要翻译： 公开了一种用于制造具有锁模特性的无引线封装的方法。 提供的无引线框架具有矩阵中的多个单元，每个单元包括具有多个凹口的改进的管芯焊盘，例如其侧壁中的半通孔和围绕管芯焊盘的多个引线。 在芯片附接和电连接之后，用于半导体封装的多个封装主体分别形成在相应的单元上并覆盖压痕，以便提高芯片焊盘的水平模具锁定能力。 使用无引线框架的冲孔，连接条来拆除无引线封装。

公开(公告)号：US09728293B2

公开(公告)日：2017-08-08

申请号：US14455858

申请日：2014-08-08

申请人： Sang-Young Kim ,  Kyung-Soo Rho ,  Ho-Jeong Moon ,  Hyuck Shin ,  Sun-Nyeong Jung

发明人： Sang-Young Kim ,  Kyung-Soo Rho ,  Ho-Jeong Moon ,  Hyuck Shin ,  Sun-Nyeong Jung

IPC分类号： G01N23/02 ,  G21K1/10 ,  G01N23/04 ,  H01L21/66

CPC分类号： H01L22/12 ,  G01N23/04 ,  G21K1/10 ,  H01L23/3114 ,  H01L24/48 ,  H01L25/0657 ,  H01L2224/48153

摘要： An X-ray source is disposed and a detector is disposed adjacent to the X-ray source. A test specimen holder is disposed between the X-ray source and the detector. A filter is disposed between the X-ray source and the test specimen holder. The filter has a plate-shaped semiconductor, a granular semiconductor, or a combination thereof.

公开(公告)号：US07211467B2

公开(公告)日：2007-05-01

申请号：US10973385

申请日：2004-10-27

申请人： Sang-Bae Park ,  Yong-Gill Lee ,  Hyung-Jun Park ,  Kyung-Soo Rho ,  Jin-Hee Won

发明人： Sang-Bae Park ,  Yong-Gill Lee ,  Hyung-Jun Park ,  Kyung-Soo Rho ,  Jin-Hee Won

IPC分类号： H01L21/00

CPC分类号： H01L24/97 ,  H01L23/3107 ,  H01L23/49503 ,  H01L23/49568 ,  H01L23/49582 ,  H01L24/15 ,  H01L24/48 ,  H01L2224/0401 ,  H01L2224/05599 ,  H01L2224/05639 ,  H01L2224/05644 ,  H01L2224/05655 ,  H01L2224/13099 ,  H01L2224/16245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2224/484 ,  H01L2224/85399 ,  H01L2224/85439 ,  H01L2224/85444 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01023 ,  H01L2924/01028 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/181 ,  H01L2924/18301 ,  H01L2924/351 ,  H01L2224/45099 ,  H01L2924/00 ,  H01L2924/00012

摘要： A method for fabricating leadless packages with mold locking characteristics is disclosed. A provided leadless leadframe has a plurality of units in a matrix, each unit includes an improved die pad with a plurality of indentations, such as semi-vias in the sidewall thereof and a plurality of leads around the die pad. After chip attachment and electrical connection, a plurality of package bodies for semiconductor packages are individually formed on the corresponding units and covered the indentations in order to enhance the horizontal mold locking capability of the die pad. Using punching, connecting bars of the leadless leadframe are removed to isolate the leadless packages.

摘要翻译： 公开了一种用于制造具有锁模特性的无引线封装的方法。 提供的无引线框架具有矩阵中的多个单元，每个单元包括具有多个凹口的改进的管芯焊盘，例如其侧壁中的半通孔和围绕管芯焊盘的多个引线。 在芯片附接和电连接之后，用于半导体封装的多个封装主体分别形成在相应的单元上并覆盖压痕，以便提高芯片焊盘的水平模具锁定能力。 使用无引线框架的冲孔，连接条来拆除无引线封装。

公开(公告)号：US06984878B2

公开(公告)日：2006-01-10

申请号：US10851112

申请日：2004-05-24

申请人： Sang-Bae Park ,  Yong-Gill Lee ,  Hyung-Jun Park ,  Kyung-Soo Rho ,  Jin-Hee Won

发明人： Sang-Bae Park ,  Yong-Gill Lee ,  Hyung-Jun Park ,  Kyung-Soo Rho ,  Jin-Hee Won

IPC分类号： H01L23/495

CPC分类号： H01L24/97 ,  H01L23/3107 ,  H01L23/49503 ,  H01L23/49568 ,  H01L23/49582 ,  H01L24/15 ,  H01L24/48 ,  H01L2224/0401 ,  H01L2224/05599 ,  H01L2224/05639 ,  H01L2224/05644 ,  H01L2224/05655 ,  H01L2224/13099 ,  H01L2224/16245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2224/484 ,  H01L2224/85399 ,  H01L2224/85439 ,  H01L2224/85444 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01023 ,  H01L2924/01028 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/181 ,  H01L2924/18301 ,  H01L2924/351 ,  H01L2224/45099 ,  H01L2924/00 ,  H01L2924/00012

摘要： A leadless leadframe with an improved die pad for mold locking includes a die pad and a plurality of leads. The leads are arranged around the die pad. A plurality of indentations, such as side semi-vias, are formed on the sidewall of the die pad for filling a package body of the semiconductor package so as to enhance the horizontal mold locking capability of the die pad.

摘要翻译： 具有用于模具锁定的改进的芯片焊盘的无引线框架包括芯片焊盘和多个引线。 引线布置在管芯焊盘的周围。 在管芯焊盘的侧壁上形成多个凹口，例如侧半通孔，用于填充半导体封装的封装体，以增强管芯焊盘的水平模具锁定能力。

公开(公告)号：US20050258521A1

公开(公告)日：2005-11-24

申请号：US10851112

申请日：2004-05-24

申请人： Sang-Bae Park ,  Yong-Gill Lee ,  Hyung-Jun Park ,  Kyung-Soo Rho ,  Jin-Hee Won

发明人： Sang-Bae Park ,  Yong-Gill Lee ,  Hyung-Jun Park ,  Kyung-Soo Rho ,  Jin-Hee Won

IPC分类号： H01L21/58 ,  H01L23/31 ,  H01L23/495

CPC分类号： H01L24/97 ,  H01L23/3107 ,  H01L23/49503 ,  H01L23/49568 ,  H01L23/49582 ,  H01L24/15 ,  H01L24/48 ,  H01L2224/0401 ,  H01L2224/05599 ,  H01L2224/05639 ,  H01L2224/05644 ,  H01L2224/05655 ,  H01L2224/13099 ,  H01L2224/16245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2224/484 ,  H01L2224/85399 ,  H01L2224/85439 ,  H01L2224/85444 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01023 ,  H01L2924/01028 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/181 ,  H01L2924/18301 ,  H01L2924/351 ,  H01L2224/45099 ,  H01L2924/00 ,  H01L2924/00012

摘要： A leadless leadframe with an improved die pad for mold locking includes a die pad and a plurality of leads. The leads are arranged around the die pad. A plurality of indentations, such as side semi-vias, are formed on the sidewall of the die pad for filling a package body of the semiconductor package so as to enhance the horizontal mold locking capability of the die pad.

摘要翻译： 具有用于模具锁定的改进的芯片焊盘的无引线框架包括芯片焊盘和多个引线。 引线布置在管芯焊盘的周围。 在管芯焊盘的侧壁上形成多个凹口，例如侧半通孔，用于填充半导体封装的封装体，以增强管芯焊盘的水平模具锁定能力。