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公开(公告)号:US07816248B2
公开(公告)日:2010-10-19
申请号:US12138482
申请日:2008-06-13
IPC分类号: H01L21/44
CPC分类号: H01L24/10 , H01L24/13 , H01L2224/05001 , H01L2224/05009 , H01L2224/05022 , H01L2224/05026 , H01L2224/05027 , H01L2224/05085 , H01L2224/05147 , H01L2224/05166 , H01L2224/05171 , H01L2224/05572 , H01L2224/05624 , H01L2224/05647 , H01L2224/05655 , H01L2224/05666 , H01L2224/05671 , H01L2224/05684 , H01L2224/13 , H01L2224/13099 , H01L2924/01006 , H01L2924/01013 , H01L2924/01018 , H01L2924/01019 , H01L2924/01022 , H01L2924/01024 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01073 , H01L2924/01074 , H01L2924/01078 , H01L2924/01082 , H01L2924/014 , H01L2924/04941 , H01L2924/04953 , H01L2924/00 , H01L2924/00014 , H01L2924/013
摘要: Disclosed are embodiments of a far back end of the line solder connector and a method of forming the connector that eliminates the use aluminum, protects the integrity of the ball limiting metallurgy (BLM) layers and promotes adhesion of the BLM layers by incorporating a thin conformal conductive liner into the solder connector structure. This conductive liner coats the top of the via filling in any divots in order to create a uniform surface for BLM deposition and to, thereby, protect the integrity of the BLM layers. The liner further coats the dielectric sidewalls of the well in which the BLM layers are formed in order to enhance adhesion of the BLM layers to the well.
摘要翻译: 公开了线焊料连接器的远端的实施例以及形成连接器的方法,其消除了使用铝,保护了球限制冶金(BLM)层的完整性,并且通过并入薄的保形膜来促进BLM层的粘附 导电衬里进入焊接接头结构。 该导电衬里以通孔填充物的顶部涂覆任何刻痕,以便产生用于BLM沉积的均匀表面,从而保护BLM层的完整性。 衬垫还涂覆在其中形成BLM层的阱的电介质侧壁,以便增强BLM层与阱的粘合性。