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公开(公告)号:US4969979A
公开(公告)日:1990-11-13
申请号:US348844
申请日:1989-05-08
申请人: Bernd K. Appelt , Perminder Bindra , Robert D. Edwards , James R. Loomis , Jae M. Park , Jonathan D. Reid , Lisa J. Smith , James R. White
发明人: Bernd K. Appelt , Perminder Bindra , Robert D. Edwards , James R. Loomis , Jae M. Park , Jonathan D. Reid , Lisa J. Smith , James R. White
CPC分类号: C25D5/56 , H05K3/424 , H05K2203/0716 , H05K2203/122 , H05K3/427
摘要: Substantially nonconductive or semiconductive surfaces of through holes can be electroplated directly, without an intervening non-electrolytic metallization, by a stepwise process which includes the application to the through holes of a polyelectrolyte surfactant in solution in combination with the application of a conductive metal containing material.